KR970077248A - 웨이퍼 미끄러짐 방지 장치 - Google Patents

웨이퍼 미끄러짐 방지 장치 Download PDF

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Publication number
KR970077248A
KR970077248A KR1019960017948A KR19960017948A KR970077248A KR 970077248 A KR970077248 A KR 970077248A KR 1019960017948 A KR1019960017948 A KR 1019960017948A KR 19960017948 A KR19960017948 A KR 19960017948A KR 970077248 A KR970077248 A KR 970077248A
Authority
KR
South Korea
Prior art keywords
wafer
pad portion
prevention device
slip prevention
slip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960017948A
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English (en)
Inventor
김창식
유덕수
고웅
박진호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960017948A priority Critical patent/KR970077248A/ko
Publication of KR970077248A publication Critical patent/KR970077248A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼가 놓여지는 웨이퍼 척에 미끄럼 방지 링을 부착하여 웨이퍼가 정해진 위치를 이탈하지 못하도록 하는 웨이퍼 미끄러짐 방지 장치에 관한 것이다.
본 발명의 목적은 웨이퍼 척의 상면부 패드부에서 웨이퍼가 미끄러지지 않도록 웨이퍼 미끄럼 방지 장치를 제공함에 있다.
본 발명의 효과는 건식 식각 공정이 이루어지는 웨이퍼 척에 패드부에 놓여진 웨이퍼의 높이보다 높게 형성된 웨이퍼 미끄러짐 방지 장치를 부착하여 웨이퍼가 웨이퍼 척의 지정된 위치를 벗어남을 방지하는 효과가 있다.

Description

웨이퍼 미끄러짐 방지 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 의한 건식 식각 설비의 웨이퍼 척을 나타낸 분해 사시도.

Claims (4)

  1. 상부면에 웨이퍼가 위치하는 소정 크기의 패드부가 돌출 형성되어 있고, 상기 패드부의 소정 위치에는 복수개의 리프트 핀 삽입공이 관통 형성되어 있으며, 상기 패드부의 중심에 상기 웨이퍼를 흡착하기 위한 진공홀이 형성되어 있는 웨이퍼 척에서, 상기 웨이퍼가 상기 패드부의 지정 위치에서 미끄러지는 것을 방지하기 위해 상기 패드부에 놓여진 웨이퍼의 높이보다 높게 형성된 미끄럼 방지 수단이 상기 패드부를 둘러싸도록 형성되어 있는 것을 특징으로 하는 웨이퍼 미끄러짐 방지 장치.
  2. 제1항에 있어서, 상기 미끄럼 방지 수단은 링 형상인 것을 특징으로 하는 웨이퍼 미끄러짐 방지 장치.
  3. 제1항 또는 제2항에 있어서, 상기 미끄럼 방지 수단의 재질은 석영인 것을 특징으로 하는 웨이퍼 미끄러짐 방지 장치.
  4. 제1항 또는 제2항에 있어서, 상기 미끄럼 방지 수단의 재질은 세라믹인 것을 특징으로하는 웨이퍼 미끄러짐 방지 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960017948A 1996-05-27 1996-05-27 웨이퍼 미끄러짐 방지 장치 Withdrawn KR970077248A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960017948A KR970077248A (ko) 1996-05-27 1996-05-27 웨이퍼 미끄러짐 방지 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960017948A KR970077248A (ko) 1996-05-27 1996-05-27 웨이퍼 미끄러짐 방지 장치

Publications (1)

Publication Number Publication Date
KR970077248A true KR970077248A (ko) 1997-12-12

Family

ID=66220373

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017948A Withdrawn KR970077248A (ko) 1996-05-27 1996-05-27 웨이퍼 미끄러짐 방지 장치

Country Status (1)

Country Link
KR (1) KR970077248A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441711B1 (ko) * 2001-12-21 2004-07-27 동부전자 주식회사 반도체 베이크 오븐의 웨이퍼가이드 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441711B1 (ko) * 2001-12-21 2004-07-27 동부전자 주식회사 반도체 베이크 오븐의 웨이퍼가이드 장치

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