KR920702018A - 웨이퍼 가공용 필름 - Google Patents

웨이퍼 가공용 필름

Info

Publication number
KR920702018A
KR920702018A KR1019910700332A KR910700332A KR920702018A KR 920702018 A KR920702018 A KR 920702018A KR 1019910700332 A KR1019910700332 A KR 1019910700332A KR 910700332 A KR910700332 A KR 910700332A KR 920702018 A KR920702018 A KR 920702018A
Authority
KR
South Korea
Prior art keywords
film
wafer processing
synthetic resin
resin film
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019910700332A
Other languages
English (en)
Inventor
야스오 다께무라
오사무 나리마쓰
가즈요시 고마쓰
Original Assignee
미시마 마사요시
미쓰이도오아쓰가가꾸 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16383269&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR920702018(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 미시마 마사요시, 미쓰이도오아쓰가가꾸 가부시끼가이샤 filed Critical 미시마 마사요시
Publication of KR920702018A publication Critical patent/KR920702018A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

Landscapes

  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

웨이퍼 가공용 필름
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 베이스 필름, 이 베이스필름의 표면에 제공된 접착층 및 이 접착층 위에 배열한 합성수지 필름으로 구성되어 있으며, 접착층과 접촉된 합성수지 필름 표면의 표면 거칠기가 2㎛ 이하인 웨이퍼 가공용 필름.
  2. 제1항에 있어서, 합성수지 필름이 쇼오 "D"경도가 적어도 30인 웨이퍼 가공용 필름.
  3. 제1항에 있어서, 합성수지 필름이 2축 신장 필름인 웨이퍼 가공용 필름.
  4. 제1항에 있어서, 합성수지 필름이 폴리프로필렌 필름인 웨이퍼 가공용 필름.
  5. 제1항에 있어서, 합성수지 필름이 2축 신장 폴리프로필렌 필름인 웨이퍼 가공용 필름.
  6. 제4항 또는 제5항에 있어서, 합성수지 필름이 폴리프로필렌 100중량부에 대하여 0.5중량부 이하의비율로 윤활제를 함유하는 웨이퍼 가공용 필름.
  7. 제4항 또는 제5항에 있어서, 합성수지 필름이 폴리프로필렌 100중량부에 대하여 0.1중량부 이하의 비율로 윤활제를 함유하는 웨이퍼 가공용 필름.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910700332A 1989-08-01 1990-07-30 웨이퍼 가공용 필름 Ceased KR920702018A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP197965/89 1989-08-01
JP19796589 1989-08-01
PCT/JP1990/000967 WO1991002377A1 (fr) 1989-08-01 1990-07-30 Feuille pour la fabrication des tranches de semi-conducteurs

Publications (1)

Publication Number Publication Date
KR920702018A true KR920702018A (ko) 1992-08-12

Family

ID=16383269

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910700332A Ceased KR920702018A (ko) 1989-08-01 1990-07-30 웨이퍼 가공용 필름

Country Status (5)

Country Link
US (1) US5183699A (ko)
EP (1) EP0436731A4 (ko)
JP (1) JP2981261B2 (ko)
KR (1) KR920702018A (ko)
WO (1) WO1991002377A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3821870B2 (ja) * 1994-10-07 2006-09-13 スリーエム カンパニー 難燃性熱硬化性樹脂組成物
TW311927B (ko) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
US5648136A (en) * 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
JP3669196B2 (ja) 1998-07-27 2005-07-06 日東電工株式会社 紫外線硬化型粘着シート
JP3763710B2 (ja) * 1999-09-29 2006-04-05 信越化学工業株式会社 防塵用カバーフィルム付きウエハ支持台及びその製造方法
KR20020061737A (ko) * 2001-01-17 2002-07-25 삼성전자 주식회사 반도체 제조장치 및 반도체 제조장치의 웨이퍼 가공방법
WO2006016883A1 (en) * 2004-07-13 2006-02-16 Illinois Tool Works Inc. Scribed interleaf separator wafer packaging
US6933033B1 (en) * 2004-07-13 2005-08-23 Illinois Tool Works Inc. Scribed interleaf separator wafer packaging
JP5528169B2 (ja) * 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
US20130084459A1 (en) 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive
JP5790753B2 (ja) * 2013-12-26 2015-10-07 東洋インキＳｃホールディングス株式会社 研磨材固定用両面感圧接着シート
CN112625609B (zh) * 2015-03-30 2022-11-08 琳得科株式会社 树脂膜形成用片及树脂膜形成用复合片
JP2021024950A (ja) * 2019-08-05 2021-02-22 日東電工株式会社 粘着シート
JP2021024949A (ja) * 2019-08-05 2021-02-22 日東電工株式会社 粘着シート
JP7173091B2 (ja) * 2020-05-08 2022-11-16 信越半導体株式会社 平面研削方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3565750A (en) * 1969-05-19 1971-02-23 Minnesota Mining & Mfg Pressure-sensitive adhesive article with dry-strippable liner
DE2009935A1 (en) * 1970-03-03 1971-09-16 Alkor Werk Karl Lissmann KG, 8000 München Self adhesive pvc sheet
JPS58131631A (ja) * 1982-01-30 1983-08-05 松下電工株式会社 回路遮断器
IT1152962B (it) * 1982-06-11 1987-01-14 Manuli Autoadesivi Spa Perfezionamento dei nastri autoadesivi con supporto in polipropilene od altro polimero o copolimero olefinico e relativo procedimento di fabbricazione
EP0185767B1 (en) * 1984-05-29 1991-01-23 MITSUI TOATSU CHEMICALS, Inc. Film for machining wafers
DE3501726A1 (de) * 1985-01-19 1986-07-24 Hoechst Ag, 6230 Frankfurt Polypropylen-klebeband
JPH0789546B2 (ja) * 1985-05-15 1995-09-27 三井東圧化学株式会社 ウエハ加工用フィルム
DE3639266A1 (de) * 1985-12-27 1987-07-02 Fsk K K Haftfolie
JPS62218467A (ja) * 1986-03-20 1987-09-25 Toyo Ink Mfg Co Ltd 剥離ライナ−およびこれを用いた両面粘着テ−プもしくはシ−ト
JPS63177423A (ja) * 1987-01-17 1988-07-21 Nitto Electric Ind Co Ltd 半導体ウエハの固定部材

Also Published As

Publication number Publication date
EP0436731A1 (en) 1991-07-17
US5183699A (en) 1993-02-02
EP0436731A4 (en) 1992-12-09
JP2981261B2 (ja) 1999-11-22
JPH03171627A (ja) 1991-07-25
WO1991002377A1 (fr) 1991-02-21

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St.27 status event code: N-2-6-B10-B15-exm-PE0601

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