KR970000007B1 - Device for transporting and positioning semiconductor wafer-type workpieces - Google Patents

Device for transporting and positioning semiconductor wafer-type workpieces Download PDF

Info

Publication number: KR970000007B1
Authority: KR; South Korea
Prior art keywords: transporting; semiconductor wafer; type workpieces; positioning semiconductor; positioning
Prior art date: 1989-07-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

KR90010491A

Other languages

English (en)

Inventor

Alois Muller

Helmut Seidl

Erich Wimmer

Laszlo Eigner

Original Assignee

Wacker Siltronic Halbleitermat

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-07-14

Filing date

1990-07-11

Publication date

1997-01-04

1990-07-11 Application filed by Wacker Siltronic Halbleitermat filed Critical Wacker Siltronic Halbleitermat

1997-01-04 Application granted granted Critical

1997-01-04 Publication of KR970000007B1 publication Critical patent/KR970000007B1/ko

2010-07-11 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
- H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Fluid Mechanics (AREA)
Mechanical Engineering (AREA)
Cleaning Or Drying Semiconductors (AREA)
Weting (AREA)

KR90010491A 1989-07-14 1990-07-11 Device for transporting and positioning semiconductor wafer-type workpieces Expired - Fee Related KR970000007B1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE3923405A DE3923405A1 (de)	1989-07-14	1989-07-14	Vorrichtung zum transportieren und positionieren von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, und verfahren zur nasschemischen oberflaechenbehandlung derselben

Publications (1)

Publication Number	Publication Date
KR970000007B1 true KR970000007B1 (en)	1997-01-04

Family

ID=6385088

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR90010491A Expired - Fee Related KR970000007B1 (en)	1989-07-14	1990-07-11	Device for transporting and positioning semiconductor wafer-type workpieces

Country Status (5)

Country	Link
US (1)	US5108513A (ko)
EP (1)	EP0408021B1 (ko)
JP (1)	JPH0744165B2 (ko)
KR (1)	KR970000007B1 (ko)
DE (2)	DE3923405A1 (ko)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH073817B2 (ja) *	1990-06-15	1995-01-18	株式会社マトリックス	半導体ウェーハの表面処理装置
EP0747931B1 (en) *	1990-11-16	2000-07-12	Kabushiki Kaisha Watanabe Shoko	Sheet-like base carrying method
DE4100526A1 (de) *	1991-01-10	1992-07-16	Wacker Chemitronic	Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
US5788425A (en) *	1992-07-15	1998-08-04	Imation Corp.	Flexible system for handling articles
US5344365A (en) *	1993-09-14	1994-09-06	Sematech, Inc.	Integrated building and conveying structure for manufacturing under ultraclean conditions
JP3331256B2 (ja) *	1994-05-10	2002-10-07	バイエルコーポレーション	試験片表裏判別手段
US5762084A (en) *	1994-07-15	1998-06-09	Ontrak Systems, Inc.	Megasonic bath
US5745946A (en) *	1994-07-15	1998-05-05	Ontrak Systems, Inc.	Substrate processing system
US5548505A (en) *	1994-07-15	1996-08-20	Oktrak Systems, Inc.	Scrubber control system
DE19628620A1 (de) *	1995-08-08	1998-01-29	Heidelberger Druckmasch Ag	Leiteinrichtung für einen frisch bedruckten Bogen
US5924154A (en) *	1996-08-29	1999-07-20	Ontrak Systems, Inc.	Brush assembly apparatus
DE19901162C2 (de) *	1999-01-14	2002-03-14	Wacker Siltronic Halbleitermat	Vorrichtung und Verfahren zum Reinigen von Halbleiterscheiben
NL1011487C2 (nl)	1999-03-08	2000-09-18	Koninkl Philips Electronics Nv	Werkwijze en inrichting voor het roteren van een wafer.
US6818604B2 (en)	2001-10-04	2004-11-16	Speedfam-Ipec Corporation	System and method for cleaning workpieces
US20030168174A1 (en)	2002-03-08	2003-09-11	Foree Michael Todd	Gas cushion susceptor system
US6883250B1 (en) *	2003-11-04	2005-04-26	Asm America, Inc.	Non-contact cool-down station for wafers
US8229585B2 (en)	2005-09-18	2012-07-24	Flitsch Frederick A	Methods and apparatus for vertically orienting substrate processing tools in a clean space
US7513822B2 (en)	2005-06-18	2009-04-07	Flitsch Frederick A	Method and apparatus for a cleanspace fabricator
US11024527B2 (en)	2005-06-18	2021-06-01	Frederick A. Flitsch	Methods and apparatus for novel fabricators with Cleanspace
US9059227B2 (en)	2005-06-18	2015-06-16	Futrfab, Inc.	Methods and apparatus for vertically orienting substrate processing tools in a clean space
US9159592B2 (en)	2005-06-18	2015-10-13	Futrfab, Inc.	Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US10651063B2 (en)	2005-06-18	2020-05-12	Frederick A. Flitsch	Methods of prototyping and manufacturing with cleanspace fabricators
US9457442B2 (en) *	2005-06-18	2016-10-04	Futrfab, Inc.	Method and apparatus to support process tool modules in a cleanspace fabricator
US10627809B2 (en)	2005-06-18	2020-04-21	Frederick A. Flitsch	Multilevel fabricators
US9339900B2 (en)	2005-08-18	2016-05-17	Futrfab, Inc.	Apparatus to support a cleanspace fabricator
US7467024B2 (en) *	2005-08-26	2008-12-16	Flitsch Frederick A	Method and apparatus for an elevator system for a multilevel cleanspace fabricator
JP4594241B2 (ja)	2006-01-06	2010-12-08	東京エレクトロン株式会社	基板搬送装置、基板搬送方法及びコンピュータプログラム
DE202006018111U1 (de) *	2006-07-25	2007-02-08	Lang, Marcus	Vorrichtung zum beschleunigten nasschemischen Behandeln von Oberflächen
US9355880B2 (en)	2008-06-19	2016-05-31	Rena Gmbh	Method and apparatus for the transporting of objects
KR101588440B1 (ko) *	2008-07-10	2016-01-25	오일레스고교 가부시키가이샤	선회류 형성체 및 비접촉 반송 장치
JP5406852B2 (ja) *	2008-11-18	2014-02-05	オイレス工業株式会社	非接触搬送装置
CN101875036A (zh) *	2009-04-30	2010-11-03	深圳富泰宏精密工业有限公司	转动装置
US8834073B2 (en) *	2010-10-29	2014-09-16	Corning Incorporated	Transport apparatus having a measuring system and methods therefor
EP2648213B1 (en)	2012-04-04	2014-10-22	RENA GmbH	Apparatus and method for the transport on a liquid
US9698042B1 (en)	2016-07-22	2017-07-04	Lam Research Corporation	Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge
JP7437186B2 (ja) *	2020-02-26	2024-02-22	Ｊｓｗアクティナシステム株式会社	浮上搬送装置、及びレーザ処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3215238A (en) *	1963-10-30	1965-11-02	Rca Corp	Orienting articles of manufacture
US3797889A (en) *	1971-12-30	1974-03-19	Texas Instruments Inc	Workpiece alignment system
US3976329A (en) *	1974-09-09	1976-08-24	Texas Instruments Incorporated	Vacuum braking system for semiconductor wafers
US4618292A (en) *	1977-02-28	1986-10-21	International Business Machines Corporation	Controls for semiconductor wafer orientor
US4242038A (en) *	1979-06-29	1980-12-30	International Business Machines Corporation	Wafer orienting apparatus
US4348139A (en) *	1980-04-30	1982-09-07	International Business Machines Corp.	Gas film wafer transportation system
JPS63225028A (ja) *	1987-03-16	1988-09-20	Hitachi Ltd	搬送装置

1989
- 1989-07-14 DE DE3923405A patent/DE3923405A1/de not_active Withdrawn
1990
- 1990-05-03 US US07/518,580 patent/US5108513A/en not_active Expired - Fee Related
- 1990-05-17 JP JP2125602A patent/JPH0744165B2/ja not_active Expired - Lifetime
- 1990-07-11 KR KR90010491A patent/KR970000007B1/ko not_active Expired - Fee Related
- 1990-07-12 DE DE90113307T patent/DE59002987D1/de not_active Expired - Fee Related
- 1990-07-12 EP EP90113307A patent/EP0408021B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0408021B1 (de)	1993-10-06
US5108513A (en)	1992-04-28
DE3923405A1 (de)	1991-01-24
JPH0355836A (ja)	1991-03-11
EP0408021A1 (de)	1991-01-16
JPH0744165B2 (ja)	1995-05-15
DE59002987D1 (de)	1993-11-11

Legal Events

Date	Code	Title	Description
1990-07-11	PA0109	Patent application	St.27 status event code: A-0-1-A10-A12-nap-PA0109
1990-07-11	R17-X000	Change to representative recorded	St.27 status event code: A-3-3-R10-R17-oth-X000
1991-02-26	PG1501	Laying open of application	St.27 status event code: A-1-1-Q10-Q12-nap-PG1501
1993-01-19	A201	Request for examination
1993-01-19	PA0201	Request for examination	St.27 status event code: A-1-2-D10-D11-exm-PA0201
1995-07-12	N231	Notification of change of applicant
1995-07-12	PN2301	Change of applicant	St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301
1995-09-30	E902	Notification of reason for refusal
1995-09-30	PE0902	Notice of grounds for rejection	St.27 status event code: A-1-2-D10-D21-exm-PE0902
1995-11-29	T11-X000	Administrative time limit extension requested	St.27 status event code: U-3-3-T10-T11-oth-X000
1995-12-29	T11-X000	Administrative time limit extension requested	St.27 status event code: U-3-3-T10-T11-oth-X000
1996-01-26	P11-X000	Amendment of application requested	St.27 status event code: A-2-2-P10-P11-nap-X000
1996-01-26	P13-X000	Application amended	St.27 status event code: A-2-2-P10-P13-nap-X000
1996-05-20	E902	Notification of reason for refusal
1996-05-20	PE0902	Notice of grounds for rejection	St.27 status event code: A-1-2-D10-D21-exm-PE0902
1996-07-19	T11-X000	Administrative time limit extension requested	St.27 status event code: U-3-3-T10-T11-oth-X000
1996-08-16	T11-X000	Administrative time limit extension requested	St.27 status event code: U-3-3-T10-T11-oth-X000
1996-09-19	T11-X000	Administrative time limit extension requested	St.27 status event code: U-3-3-T10-T11-oth-X000
1996-11-27	G160	Decision to publish patent application
1997-01-04	PG1605	Publication of application before grant of patent	St.27 status event code: A-2-2-Q10-Q13-nap-PG1605
1997-03-18	E701	Decision to grant or registration of patent right
1997-03-18	PE0701	Decision of registration	St.27 status event code: A-1-2-D10-D22-exm-PE0701
1997-05-12	GRNT	Written decision to grant
1997-05-12	PR0701	Registration of establishment	St.27 status event code: A-2-4-F10-F11-exm-PR0701
1997-05-12	PR1002	Payment of registration fee	St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1
1999-12-30	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4
2000-12-29	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5
2001-12-28	FPAY	Annual fee payment	Payment date: 20011229 Year of fee payment: 6
2001-12-29	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6
2003-01-05	LAPS	Lapse due to unpaid annual fee
2003-01-05	PC1903	Unpaid annual fee	St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20030105 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE
2003-01-17	PN2301	Change of applicant	St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301
2003-10-11	PC1903	Unpaid annual fee	St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20030105
2004-04-01	R17-X000	Change to representative recorded	St.27 status event code: A-5-5-R10-R17-oth-X000
2004-05-21	R18-X000	Changes to party contact information recorded	St.27 status event code: A-5-5-R10-R18-oth-X000
2018-10-18	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000
2021-04-29	R18-X000	Changes to party contact information recorded	St.27 status event code: A-5-5-R10-R18-oth-X000
2026-01-06	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000

Publication	Publication Date	Title
KR970000007B1 (en)	1997-01-04	Device for transporting and positioning semiconductor wafer-type workpieces
KR970010571B1 (en)	1997-06-28	Semiconductor device and its fabrication method
KR960008517B1 (en)	1996-06-26	Semiconductor device and the manufacturing method
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