KR960031402A - 세라믹스의 접합 구조 및 그 제조 방법 - Google Patents
세라믹스의 접합 구조 및 그 제조 방법 Download PDFInfo
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- KR960031402A KR960031402A KR1019960002909A KR19960002909A KR960031402A KR 960031402 A KR960031402 A KR 960031402A KR 1019960002909 A KR1019960002909 A KR 1019960002909A KR 19960002909 A KR19960002909 A KR 19960002909A KR 960031402 A KR960031402 A KR 960031402A
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- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
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Abstract
Description
Claims (13)
- 세라믹 부재와 금속 접합 부재가 납재로 이루어진 접합층에 의하여 접합되어 있는 세라믹의 접합 구조에 있어서, 상기 세라믹 부재에 금속 부재가 매설되어 있고, 상기 세라믹 부재의 상기 접합층과 접촉하는 접합면에 상기 금속 부재의 일부가 노출되어 금속노출부를 형성하고 있고, 이 접합면에 따라 세라믹 부재와 상기 금속노출부가 각각 상기 접합층에 대하여 접합하고 있는 것을 특징으로 하는 세라믹의 접합 구조.
- 제1항에 있어서, 상기 세라믹 부재를 구성하는 세라믹이, 질화 알루미늄인 것을 특징으로 하는 세라믹의 접합 구조.
- 제2항에 있어서, 상기 접합층이 적어도 주성분이 동, 알루미늄 및 니켈로 이루어진 군에서 선택된 금속으로 이루어진 연속상을 구비하고 있고, 또한 마그네슘, 티타늄, 지르코늄 및 팔라듐으로 이루어진 군에서 선택된 1종 이상의 활성 금속을 10중량% 이하 함유하고 있는 것을 특징으로 하는 세라믹의 접합 구조.
- 제1항에 있어서, 상기 금속 접합 부재를 구성하는 금속이, 니켈, 동, 알루미늄 및 이들의 합금으로 이루어진 군에서 선택된 금속인 것을 특징으로 하는 세라믹의 접합 구조.
- 제4항에 있어서, 상기 금속 접합 부재를 구성하는 금속이, 니켈이고, 또한 상기 금속 접합 부재상에, 니켈-알루미늄 금속간 화합물로 이루어진 반응층이 형성되어 있는 것을 특징으로 하는 세라믹의 접합 구조.
- 제3항에 있어서, 상기 연속상의 주성분이 알루미늄이고, 이 연속상 중에 마그네슘이 응고되어 있는 것을 특징으로 하는 세라믹의 접합 구조.
- 제3항에 있어서, 상기 연속상 중에, 니켈-알루미늄 금속간 화합물로 이루어진 분산상이 형성되어 있는 것을 특징으로 하는 세라믹의 접합 구조.
- 제1항에 있어서, 상기 금속 부재가 몰리브덴, 텅스텐 및 몰리브덴과 텅스텐과의 합금으로 이루어진 군에서 선택된 금속인 것을 특징으로 하는 세라믹의 접합 구조.
- 제1항에 있어서, 상기 금속노출부가 망상 구조를 이루고 있고, 이 망상 구조의 사이에 상기 세라믹 부재가 노출하고 있는 것을 특징으로 하는 세라믹의 접합 구조.
- 청구항 제1항 기재의 세라믹의 접합 구조를 제조하는 방법으로서, 상기 세라믹 부재의 접합면에 상기 금속 부재의 일부를 노출시켜 상기 금속노출부를 형성하고, 이 접합면에 따라 납재를 접촉시켜 납땜을 행함으로써, 상기 세라믹 부재와 상기 금속노출부를 각각 상기 접합층에 대하여 접합시키는 것을 특징으로 하는 세라믹의 접합 구조의 제조 방법.
- 제10항에 있어서, 상기 납재 중에, 주성분으로서, 동, 알루미늄 및 니켈로 이루어진 군에서 선택된 금속이 함유되어 있고, 마그네슘, 티타늄, 지르코늄 및 팔라듐으로 이루어진 군에서 선택된 1종 이상의 활성 금속 0.3중량% 아상, 20중량% 이하 함유되어 있는 것을 특징으로 하는 세라믹의 접합 구조의 제조 방법.
- 제11항에 있어서, 상기 납재 중에 제3성분이 50중량% 이하 함유되어 있는 것을 특징으로 하는 세라믹의 접합 구조의 제조 방법.
- 제10항에 있어서, 상기 세라믹 부재의 접합면 또는 상기 납재의 상기 세라믹 부재 측의 표면에 동, 알루미늄, 니켈, 마그네슘, 티타늄, 지르코늄 및 팔라듐으로 이루어진 군에서 선택된 금속으로 이루어진 막을 형성하는 것을 특징으로 하는 세라믹의 접합 구조의 제조 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980049525A KR100199337B1 (en) | 1995-02-09 | 1998-11-18 | Junction structure of ceramics and method for preparing the same |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP95-21658 | 1995-02-09 | ||
| JP2165895 | 1995-02-09 | ||
| JP02483696A JP3813654B2 (ja) | 1995-02-09 | 1996-01-19 | セラミックスの接合構造およびその製造方法 |
| JP96-24836 | 1996-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960031402A true KR960031402A (ko) | 1996-09-17 |
Family
ID=26358756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960002909A Ceased KR960031402A (ko) | 1995-02-09 | 1996-02-07 | 세라믹스의 접합 구조 및 그 제조 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6020076A (ko) |
| EP (1) | EP0726239B1 (ko) |
| JP (1) | JP3813654B2 (ko) |
| KR (1) | KR960031402A (ko) |
| DE (1) | DE69609742T2 (ko) |
| TW (1) | TW397808B (ko) |
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| KR20210043586A (ko) * | 2018-08-28 | 2021-04-21 | 미쓰비시 마테리알 가부시키가이샤 | 구리/세라믹스 접합체, 절연 회로 기판, 및 구리/세라믹스 접합체의 제조 방법, 및 절연 회로 기판의 제조 방법 |
| KR20220054461A (ko) * | 2019-12-02 | 2022-05-02 | 미쓰비시 마테리알 가부시키가이샤 | 구리/세라믹스 접합체, 절연 회로 기판, 및 구리/세라믹스 접합체의 제조 방법, 절연 회로 기판의 제조 방법 |
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| JP3790000B2 (ja) * | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
| JP3954177B2 (ja) * | 1997-01-29 | 2007-08-08 | 日本碍子株式会社 | 金属部材とセラミックス部材との接合構造およびその製造方法 |
| JP3746594B2 (ja) | 1997-06-20 | 2006-02-15 | 日本碍子株式会社 | セラミックスの接合構造およびその製造方法 |
| JP3541702B2 (ja) * | 1998-01-16 | 2004-07-14 | 株式会社デンソー | セラミック−金属接合体及びその製造方法 |
| JP2000106391A (ja) * | 1998-07-28 | 2000-04-11 | Ngk Insulators Ltd | 半導体支持装置、その製造方法、接合体の製造方法および接合体 |
| DE19923865A1 (de) * | 1999-05-25 | 2000-11-30 | Voith Sulzer Papiertech Patent | Verfahren zur Herstellung von Garnituren für das mechanische Bearbeiten von wasserhaltigem Papierfaserstoff |
| JP4005268B2 (ja) | 1999-06-01 | 2007-11-07 | 日本碍子株式会社 | セラミックスと金属との接合構造およびこれに使用する中間挿入材 |
| JP2002293655A (ja) | 2001-03-29 | 2002-10-09 | Ngk Insulators Ltd | 金属端子とセラミック部材との接合構造、金属部材とセラミック部材との接合構造および金属端子とセラミック部材との接合材 |
| US20050106794A1 (en) * | 2002-03-26 | 2005-05-19 | Fuji Electric Holdings Co., Ltd. | Method of manufacturing a semiconductor device |
| JP4107643B2 (ja) | 2002-07-23 | 2008-06-25 | 日本碍子株式会社 | 接合体の製造方法 |
| US7252872B2 (en) * | 2003-01-29 | 2007-08-07 | Ngk Insulators, Ltd. | Joined structures of ceramics |
| JP4008401B2 (ja) * | 2003-09-22 | 2007-11-14 | 日本碍子株式会社 | 基板載置台の製造方法 |
| JP2007536088A (ja) * | 2004-05-04 | 2007-12-13 | エス−ボンド テクノロジーズ、エルエルシー | インジウム、ビスマス及び/またはカドミウムを含有する低温活性半田を用いて形成した電子パッケージ |
| JP4510745B2 (ja) * | 2005-10-28 | 2010-07-28 | 日本碍子株式会社 | セラミックス基材と電力供給用コネクタの接合構造 |
| JP4531004B2 (ja) | 2006-03-24 | 2010-08-25 | 日本碍子株式会社 | 加熱装置 |
| US20070251938A1 (en) * | 2006-04-26 | 2007-11-01 | Watlow Electric Manufacturing Company | Ceramic heater and method of securing a thermocouple thereto |
| JP4421595B2 (ja) | 2006-11-16 | 2010-02-24 | 日本碍子株式会社 | 加熱装置 |
| JP4858319B2 (ja) * | 2007-06-07 | 2012-01-18 | 住友電気工業株式会社 | ウェハ保持体の電極接続構造 |
| DE102007029031A1 (de) * | 2007-06-23 | 2008-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot |
| JP5345449B2 (ja) * | 2008-07-01 | 2013-11-20 | 日本碍子株式会社 | 接合構造体及びその製造方法 |
| JP2010114351A (ja) * | 2008-11-10 | 2010-05-20 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
| DE102011103746A1 (de) * | 2011-05-31 | 2012-12-06 | Ixys Semiconductor Gmbh | Verfahren zum Fügen von Metall-Keramik-Substraten an Metallkörpern |
| JP5348439B2 (ja) | 2011-09-30 | 2013-11-20 | Toto株式会社 | 静電チャック |
| US8684256B2 (en) * | 2011-11-30 | 2014-04-01 | Component Re-Engineering Company, Inc. | Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing |
| US9624137B2 (en) * | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
| JP6886128B2 (ja) * | 2016-11-29 | 2021-06-16 | 住友電気工業株式会社 | ウエハ保持体 |
| WO2018159590A1 (ja) * | 2017-02-28 | 2018-09-07 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
| JP6965768B2 (ja) | 2017-02-28 | 2021-11-10 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
| US10882130B2 (en) * | 2018-04-17 | 2021-01-05 | Watlow Electric Manufacturing Company | Ceramic-aluminum assembly with bonding trenches |
| WO2020044593A1 (ja) * | 2018-08-28 | 2020-03-05 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法 |
| US12120257B2 (en) * | 2020-04-07 | 2024-10-15 | Amosense Co., Ltd. | Folding plate and manufacturing method therefor |
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| WO2025154186A1 (ja) * | 2024-01-16 | 2025-07-24 | 日本碍子株式会社 | セラミックサセプタ及びその製造方法 |
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-
1996
- 1996-01-19 JP JP02483696A patent/JP3813654B2/ja not_active Expired - Lifetime
- 1996-02-02 US US08/590,026 patent/US6020076A/en not_active Expired - Lifetime
- 1996-02-07 KR KR1019960002909A patent/KR960031402A/ko not_active Ceased
- 1996-02-07 DE DE69609742T patent/DE69609742T2/de not_active Expired - Lifetime
- 1996-02-07 EP EP96300812A patent/EP0726239B1/en not_active Expired - Lifetime
- 1996-02-07 TW TW085101483A patent/TW397808B/zh not_active IP Right Cessation
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|---|---|---|---|---|
| KR20210043586A (ko) * | 2018-08-28 | 2021-04-21 | 미쓰비시 마테리알 가부시키가이샤 | 구리/세라믹스 접합체, 절연 회로 기판, 및 구리/세라믹스 접합체의 제조 방법, 및 절연 회로 기판의 제조 방법 |
| KR20220054461A (ko) * | 2019-12-02 | 2022-05-02 | 미쓰비시 마테리알 가부시키가이샤 | 구리/세라믹스 접합체, 절연 회로 기판, 및 구리/세라믹스 접합체의 제조 방법, 절연 회로 기판의 제조 방법 |
| US11638350B2 (en) | 2019-12-02 | 2023-04-25 | Mitsubishi Materials Corporation | Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69609742T2 (de) | 2001-05-03 |
| EP0726239B1 (en) | 2000-08-16 |
| DE69609742D1 (de) | 2000-09-21 |
| TW397808B (en) | 2000-07-11 |
| JPH08277173A (ja) | 1996-10-22 |
| JP3813654B2 (ja) | 2006-08-23 |
| EP0726239A3 (en) | 1996-11-27 |
| US6020076A (en) | 2000-02-01 |
| EP0726239A2 (en) | 1996-08-14 |
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St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |