KR970077291A - 연동기능을 구비한 폴리싱 장치 - Google Patents

연동기능을 구비한 폴리싱 장치 Download PDF

Info

Publication number
KR970077291A
KR970077291A KR1019970021476A KR19970021476A KR970077291A KR 970077291 A KR970077291 A KR 970077291A KR 1019970021476 A KR1019970021476 A KR 1019970021476A KR 19970021476 A KR19970021476 A KR 19970021476A KR 970077291 A KR970077291 A KR 970077291A
Authority
KR
South Korea
Prior art keywords
motor
actuator
upper ring
polishing
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019970021476A
Other languages
English (en)
Other versions
KR100429299B1 (ko
Inventor
가쯔히데 와따나베
Original Assignee
마에다 시게루
가부시키가이샤 에바라 세사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마에다 시게루, 가부시키가이샤 에바라 세사쿠쇼 filed Critical 마에다 시게루
Publication of KR970077291A publication Critical patent/KR970077291A/ko
Application granted granted Critical
Publication of KR100429299B1 publication Critical patent/KR100429299B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by monitoring or safety
    • G05B19/4063—Monitoring general control system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/416—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control of velocity, acceleration or deceleration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37434—Measuring vibration of machine or workpiece or tool
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45199—Polish
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50113—Short stroke, retract tool, safe distance from workpiece surface, hover height
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50205—On tool breakage stop machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50276—Detect wear or defect tool, breakage and change tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

본 발명의 폴리싱 장치는 반도체 웨이퍼와 같은 가공물을 평면경 다듬질로 폴리싱 처리하는데 사용된다. 연동기능을 구비한 폴리싱 장치는, 그 상에 폴리싱 표면을 구비한 턴테이블과, 폴리싱 처리할 가공물을 지지하고 턴테이블 상의 폴리싱 표면에 대하여 가공물을 압착하는 상부링과, 턴테이블을 회전시키는 제1모터 및, 상부링을 회전시키는 제2모터를 포함한다. 상기 폴리싱 장치는 상부링을 상승 및 하강시키는 제1작동기와, 상부링을 수평 방향으로 이동시키는 제2작동기 및, 모터 및 작동기를 제어하는 제어유닛을 더욱 포함한다. 제어 유닛은, 모터와 작동기 중 적어도 하나에서 비정상이 검출될 경우에, 비정상이 검출된 것과 다른 모터와 작동기 중 적어도 하나가 소정 동작을 수행하도록 하는 방식으로 모터와 작동기를 제어한다.

Description

연동기능을 구비한 폴리싱 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 연동기능을 구비한 폴리싱 장치를 도시하는 개략도.

Claims (9)

  1. 가공물의 표면을 폴리싱 처리하며 연동기능을 구비한 폴리싱 장치에 있어서, 폴리싱 표면을 위에 구비한 턴테이블과; 폴리싱 처리할 가공물을 지지하고 상기 턴테이블상의 상기 폴리싱 표면에 대하여 가공물을 압착하는 상부링과; 상기 턴테이블을 회전시키는 제1모터와; 상기 상부링을 회전시키는 제2모터와; 상기 상부링을 상승 및 하강시키는 제1작동기와; 상기 상부링을 수평 방향으로 이동시키는 제2작동기 및; 상기 모터 및 상기 작동기를 제어하는 제어유닛을 더욱 포함하고, 상기 제어유닛은, 상기 모터와 상기 작동기 중 적어도 하나에서 비정상이 검출될 경우에, 상기 모터와 상기 작동기 중 상기 비정상이 검출된 상기 적어도 하나와는 다른 적어도 하나를 정상 동작과는 구별되는 소정 동작을 수행하도록 하는 방식으로 상기 모터와 상기 작동기를 제어하는 것을 특징으로 하는 폴리싱 장치.
  2. 제1항에 있어서, 상기 비정상의 검출은, 상기 모터의 토크들 중 적어도 하나와, 상기 모터와 상기 작동기에 의해 작동되는 구성요소들 중 적어도 하나의 진동 및, 사이 구성요소들 중 적어도 하나로부터 발생된 소리를 측정하고, 측정값을 정상상태에서의 값과 비교함으로써 행해지는 것을 특징으로 하는 폴리싱 장치.
  3. 제1항에 있어서, 상기 소정 동작은 상기 상부링을 상승시키는 것과 상기 상부링의 회전을 정지시키는 것을 포함하는 것을 특징으로 하는 폴리싱 장치.
  4. 제3항에 있어서, 상기 소정 동작은 상기 수평방향으로 퇴거 위치로 이동시키는 것을 포함하는 것을 특징으로 하는 폴리싱 장치.
  5. 제2항에 있어서, 상기 진동은 상기 상부링에 부착된 센서에 의해 측정되는 것을 특징으로 하는 폴리싱 장치.
  6. 제2항에 있어서, 상기 소리는 상기 상부링에 근접하여 제공된 센서에 의해 측정되는 것을 특징으로 하는 폴리싱 장치.
  7. 제1항에 있어서, 상기 턴테이블의 상기 폴리싱 표면을 드레싱하는 드레싱공구와; 상기 드레싱공구를 회전시키는 제3모터 및; 상기 드레싱공구를 상승및 하강시키는 제3작동기를 더욱 포함하고, 상기 제어유닛은, 상기 제3모터와 상기 제1모터 중 적어도 하나에서 비정상이 검출될 경우에, 상기 드레싱공구를 상승시키고 상기 드레싱공구의 회전을 정지시키는 방식으로 상기 제3모터와 상기 제3작동기를 제어하는 것을 특징으로 하는 폴리싱 장치.
  8. 가공물의 표면을 폴리싱 처리하며 연동기능을 구비한 폴리싱 장치에 있어서, 폴리싱 표면을 위에 구비한 턴테이블과; 폴리싱 처리할 가공물을 지지하고 상기 턴테이블 상의 상기 폴리싱 표면에 대하여 가공물을 압착하는 상부링과; 상기 턴테이블을 회전시키는 제1모터와;상기 상부링을 회전시키는 제2모터와; 상기 상부링을 상승 및 하강시키는 제1작동기와; 상기 상부링을 수평방향으로 이동시키는 제2작동기와; 상기 모터와 상기 작동기를 제어하는 제어유닛과; 상기 제2모터의 토크를 측정하는 토크검출기 및; 상기 상부링의 진동을 측정하는 진공검출기를 포함하고, 상기 제어유닛은 토크검출기와 진동검출기에 의해 측정된 값들 중 적어도 하나의 비정상 값일 경우에, 상기 상부링을 상승시키고 상기 상부링의 회전을 정지시키는 방식으로 상기 모터와 상기 작동기를 제어하는 것을 특징으로 하는 폴리싱 장치.
  9. 가공물의 표면을 폴리싱 처리하는 방법에 있어서, 상부링에 의해 가공물을 지지하고, 제1모터에 의해 회전되는 턴테이블 상의 폴리싱 표면에 대하여 가공물을 압착하고, 상기 상부링은 제2모터에 의해 회전되고 제1작동기에 의해 상승 및 하강되고 제2작동기에 의해 수평방향으로 이동되는 단계와; 상기 모터와 상기 작동기 중 적어도 하나에서 비정상을 검출하는 단계와; 상기 비정상이 검출된 것 중 상기 적어도 하나와는 다른 상기 모터와 상기 작동기 중 적어도 하나를 정상 동작과는 구별되는 소정 동작을 수행하도록 하는 단계를 포함하는 것을 특징으로 하는 가공물의 표면을 폴리싱 처리하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970021476A 1996-05-30 1997-05-29 연동기능을구비한폴리싱장치 Expired - Lifetime KR100429299B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8-161146 1996-05-30
JP16114696 1996-05-30

Publications (2)

Publication Number Publication Date
KR970077291A true KR970077291A (ko) 1997-12-12
KR100429299B1 KR100429299B1 (ko) 2004-08-09

Family

ID=15729474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970021476A Expired - Lifetime KR100429299B1 (ko) 1996-05-30 1997-05-29 연동기능을구비한폴리싱장치

Country Status (4)

Country Link
US (1) US5904608A (ko)
EP (3) EP1704962B1 (ko)
KR (1) KR100429299B1 (ko)
DE (2) DE69739038D1 (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3705670B2 (ja) 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
JP3761673B2 (ja) 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP3292835B2 (ja) * 1998-05-06 2002-06-17 信越半導体株式会社 薄板ワークの平面研削方法およびその研削装置
JP2956694B1 (ja) * 1998-05-19 1999-10-04 日本電気株式会社 研磨装置及び研磨方法
US6000998A (en) * 1998-05-29 1999-12-14 Seh America, Inc. System for calibrating wafer edge-grinder
JP2000015549A (ja) * 1998-06-30 2000-01-18 Nidek Co Ltd 眼鏡レンズ加工装置
US6783428B1 (en) * 1999-01-18 2004-08-31 Nsk Ltd. Method for forming grooves on workpiece and for dressing a grindstone used in the groove formation
US6361410B1 (en) * 1999-01-18 2002-03-26 Nsk Ltd. Grinding apparatus for forming grooves on a workpiece and a method for dressing a grindstone used in the apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6896583B2 (en) 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
JP4102081B2 (ja) * 2002-02-28 2008-06-18 株式会社荏原製作所 研磨装置及び研磨面の異物検出方法
US6931330B1 (en) * 2003-06-30 2005-08-16 Lam Research Corporation Methods for monitoring and controlling chemical mechanical planarization
DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
DE10361636B4 (de) * 2003-12-30 2009-12-10 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines seismischen Signals eines seismischen Sensors
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US7090560B2 (en) * 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
KR100541821B1 (ko) * 2004-09-09 2006-01-11 삼성전자주식회사 폴리싱장치의 패드컨디셔너 오동작 감지장치 및 그 방법
US7040954B1 (en) 2004-09-28 2006-05-09 Lam Research Corporation Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing
JP2007152499A (ja) * 2005-12-06 2007-06-21 Fujikoshi Mach Corp ワーク研磨方法
JP5191312B2 (ja) * 2008-08-25 2013-05-08 東京エレクトロン株式会社 プローブの研磨方法、プローブ研磨用プログラム及びプローブ装置
JP5454513B2 (ja) 2011-05-27 2014-03-26 信越半導体株式会社 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
JP6008220B2 (ja) * 2012-06-07 2016-10-19 イファ ダイヤモンド インダストリアル カンパニー，リミテッド Ｃｍｐ装置
US9902038B2 (en) 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
CN108803500A (zh) * 2018-06-08 2018-11-13 大连理工大学 一种环抛机的多电机运动控制系统及其控制方法
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3829750A (en) * 1971-02-12 1974-08-13 Bendix Corp Self-adaptive process control
US3813828A (en) * 1973-01-05 1974-06-04 Westinghouse Electric Corp Method for controlling finished thickness of planetary-lapped parts
US4193226A (en) * 1977-09-21 1980-03-18 Kayex Corporation Polishing apparatus
JPS63212465A (ja) * 1987-02-25 1988-09-05 Hoya Corp 研摩方法
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5070655A (en) * 1990-11-30 1991-12-10 Aggarwal Trilok R Machining process monitor
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5222329A (en) * 1992-03-26 1993-06-29 Micron Technology, Inc. Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials
JPH05277929A (ja) * 1992-04-01 1993-10-26 Mitsubishi Materials Corp ポリッシング装置の上軸機構
EP0616362A3 (en) * 1993-03-15 1995-06-21 Tokyo Shibaura Electric Co Process for polishing workpieces and device therefor.
JP3120921B2 (ja) * 1993-03-24 2000-12-25 株式会社村田製作所 ラップ盤の異常検出装置
JP3285663B2 (ja) * 1993-05-11 2002-05-27 ファナック株式会社 工具破損検出装置
JP3119054B2 (ja) * 1993-10-20 2000-12-18 株式会社村田製作所 浮遊砥粒式研磨装置
JPH07112365A (ja) * 1993-10-20 1995-05-02 Murata Mfg Co Ltd 浮遊砥粒式研磨装置
US5653623A (en) * 1993-12-14 1997-08-05 Ebara Corporation Polishing apparatus with improved exhaust
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5439551A (en) * 1994-03-02 1995-08-08 Micron Technology, Inc. Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes

Also Published As

Publication number Publication date
DE69715726D1 (de) 2002-10-31
EP1213094A3 (en) 2003-01-08
EP1213094A9 (en) 2002-08-07
EP1704962A3 (en) 2007-08-01
EP0810064A2 (en) 1997-12-03
KR100429299B1 (ko) 2004-08-09
EP0810064A3 (en) 1998-12-23
US5904608A (en) 1999-05-18
DE69739038D1 (de) 2008-11-20
EP1704962A2 (en) 2006-09-27
DE69715726T2 (de) 2003-08-14
EP0810064B1 (en) 2002-09-25
EP1213094A2 (en) 2002-06-12
EP1704962B1 (en) 2008-10-08

Similar Documents

Publication Publication Date Title
KR970077291A (ko) 연동기능을 구비한 폴리싱 장치
JPH01321162A (ja) 研磨装置
US6042454A (en) System for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisher
US7258595B2 (en) Polishing apparatus
JP5331533B2 (ja) 研磨装置
JP4825374B2 (ja) 研削盤
JP5388133B2 (ja) ばね研削装置及びばね研削方法
JP3510083B2 (ja) 研削装置
KR970000646B1 (ko) 테이프본딩장치
WO2006061910A1 (ja) 竪型両頭平面研削盤における砥石の初期位置設定方法
US20060141907A1 (en) Method for monitoring a CMP polishing method and arrangement for a CMP polishing method
JP4799313B2 (ja) 両面研磨装置および両面研磨装置におけるワークとキャリアとの重なり検知方法
KR100439564B1 (ko) 표면연마방법및장치
JPH0398761A (ja) 研削盤の研削寸法制御方法およびその装置
JPH0227721A (ja) 半導体ウエハの研磨装置
JP5495780B2 (ja) 仕上げロボットの倣い装置および倣い方法
JPH11214343A (ja) 半導体基板のブラシ洗浄装置および洗浄方法
JPH08243917A (ja) 研磨の終点検出方法及び研磨装置並びにそれを用いた半導体装置製造方法
JPH06143133A (ja) 塗膜研磨方法及びその装置
JPH0631575A (ja) 位置決め装置
JPH09155731A (ja) 高平面度研磨装置
JPH0239430A (ja) スライシングマシンの切刃変位検出装置
WO1991012113A1 (en) System for controlling the force applied to a workpiece by a tool element
JP2001085377A (ja) Ｃｍｐ装置
JP2024178498A (ja) 加工装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20130321

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20140319

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20160318

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20170317

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20170530

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000