KR970077375A - 이물질 제거방법 - Google Patents

이물질 제거방법 Download PDF

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Publication number
KR970077375A
KR970077375A KR1019960014209A KR19960014209A KR970077375A KR 970077375 A KR970077375 A KR 970077375A KR 1019960014209 A KR1019960014209 A KR 1019960014209A KR 19960014209 A KR19960014209 A KR 19960014209A KR 970077375 A KR970077375 A KR 970077375A
Authority
KR
South Korea
Prior art keywords
remove foreign
film
foreign materials
present
pure water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960014209A
Other languages
English (en)
Inventor
최재광
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019960014209A priority Critical patent/KR970077375A/ko
Publication of KR970077375A publication Critical patent/KR970077375A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

본 발명은 웨이퍼 표면에 증착된 공정막에 존재하는 이물질을 순수를 이용하여 제거하는 이물질 제거 방법에 관한 것이다.
본 발명에 따른 이물질 제거방법은 웨이퍼 표면에 형성된 막 표면에 순수를 분사하여 막에 흡착되어 있는 이물질을 분리, 제거하는 것을 특징으로 한다.

Description

이물질 제거방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 비피에스지막 증착장비의 개략적인 구성도.
제2도는 비피에스지막 증착공정이 종료된 후의 웨이퍼 표면을 도시한 부분 상세도.
제3도는 본 발명을 설명하기 위한 웨이퍼 표면의 개략적인 부분 상세도.

Claims (1)

  1. 웨이퍼 표면에 형성된 막 표면에 흡착된 이물질을 제거하는 방법에 있어서, 형성된 막 표면에 순수와 고주파를 함께 분사하여 막에 흡착되어 있는 이물질을 분리, 제거하는 것을 특징으로 하는 이물질 제거방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960014209A 1996-05-02 1996-05-02 이물질 제거방법 Withdrawn KR970077375A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960014209A KR970077375A (ko) 1996-05-02 1996-05-02 이물질 제거방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960014209A KR970077375A (ko) 1996-05-02 1996-05-02 이물질 제거방법

Publications (1)

Publication Number Publication Date
KR970077375A true KR970077375A (ko) 1997-12-12

Family

ID=66217177

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960014209A Withdrawn KR970077375A (ko) 1996-05-02 1996-05-02 이물질 제거방법

Country Status (1)

Country Link
KR (1) KR970077375A (ko)

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

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