KR920700785A - 하도층상에 감광성 내식막 조성물을 피복하는 방법 - Google Patents

하도층상에 감광성 내식막 조성물을 피복하는 방법

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Publication number
KR920700785A
KR920700785A KR1019910701249A KR910701249A KR920700785A KR 920700785 A KR920700785 A KR 920700785A KR 1019910701249 A KR1019910701249 A KR 1019910701249A KR 910701249 A KR910701249 A KR 910701249A KR 920700785 A KR920700785 A KR 920700785A
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South Korea
Prior art keywords
photoresist
photoresist composition
undercoat
liquid
composition
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KR1019910701249A
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KR0127145B1 (ko
Inventor
에스. 다락트치에프 이반
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원본미기재
올린 헌트 스페셜티 프로덕츠 인코포레이티드
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/40Distributing applied liquids or other fluent materials by members moving relatively to surface

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

내용 없음

Description

하도층상에 감광성 내식막 조성물을 피복하는 방법.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (18)

  1. (a) 용매 중 감광성 내식막 고형분을 포함하는 액체 감광성 내식마 조성물(여기에서, 감광성 내식막 조성물 중 고형분 함량은 약 10내지 약22중량%이다)을 형성시키고; (b) 상기 액체 감광성 내식막 조성물의 미세분무소적을 형성시킨 다음; (c) 하도층 표면상에 상기 미세 분무 소적을 중력으로서 고정시켜, 하도체상에 감광성 내식막 피복물을 형성시키고; (d)상기 피복된 하도층을 예정된 회전속도 및 예정된 시간동안 회전시켜 감광성 내식막 피복물 중의 거의 모든 용매를 제거하고 하도층상에 일정한 두께의 감광성 내식막 고형분 필름을 형성시키는 단계를 특징으로 하여, 하도층상에 일정한 두께의 감광성 내식막 고형분 필름을 적용시키는 방법.
  2. 제1항에 있어서, 미세 감광성 내식막 분무 소적을 단계(b)에서 초음파 분무 노즐을 사용하여 형성시킴을 특징으로 하는 방법.
  3. 제2항에 있어서, 액체 감광성 내식막 조성물을 초음파 분무노즐에 중력으로 공급하는 방법.
  4. 제3항에 있어서, 액체 감광성 내식막 조성물이 약 2내지 6초동안 피복되는 하도충당 약 10 내지 20㎖/분의 속도로 상기 초음파 분무 노즐내로 공급됨을 특징으로 하는 방법.
  5. 제1항에 있어서, 상기 감광성 내식막 조성물의 고형분 함량이 약 12내지 약 20중량%임을 특징으로 하는 방법.
  6. 제1항에 있어서, 감광성 내식막 고형분 함량이 약 15내지 약 19중량%임을 특징으로 하는 방법.
  7. 제1항에 있어서, 하도층이 실리콘 와이퍼임을 특징으로 하는 방법.
  8. 제1항에 있어서, 피복단계(c)를 하도층을 회전시커며 수행함을 특징으로 하는 방법.
  9. 제8항에 있어서, 피복단계(c)를 약 500내지 약 2,000 rpm 의 회전속도로 수행함을 특징으로 하는 방법.
  10. 제1항에 있어서, 피복단계(d)를 약 1000내지 약 6000 rpm 이 회전속도로 약 20내지 60초 동안 수행함을 특징으로 하는 방법.
  11. 제1항에 있어서, 균일한 두께의 감광성 내식막 고형분 필름의 두께가 약 0.5 내지 1.5μ임을 특징으로 하는 방법.
  12. (a)용매 중 감광성 내식막 고형분을 포함하는 액체 감광성 내식막 조성루(여기에서, 감광성 내식막 조성물 중 고형분 함량은 약 12내지 약 20중량%이다)을 형성시키고, (b) 상기의 액체 감광성 내식막 조성물을 약 10내지 20㎖/분의 속도에서 초음파 분무 노즐에 중력으로 공급하며, (c) 상기 액체 감광성 내식막 조성물을 초음파 분무 노즐을 통과시킴으로써 상기 액체 감광성 내식막 조성물의 미세분무 소적을 형성시킨 다음,(d) 하도충당 2 내지 6초의 고정시간에 하도충상에 상기의 미세 분무 소적을 고정시킴으로써 하도충상에 감광성 내식막 피복물을 형성시키고, (d) 상기 피복된 하도층을 약 1000내지 약 6000rpm의 예정된 회전속도 및 약 20내지 60초의 예정된 시간 동안 회전시켜 상기 하도층상에 일정한 두께의 감광성 내식막 고형분 필름을 형성시키는 단계를 특징으로 하여, 하도층상에 일정두께의 감광성 내식막 고형분 필름을 적용시키는 방법
  13. 제12항에 있어서, 상기 감광성 내식막 조성물의 고형분 함량이 약 15내지 약 19중량%임을 특징으로 하는 방법.
  14. 제13항에 있어서, 하도층이 실리콘 와이퍼임을 특징으로 하는 방법.
  15. 제14항에 있어서, 피복단계(c)를 하도층을 회전시키며 수행함을 특징으로 하는 방법.
  16. 제15항에 있어서, 피복단계(c)를 약 500 내지 약 2,000rpm의 회전속도로 수행함을 특징으로 하는 방법.
  17. 제16항에 있어서, 회전단계(e)를 약 1500 내지 약 5000rpm의 회전속도로 수행함을 특징으로 하는 방법.
  18. 제17항에 있어서, 균일한 두께의 감광성 내식막 고형분 필름의 두께가 약 0.5내지 1.5μ임을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910701249A 1989-04-05 1990-03-27 기판 위에 감광성 내식막 조성물을 피복하는 방법 Expired - Fee Related KR0127145B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/333,519 US4996080A (en) 1989-04-05 1989-04-05 Process for coating a photoresist composition onto a substrate
US07/333,519 1989-04-05
US07/333519 1989-04-05
PCT/US1990/001623 WO1990011837A1 (en) 1989-04-05 1990-03-27 Process for coating a photoresist composition onto a substrate

Publications (2)

Publication Number Publication Date
KR920700785A true KR920700785A (ko) 1992-08-10
KR0127145B1 KR0127145B1 (ko) 1997-12-29

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Country Status (7)

Country Link
US (1) US4996080A (ko)
EP (1) EP0466770B1 (ko)
JP (1) JP2550440B2 (ko)
KR (1) KR0127145B1 (ko)
AU (1) AU5401190A (ko)
DE (1) DE69030497T2 (ko)
WO (1) WO1990011837A1 (ko)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658387A (en) * 1991-03-06 1997-08-19 Semitool, Inc. Semiconductor processing spray coating apparatus
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5158843A (en) * 1990-07-02 1992-10-27 Batson David C Small particle thin electrochemical electrode and method
US5395803A (en) * 1993-09-08 1995-03-07 At&T Corp. Method of spiral resist deposition
US5403617A (en) * 1993-09-15 1995-04-04 Mobium Enterprises Corporation Hybrid pulsed valve for thin film coating and method
US5736195A (en) * 1993-09-15 1998-04-07 Mobium Enterprises Corporation Method of coating a thin film on a substrate
SE9304145D0 (sv) * 1993-12-10 1993-12-10 Pharmacia Lkb Biotech Sätt att tillverka hålrumsstrukturer
DE69523815T2 (de) * 1994-05-18 2002-04-18 Xerox Corp., Rochester Akustischbeschichtung von Materialschichten
US6004622A (en) * 1994-11-07 1999-12-21 Macronix International Co., Ltd. Spin-on-glass process with controlled environment
US5716673A (en) * 1994-11-07 1998-02-10 Macronix Internationalco., Ltd. Spin-on-glass process with controlled environment
US6379744B1 (en) * 1996-02-05 2002-04-30 Motorola, Inc. Method for coating an integrated circuit substrate
US6147010A (en) * 1996-11-14 2000-11-14 Micron Technology, Inc. Solvent prewet and method to dispense the solvent prewet
US6177133B1 (en) 1997-12-10 2001-01-23 Silicon Valley Group, Inc. Method and apparatus for adaptive process control of critical dimensions during spin coating process
US6344163B1 (en) * 1998-04-23 2002-02-05 Louis S. Ashley Method and apparatus for dipped forming PVC gloves and cot-like articles
US6349668B1 (en) 1998-04-27 2002-02-26 Msp Corporation Method and apparatus for thin film deposition on large area substrates
US6407009B1 (en) 1998-11-12 2002-06-18 Advanced Micro Devices, Inc. Methods of manufacture of uniform spin-on films
US6530340B2 (en) 1998-11-12 2003-03-11 Advanced Micro Devices, Inc. Apparatus for manufacturing planar spin-on films
US6200913B1 (en) 1998-11-12 2001-03-13 Advanced Micro Devices, Inc. Cure process for manufacture of low dielectric constant interlevel dielectric layers
US6225240B1 (en) 1998-11-12 2001-05-01 Advanced Micro Devices, Inc. Rapid acceleration methods for global planarization of spin-on films
US6317642B1 (en) 1998-11-12 2001-11-13 Advanced Micro Devices, Inc. Apparatus and methods for uniform scan dispensing of spin-on materials
US6387825B2 (en) 1998-11-12 2002-05-14 Advanced Micro Devices, Inc. Solution flow-in for uniform deposition of spin-on films
US6174651B1 (en) * 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
US6746539B2 (en) 2001-01-30 2004-06-08 Msp Corporation Scanning deposition head for depositing particles on a wafer
US6607597B2 (en) 2001-01-30 2003-08-19 Msp Corporation Method and apparatus for deposition of particles on surfaces
US6780233B1 (en) 2001-05-24 2004-08-24 Seagate Technology Llc Wettability improvement of spun-on resist and thermoplastic materials
US6642147B2 (en) 2001-08-23 2003-11-04 International Business Machines Corporation Method of making thermally stable planarizing films
KR100973799B1 (ko) * 2003-01-03 2010-08-03 삼성전자주식회사 Mmn 헤드 코터용 포토레지스트 조성물
DE10351963B4 (de) * 2003-11-07 2013-08-22 Süss Microtec Lithography Gmbh Verfahren zum Belacken von Halbleitersubstraten
EP1740303A2 (en) * 2004-03-23 2007-01-10 Velocys, Inc. Protected alloy surfaces in microchannel apparatus and catalysts, alumina supported catalysts, catalyst intermediates, and methods of forming catalysts and microchannel apparatus
US7874432B2 (en) * 2004-03-23 2011-01-25 Velocys Protected alloy surfaces in microchannel apparatus and catalysts, alumina supported catalysts, catalyst intermediates, and methods of forming catalysts and microchannel apparatus
US7939131B2 (en) * 2004-08-16 2011-05-10 Molecular Imprints, Inc. Method to provide a layer with uniform etch characteristics
JP5079984B2 (ja) * 2005-02-23 2012-11-21 株式会社Gsユアサ 膜エレメントの製造方法
US8142702B2 (en) * 2007-06-18 2012-03-27 Molecular Imprints, Inc. Solvent-assisted layer formation for imprint lithography
US8282999B2 (en) * 2008-04-04 2012-10-09 Micron Technology, Inc. Spin-on film processing using acoustic radiation pressure
TWI384496B (zh) * 2008-12-23 2013-02-01 Nat Univ Chung Hsing Preparation method of carbon nanotube conductive thin film
US8202568B2 (en) * 2008-12-23 2012-06-19 Ipcooler Technology Inc. Method for making a conductive film of carbon nanotubes
JP5306300B2 (ja) * 2010-09-15 2013-10-02 株式会社東芝 成膜装置及び成膜方法
RU2666175C1 (ru) * 2017-12-26 2018-09-06 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" Способ формирования фоторезистивной пленки из раствора на поверхности подложки

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231727A (en) * 1975-09-05 1977-03-10 Fuji Photo Film Co Ltd Coating method
US4301968A (en) * 1976-11-08 1981-11-24 Sono-Tek Corporation Transducer assembly, ultrasonic atomizer and fuel burner
US4153201A (en) * 1976-11-08 1979-05-08 Sono-Tek Corporation Transducer assembly, ultrasonic atomizer and fuel burner
IL60236A (en) * 1979-06-08 1985-07-31 Sono Tek Corp Ultrasonic fuel atomizer
JPS5656261A (en) * 1979-10-11 1981-05-18 Matsushita Electric Ind Co Ltd Method and apparatus for rotary coating
US4352459A (en) * 1979-11-13 1982-10-05 Sono-Tek Corporation Ultrasonic liquid atomizer having an axially-extending liquid feed passage
JPS5769737A (en) * 1980-10-17 1982-04-28 Hitachi Ltd Coating method and device for resist on both side surfaces of wafer
JPS5972725A (ja) * 1982-10-20 1984-04-24 Toshiba Corp レジスト塗布方法
US4541564A (en) * 1983-01-05 1985-09-17 Sono-Tek Corporation Ultrasonic liquid atomizer, particularly for high volume flow rates
US4642581A (en) * 1985-06-21 1987-02-10 Sono-Tek Corporation Ultrasonic transducer drive circuit
US4723708A (en) * 1986-05-09 1988-02-09 Sono-Tek Corporation Central bolt ultrasonic atomizer
US4806455A (en) * 1987-04-03 1989-02-21 Macdermid, Incorporated Thermal stabilization of photoresist images

Also Published As

Publication number Publication date
KR0127145B1 (ko) 1997-12-29
AU5401190A (en) 1990-11-05
US4996080A (en) 1991-02-26
EP0466770B1 (en) 1997-04-16
EP0466770A1 (en) 1992-01-22
JPH04504377A (ja) 1992-08-06
EP0466770A4 (en) 1993-10-20
WO1990011837A1 (en) 1990-10-18
JP2550440B2 (ja) 1996-11-06
DE69030497T2 (de) 1997-07-24
DE69030497D1 (de) 1997-05-22

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