KR910021189A - 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판 - Google Patents

전기회로 또는 전자회로의 성형에 사용되는 세라믹기판 Download PDF

Info

Publication number
KR910021189A
KR910021189A KR1019910007202A KR910007202A KR910021189A KR 910021189 A KR910021189 A KR 910021189A KR 1019910007202 A KR1019910007202 A KR 1019910007202A KR 910007202 A KR910007202 A KR 910007202A KR 910021189 A KR910021189 A KR 910021189A
Authority
KR
South Korea
Prior art keywords
ceramic
plate
aluminum
base layer
substrates used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019910007202A
Other languages
English (en)
Other versions
KR0173783B1 (ko
Inventor
히데아키 요시다
마코도 도리우미
히로가즈 다나카
마사오 우메자와
미찌오 유자와
요시로오 구로미쓰
Original Assignee
후지무라 마사야
미쓰비시 마테리알 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11616290A external-priority patent/JP2689685B2/ja
Priority claimed from JP12175490A external-priority patent/JP2689687B2/ja
Priority claimed from JP22198890A external-priority patent/JP2679375B2/ja
Application filed by 후지무라 마사야, 미쓰비시 마테리알 가부시기가이샤 filed Critical 후지무라 마사야
Publication of KR910021189A publication Critical patent/KR910021189A/ko
Application granted granted Critical
Publication of KR0173783B1 publication Critical patent/KR0173783B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6588—Water vapor containing atmospheres
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/062—Oxidic interlayers based on silica or silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/064—Oxidic interlayers based on alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/123—Metallic interlayers based on iron group metals, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음

Description

전기회로 또는 전자회로의 성형에 사용되는 세라믹기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 의한 세라믹기판의 구조를 나타내는 도면.

Claims (7)

  1. a) 세라믹기층(31/31a, 41/43a/43b, 51/52a/52b, 51/56/52a/52b)과, b) 전기한 세라믹기층의 한쪽면에 결합되어서 그것에 접속되는 적어도 하나의 회로부품(35/35b)을 위한 도전로를 구비하고 있는 도전성아일렌드(32/32a, 42a/44a, 53a/55a)로 구성되며, 전기한 도전성아일랜드는 알루미늄-실리콘합금, 알루미늄-게르마늄합금, 알루미늄-실리콘-마그네슘합금, 및 알루미늄-실리콘-게르마늄합금으로 이루어진 군(群)에서 선택되는 접합합금으로 전기한 세라믹기층의 한쪽면에 접합되는 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
  2. 제1항에 있어서, 전기한 세라믹기층은 약 0.2∼20㎛범위의 산화알루미늄박층(31a)으로 피복된 질화알루미늄으로 주로 이루어진 세라믹판(31)에 의해 실현되는 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
  3. 제2항에 있어서, 전기한 질화알루미늄은 산화아트륨과 산화칼슘으로 이루어진 군에서 선택되는 적어도 한 종류의 소결보조제를 함유하며, 전기한 소결보조제는 0.1∼10중량%의 범위인 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
  4. 제1항에 있어서, 전기한 세라믹기층은 주로 탄화규소로 이루어진 세라믹판(41)에 의해 실현되는 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
  5. 제1항에 있어서, 전기한 세라믹기층은 주로 질화알루미늄으로 이루어진 제1판(51)과, 주로 탄화규소로 이루어진 제2판(5a)의 조합에 의해 실현되는 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
  6. 제5항에 있어서, 전기한 제1판(51)은 전기한 제2판이 부착되는 제1산화조면(粗面)(56)을 보유하는 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
  7. 제6항에 있어서, 전기한 세라믹기판은 주로 탄화규소로 이루어져서 전기한 제1산화조면의 반대쪽의 제2산화조면에 부착되는 제3판(52b)과, 전기한 접합합금으로 전기한 제3판에 접합되는 다른 금속아일랜드(53b)가 더 구성되어 있는 것을 특징으로 하는 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910007202A 1990-05-02 1991-05-02 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판 Expired - Lifetime KR0173783B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP???2-?116162? 1990-05-02
JP11616290A JP2689685B2 (ja) 1990-05-02 1990-05-02 半導体装置用軽量基板
JP2-116162 1990-05-02
JP2-121754 1990-05-11
JP???2-?121754? 1990-05-11
JP12175490A JP2689687B2 (ja) 1990-05-11 1990-05-11 Ｉｃ実装用基板
JP2-221988 1990-08-23
JP22198890A JP2679375B2 (ja) 1990-08-23 1990-08-23 Ｉｃ実装用基板
JP???2-?221988? 1990-08-23

Publications (2)

Publication Number Publication Date
KR910021189A true KR910021189A (ko) 1991-12-20
KR0173783B1 KR0173783B1 (ko) 1999-05-01

Family

ID=27313102

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910007202A Expired - Lifetime KR0173783B1 (ko) 1990-05-02 1991-05-02 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판

Country Status (3)

Country Link
EP (1) EP0455229B1 (ko)
KR (1) KR0173783B1 (ko)
DE (1) DE69127927T2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0693776B1 (en) * 1994-07-15 2000-05-31 Mitsubishi Materials Corporation Highly heat-radiating ceramic package
JP3866320B2 (ja) * 1995-02-09 2007-01-10 日本碍子株式会社 接合体、および接合体の製造方法
FR2763204A1 (fr) * 1997-05-12 1998-11-13 Ferraz Echangeur de chaleur pour composants electroniques et appareillages electrotechniques
AT408345B (de) 1999-11-17 2001-10-25 Electrovac Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper
EP1498946B1 (en) 2002-04-19 2012-04-04 Mitsubishi Materials Corporation Circuit board, process for producing the same and power module
WO2008004851A1 (en) * 2006-07-06 2008-01-10 Globetronics Industries Sdn Bhd (17765-H) A hybrid substrate and method of manufacturing the same
CN119725233B (zh) * 2025-02-27 2025-06-20 山东大学 一种基于双面覆铝的碳化硅绝缘基板及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3376829D1 (en) * 1982-06-29 1988-07-07 Toshiba Kk Method for directly bonding ceramic and metal members and laminated body of the same
JPH0653253B2 (ja) * 1986-11-08 1994-07-20 松下電工株式会社 セラミツク基板の粗化法
KR0173782B1 (ko) * 1989-10-09 1999-02-01 나가노 다께시 전기 또는 전자회로의 성형에 사용되는 세라믹기판

Also Published As

Publication number Publication date
DE69127927D1 (de) 1997-11-20
KR0173783B1 (ko) 1999-05-01
EP0455229A2 (en) 1991-11-06
EP0455229B1 (en) 1997-10-15
DE69127927T2 (de) 1998-06-04
EP0455229A3 (en) 1991-12-18

Similar Documents

Publication Publication Date Title
EP0681322A3 (en) Bonded ceramic metal composite substrates and circuit boards constructed therewith
KR870011690A (ko) 혼성 집적회로장치
KR890007386A (ko) 반도체 장치 및 그 제조방법
ATE122651T1 (de) Heisspressen dichter keramischer flachkörper als ein- und mehrschichtsubstrate für elektronische bauelemente.
ATE99828T1 (de) Elektrischer widerstand in chip-bauweise fuer oberflaechenbestueckung und verfahren zu seiner herstellung.
US4313262A (en) Molybdenum substrate thick film circuit
EP1720392A3 (en) Multilayered printed wiring board and its manufacture
JPH06173081A (ja) 電子部品
KR970067544A (ko) 질화 규소 회로 기판 및 그 제조 방법
KR960026410A (ko) 집적회로 및 그의 제조방법
KR910021189A (ko) 전기회로 또는 전자회로의 성형에 사용되는 세라믹기판
EP1345264A4 (en) CERAMIC CONDUCTOR PLATE OF THE INTEGRAL TYPE AND METHOD FOR THE PRODUCTION THEREOF
EP0255911A3 (en) Metal-dielectric-metal layer structure with low resistance via connections
KR880002417A (ko) 질화 알루미늄(ain)회로 기판
KR880002423A (ko) 회로기판
EP1282164A3 (en) Method to improve the adhesion of dielectric layers to copper
US4936010A (en) Method of forming dielectric layer on a metal substrate having improved adhesion
JPS60171792A (ja) 金属ベ−ス多層回路基板
EP0964446A3 (en) An electronic circuit assembly
JP2697343B2 (ja) 半導体装置及びその製造方法
US5164547A (en) Articles having a dielectric layer on a metal substrate having improved adhesion
JPH03237795A (ja) 厚膜印刷配線基板
JPS6317263Y2 (ko)
JPH05110219A (ja) 印刷配線基板
JPH0221688A (ja) 導体形成プラスチック樹脂基板

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19910502

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19941227

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19910502

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980330

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19980831

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19981102

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19981102

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20011102

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20021021

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20031030

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20041029

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20051028

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20061031

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20071026

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20081027

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20091028

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20101026

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20101026

Start annual number: 13

End annual number: 13

EXPY Expiration of term
PC1801 Expiration of term

Termination date: 20121009

Termination category: Expiration of duration