KR920700785A - 하도층상에 감광성 내식막 조성물을 피복하는 방법 - Google Patents
하도층상에 감광성 내식막 조성물을 피복하는 방법Info
- Publication number
- KR920700785A KR920700785A KR1019910701249A KR910701249A KR920700785A KR 920700785 A KR920700785 A KR 920700785A KR 1019910701249 A KR1019910701249 A KR 1019910701249A KR 910701249 A KR910701249 A KR 910701249A KR 920700785 A KR920700785 A KR 920700785A
- Authority
- KR
- South Korea
- Prior art keywords
- photoresist
- photoresist composition
- undercoat
- liquid
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (18)
- (a) 용매 중 감광성 내식막 고형분을 포함하는 액체 감광성 내식마 조성물(여기에서, 감광성 내식막 조성물 중 고형분 함량은 약 10내지 약22중량%이다)을 형성시키고; (b) 상기 액체 감광성 내식막 조성물의 미세분무소적을 형성시킨 다음; (c) 하도층 표면상에 상기 미세 분무 소적을 중력으로서 고정시켜, 하도체상에 감광성 내식막 피복물을 형성시키고; (d)상기 피복된 하도층을 예정된 회전속도 및 예정된 시간동안 회전시켜 감광성 내식막 피복물 중의 거의 모든 용매를 제거하고 하도층상에 일정한 두께의 감광성 내식막 고형분 필름을 형성시키는 단계를 특징으로 하여, 하도층상에 일정한 두께의 감광성 내식막 고형분 필름을 적용시키는 방법.
- 제1항에 있어서, 미세 감광성 내식막 분무 소적을 단계(b)에서 초음파 분무 노즐을 사용하여 형성시킴을 특징으로 하는 방법.
- 제2항에 있어서, 액체 감광성 내식막 조성물을 초음파 분무노즐에 중력으로 공급하는 방법.
- 제3항에 있어서, 액체 감광성 내식막 조성물이 약 2내지 6초동안 피복되는 하도충당 약 10 내지 20㎖/분의 속도로 상기 초음파 분무 노즐내로 공급됨을 특징으로 하는 방법.
- 제1항에 있어서, 상기 감광성 내식막 조성물의 고형분 함량이 약 12내지 약 20중량%임을 특징으로 하는 방법.
- 제1항에 있어서, 감광성 내식막 고형분 함량이 약 15내지 약 19중량%임을 특징으로 하는 방법.
- 제1항에 있어서, 하도층이 실리콘 와이퍼임을 특징으로 하는 방법.
- 제1항에 있어서, 피복단계(c)를 하도층을 회전시커며 수행함을 특징으로 하는 방법.
- 제8항에 있어서, 피복단계(c)를 약 500내지 약 2,000 rpm 의 회전속도로 수행함을 특징으로 하는 방법.
- 제1항에 있어서, 피복단계(d)를 약 1000내지 약 6000 rpm 이 회전속도로 약 20내지 60초 동안 수행함을 특징으로 하는 방법.
- 제1항에 있어서, 균일한 두께의 감광성 내식막 고형분 필름의 두께가 약 0.5 내지 1.5μ임을 특징으로 하는 방법.
- (a)용매 중 감광성 내식막 고형분을 포함하는 액체 감광성 내식막 조성루(여기에서, 감광성 내식막 조성물 중 고형분 함량은 약 12내지 약 20중량%이다)을 형성시키고, (b) 상기의 액체 감광성 내식막 조성물을 약 10내지 20㎖/분의 속도에서 초음파 분무 노즐에 중력으로 공급하며, (c) 상기 액체 감광성 내식막 조성물을 초음파 분무 노즐을 통과시킴으로써 상기 액체 감광성 내식막 조성물의 미세분무 소적을 형성시킨 다음,(d) 하도충당 2 내지 6초의 고정시간에 하도충상에 상기의 미세 분무 소적을 고정시킴으로써 하도충상에 감광성 내식막 피복물을 형성시키고, (d) 상기 피복된 하도층을 약 1000내지 약 6000rpm의 예정된 회전속도 및 약 20내지 60초의 예정된 시간 동안 회전시켜 상기 하도층상에 일정한 두께의 감광성 내식막 고형분 필름을 형성시키는 단계를 특징으로 하여, 하도층상에 일정두께의 감광성 내식막 고형분 필름을 적용시키는 방법
- 제12항에 있어서, 상기 감광성 내식막 조성물의 고형분 함량이 약 15내지 약 19중량%임을 특징으로 하는 방법.
- 제13항에 있어서, 하도층이 실리콘 와이퍼임을 특징으로 하는 방법.
- 제14항에 있어서, 피복단계(c)를 하도층을 회전시키며 수행함을 특징으로 하는 방법.
- 제15항에 있어서, 피복단계(c)를 약 500 내지 약 2,000rpm의 회전속도로 수행함을 특징으로 하는 방법.
- 제16항에 있어서, 회전단계(e)를 약 1500 내지 약 5000rpm의 회전속도로 수행함을 특징으로 하는 방법.
- 제17항에 있어서, 균일한 두께의 감광성 내식막 고형분 필름의 두께가 약 0.5내지 1.5μ임을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/333,519 US4996080A (en) | 1989-04-05 | 1989-04-05 | Process for coating a photoresist composition onto a substrate |
| US07/333,519 | 1989-04-05 | ||
| US07/333519 | 1989-04-05 | ||
| PCT/US1990/001623 WO1990011837A1 (en) | 1989-04-05 | 1990-03-27 | Process for coating a photoresist composition onto a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920700785A true KR920700785A (ko) | 1992-08-10 |
| KR0127145B1 KR0127145B1 (ko) | 1997-12-29 |
Family
ID=23303129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910701249A Expired - Fee Related KR0127145B1 (ko) | 1989-04-05 | 1990-03-27 | 기판 위에 감광성 내식막 조성물을 피복하는 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4996080A (ko) |
| EP (1) | EP0466770B1 (ko) |
| JP (1) | JP2550440B2 (ko) |
| KR (1) | KR0127145B1 (ko) |
| AU (1) | AU5401190A (ko) |
| DE (1) | DE69030497T2 (ko) |
| WO (1) | WO1990011837A1 (ko) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5658387A (en) * | 1991-03-06 | 1997-08-19 | Semitool, Inc. | Semiconductor processing spray coating apparatus |
| US6375741B2 (en) * | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
| US5158843A (en) * | 1990-07-02 | 1992-10-27 | Batson David C | Small particle thin electrochemical electrode and method |
| US5395803A (en) * | 1993-09-08 | 1995-03-07 | At&T Corp. | Method of spiral resist deposition |
| US5403617A (en) * | 1993-09-15 | 1995-04-04 | Mobium Enterprises Corporation | Hybrid pulsed valve for thin film coating and method |
| US5736195A (en) * | 1993-09-15 | 1998-04-07 | Mobium Enterprises Corporation | Method of coating a thin film on a substrate |
| SE9304145D0 (sv) * | 1993-12-10 | 1993-12-10 | Pharmacia Lkb Biotech | Sätt att tillverka hålrumsstrukturer |
| DE69523815T2 (de) * | 1994-05-18 | 2002-04-18 | Xerox Corp., Rochester | Akustischbeschichtung von Materialschichten |
| US6004622A (en) * | 1994-11-07 | 1999-12-21 | Macronix International Co., Ltd. | Spin-on-glass process with controlled environment |
| US5716673A (en) * | 1994-11-07 | 1998-02-10 | Macronix Internationalco., Ltd. | Spin-on-glass process with controlled environment |
| US6379744B1 (en) * | 1996-02-05 | 2002-04-30 | Motorola, Inc. | Method for coating an integrated circuit substrate |
| US6147010A (en) * | 1996-11-14 | 2000-11-14 | Micron Technology, Inc. | Solvent prewet and method to dispense the solvent prewet |
| US6177133B1 (en) | 1997-12-10 | 2001-01-23 | Silicon Valley Group, Inc. | Method and apparatus for adaptive process control of critical dimensions during spin coating process |
| US6344163B1 (en) * | 1998-04-23 | 2002-02-05 | Louis S. Ashley | Method and apparatus for dipped forming PVC gloves and cot-like articles |
| US6349668B1 (en) | 1998-04-27 | 2002-02-26 | Msp Corporation | Method and apparatus for thin film deposition on large area substrates |
| US6407009B1 (en) | 1998-11-12 | 2002-06-18 | Advanced Micro Devices, Inc. | Methods of manufacture of uniform spin-on films |
| US6530340B2 (en) | 1998-11-12 | 2003-03-11 | Advanced Micro Devices, Inc. | Apparatus for manufacturing planar spin-on films |
| US6200913B1 (en) | 1998-11-12 | 2001-03-13 | Advanced Micro Devices, Inc. | Cure process for manufacture of low dielectric constant interlevel dielectric layers |
| US6225240B1 (en) | 1998-11-12 | 2001-05-01 | Advanced Micro Devices, Inc. | Rapid acceleration methods for global planarization of spin-on films |
| US6317642B1 (en) | 1998-11-12 | 2001-11-13 | Advanced Micro Devices, Inc. | Apparatus and methods for uniform scan dispensing of spin-on materials |
| US6387825B2 (en) | 1998-11-12 | 2002-05-14 | Advanced Micro Devices, Inc. | Solution flow-in for uniform deposition of spin-on films |
| US6174651B1 (en) * | 1999-01-14 | 2001-01-16 | Steag Rtp Systems, Inc. | Method for depositing atomized materials onto a substrate utilizing light exposure for heating |
| US6746539B2 (en) | 2001-01-30 | 2004-06-08 | Msp Corporation | Scanning deposition head for depositing particles on a wafer |
| US6607597B2 (en) | 2001-01-30 | 2003-08-19 | Msp Corporation | Method and apparatus for deposition of particles on surfaces |
| US6780233B1 (en) | 2001-05-24 | 2004-08-24 | Seagate Technology Llc | Wettability improvement of spun-on resist and thermoplastic materials |
| US6642147B2 (en) | 2001-08-23 | 2003-11-04 | International Business Machines Corporation | Method of making thermally stable planarizing films |
| KR100973799B1 (ko) * | 2003-01-03 | 2010-08-03 | 삼성전자주식회사 | Mmn 헤드 코터용 포토레지스트 조성물 |
| DE10351963B4 (de) * | 2003-11-07 | 2013-08-22 | Süss Microtec Lithography Gmbh | Verfahren zum Belacken von Halbleitersubstraten |
| EP1740303A2 (en) * | 2004-03-23 | 2007-01-10 | Velocys, Inc. | Protected alloy surfaces in microchannel apparatus and catalysts, alumina supported catalysts, catalyst intermediates, and methods of forming catalysts and microchannel apparatus |
| US7874432B2 (en) * | 2004-03-23 | 2011-01-25 | Velocys | Protected alloy surfaces in microchannel apparatus and catalysts, alumina supported catalysts, catalyst intermediates, and methods of forming catalysts and microchannel apparatus |
| US7939131B2 (en) * | 2004-08-16 | 2011-05-10 | Molecular Imprints, Inc. | Method to provide a layer with uniform etch characteristics |
| JP5079984B2 (ja) * | 2005-02-23 | 2012-11-21 | 株式会社Gsユアサ | 膜エレメントの製造方法 |
| US8142702B2 (en) * | 2007-06-18 | 2012-03-27 | Molecular Imprints, Inc. | Solvent-assisted layer formation for imprint lithography |
| US8282999B2 (en) * | 2008-04-04 | 2012-10-09 | Micron Technology, Inc. | Spin-on film processing using acoustic radiation pressure |
| TWI384496B (zh) * | 2008-12-23 | 2013-02-01 | Nat Univ Chung Hsing | Preparation method of carbon nanotube conductive thin film |
| US8202568B2 (en) * | 2008-12-23 | 2012-06-19 | Ipcooler Technology Inc. | Method for making a conductive film of carbon nanotubes |
| JP5306300B2 (ja) * | 2010-09-15 | 2013-10-02 | 株式会社東芝 | 成膜装置及び成膜方法 |
| RU2666175C1 (ru) * | 2017-12-26 | 2018-09-06 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" | Способ формирования фоторезистивной пленки из раствора на поверхности подложки |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231727A (en) * | 1975-09-05 | 1977-03-10 | Fuji Photo Film Co Ltd | Coating method |
| US4301968A (en) * | 1976-11-08 | 1981-11-24 | Sono-Tek Corporation | Transducer assembly, ultrasonic atomizer and fuel burner |
| US4153201A (en) * | 1976-11-08 | 1979-05-08 | Sono-Tek Corporation | Transducer assembly, ultrasonic atomizer and fuel burner |
| IL60236A (en) * | 1979-06-08 | 1985-07-31 | Sono Tek Corp | Ultrasonic fuel atomizer |
| JPS5656261A (en) * | 1979-10-11 | 1981-05-18 | Matsushita Electric Ind Co Ltd | Method and apparatus for rotary coating |
| US4352459A (en) * | 1979-11-13 | 1982-10-05 | Sono-Tek Corporation | Ultrasonic liquid atomizer having an axially-extending liquid feed passage |
| JPS5769737A (en) * | 1980-10-17 | 1982-04-28 | Hitachi Ltd | Coating method and device for resist on both side surfaces of wafer |
| JPS5972725A (ja) * | 1982-10-20 | 1984-04-24 | Toshiba Corp | レジスト塗布方法 |
| US4541564A (en) * | 1983-01-05 | 1985-09-17 | Sono-Tek Corporation | Ultrasonic liquid atomizer, particularly for high volume flow rates |
| US4642581A (en) * | 1985-06-21 | 1987-02-10 | Sono-Tek Corporation | Ultrasonic transducer drive circuit |
| US4723708A (en) * | 1986-05-09 | 1988-02-09 | Sono-Tek Corporation | Central bolt ultrasonic atomizer |
| US4806455A (en) * | 1987-04-03 | 1989-02-21 | Macdermid, Incorporated | Thermal stabilization of photoresist images |
-
1989
- 1989-04-05 US US07/333,519 patent/US4996080A/en not_active Expired - Lifetime
-
1990
- 1990-03-27 DE DE69030497T patent/DE69030497T2/de not_active Expired - Fee Related
- 1990-03-27 AU AU54011/90A patent/AU5401190A/en not_active Abandoned
- 1990-03-27 WO PCT/US1990/001623 patent/WO1990011837A1/en not_active Ceased
- 1990-03-27 JP JP2505547A patent/JP2550440B2/ja not_active Expired - Lifetime
- 1990-03-27 EP EP90905877A patent/EP0466770B1/en not_active Expired - Lifetime
- 1990-03-27 KR KR1019910701249A patent/KR0127145B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR0127145B1 (ko) | 1997-12-29 |
| AU5401190A (en) | 1990-11-05 |
| US4996080A (en) | 1991-02-26 |
| EP0466770B1 (en) | 1997-04-16 |
| EP0466770A1 (en) | 1992-01-22 |
| JPH04504377A (ja) | 1992-08-06 |
| EP0466770A4 (en) | 1993-10-20 |
| WO1990011837A1 (en) | 1990-10-18 |
| JP2550440B2 (ja) | 1996-11-06 |
| DE69030497T2 (de) | 1997-07-24 |
| DE69030497D1 (de) | 1997-05-22 |
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