KR970077292A - 반도체소자 제조용 식각장치 - Google Patents
반도체소자 제조용 식각장치 Download PDFInfo
- Publication number
- KR970077292A KR970077292A KR1019960014232A KR19960014232A KR970077292A KR 970077292 A KR970077292 A KR 970077292A KR 1019960014232 A KR1019960014232 A KR 1019960014232A KR 19960014232 A KR19960014232 A KR 19960014232A KR 970077292 A KR970077292 A KR 970077292A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- carrier
- etching
- etching apparatus
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
Landscapes
- Weting (AREA)
Abstract
Description
Claims (3)
- 화학용액이 하부에서 공급되어 상부로 오버플로우되는 공정조(10)와 이 공정조 내에 웨이퍼(100)를 투입하여 식각 공정을 반도체 웨이퍼의 습식식각장치에 있어서, 상기 공정조(10)내에 웨이퍼가 일정위치에 고정되도록 하는 웨이퍼 지지수단과; 상기 웨이퍼 지지수단에 연결되어 이 지지수단을 수평방향으로 유동시켜 주는 유동수단을 포함하는 것을 특징으로 하는 반도체소자 제조용 식각장치.
- 제1항에 있어서, 상기 웨이퍼 지지수단은 웨이퍼가 적재되는 캐리어(50)가 얹혀져 안착될 수 있도록 평행하게 위치한 한 쌍의 정렬편(61)과, 이 정렬편이 일정위치에 고정되도록 하고 상기 유동수단에 연결되도록 상기 공정조(10) 밖으로 연장된 지지아암(62)으로 구성된 것을 특징으로 하는 반도체소자 제조용 식각장치.
- 제1항에 있어서, 상기 유동수단(70)은 상기 캐리어 지지아암(62)의 일단에 연결되어 캐리어(50)를 소정간격으로 왕복운동되도록 하는 엑추에이터와 모터에 의해 구동되는 왕복부재 중 어느 하나를 사용한 것을 특징으로 하는 반도체소자 제조용 식각장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960014232A KR970077292A (ko) | 1996-05-02 | 1996-05-02 | 반도체소자 제조용 식각장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960014232A KR970077292A (ko) | 1996-05-02 | 1996-05-02 | 반도체소자 제조용 식각장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077292A true KR970077292A (ko) | 1997-12-12 |
Family
ID=66217448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960014232A Abandoned KR970077292A (ko) | 1996-05-02 | 1996-05-02 | 반도체소자 제조용 식각장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077292A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136895A1 (en) * | 2007-05-02 | 2008-11-13 | Lam Research Corporation | Substrate cleaning techniques employing multi-phase solution |
-
1996
- 1996-05-02 KR KR1019960014232A patent/KR970077292A/ko not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136895A1 (en) * | 2007-05-02 | 2008-11-13 | Lam Research Corporation | Substrate cleaning techniques employing multi-phase solution |
| US8388762B2 (en) | 2007-05-02 | 2013-03-05 | Lam Research Corporation | Substrate cleaning technique employing multi-phase solution |
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Legal Events
| Date | Code | Title | Description |
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| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| E902 | Notification of reason for refusal | ||
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| N231 | Notification of change of applicant | ||
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St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| PC1902 | Submission of document of abandonment before decision of registration |
St.27 status event code: N-1-6-B10-B11-nap-PC1902 |
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| SUBM | Surrender of laid-open application requested | ||
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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