LT3057736T - Lazerinio mikroapdirbimo būdas ir įrenginys - Google Patents

Lazerinio mikroapdirbimo būdas ir įrenginys

Info

Publication number
LT3057736T
LT3057736T LTEP14796718.6T LT14796718T LT3057736T LT 3057736 T LT3057736 T LT 3057736T LT 14796718 T LT14796718 T LT 14796718T LT 3057736 T LT3057736 T LT 3057736T
Authority
LT
Lithuania
Prior art keywords
laser micromachining
micromachining
laser
Prior art date
Application number
LTEP14796718.6T
Other languages
English (en)
Inventor
Francois Courvoisier
Pierre-Ambroise Lacourt
Arnaud COUAIRON
Original Assignee
Centre National De La Recherche Scientifique (C.N.R.S.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National De La Recherche Scientifique (C.N.R.S.) filed Critical Centre National De La Recherche Scientifique (C.N.R.S.)
Publication of LT3057736T publication Critical patent/LT3057736T/lt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Lasers (AREA)
LTEP14796718.6T 2013-10-17 2014-10-16 Lazerinio mikroapdirbimo būdas ir įrenginys LT3057736T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1360131A FR3012059B1 (fr) 2013-10-17 2013-10-17 Methode et dispositif de micro-usinage par laser
PCT/EP2014/072255 WO2015055779A1 (fr) 2013-10-17 2014-10-16 Methode et dispositif de micro-usinage par laser

Publications (1)

Publication Number Publication Date
LT3057736T true LT3057736T (lt) 2018-05-10

Family

ID=49713339

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP14796718.6T LT3057736T (lt) 2013-10-17 2014-10-16 Lazerinio mikroapdirbimo būdas ir įrenginys

Country Status (6)

Country Link
US (1) US11059129B2 (lt)
EP (1) EP3057736B1 (lt)
JP (1) JP6512612B2 (lt)
FR (1) FR3012059B1 (lt)
LT (1) LT3057736T (lt)
WO (1) WO2015055779A1 (lt)

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US10648864B2 (en) * 2016-11-01 2020-05-12 Korea Food Research Institute High-resolution terahertz wave concentration module, scattered light detection module, and high-resolution inspection apparatus using terahertz bessel beam
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DE102017116477B4 (de) * 2017-07-21 2021-08-19 Asphericon Gmbh Polarisationswandler mit reflektiver Axikonoptik, Laseroptik, und Verfahren zur Herstellung eines Polarisationswandlers
CN107824959B (zh) * 2017-11-13 2024-02-02 华中科技大学 一种激光打孔方法及系统
US11482826B2 (en) * 2018-01-12 2022-10-25 Ricoh Company, Ltd. Optical processing apparatus, optical processing method, and optically-processed product production method
US11150484B2 (en) 2018-05-18 2021-10-19 Lawrence Livermore National Security, Llc System and method for curved light sheet projection during two-photon polymerization
CN113613825B (zh) * 2019-03-21 2024-11-19 康宁股份有限公司 使用环形涡旋激光束在基于玻璃的物体中形成微孔的系统及方法
EP3990209B1 (en) 2019-07-01 2023-10-04 Corning Incorporated Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
CH716546A1 (fr) * 2019-08-29 2021-03-15 Haute Ecole Arc Dispositif d'usinage laser et procédé de trépanation optique.
DE102020105540A1 (de) * 2019-10-11 2021-04-15 Trumpf Laser- Und Systemtechnik Gmbh Optisches Stanzen von Mikrolöchern in Dünnglas
CN110824716B (zh) * 2019-12-26 2021-09-07 河南科技大学 一种灵活调控自聚焦光束自聚焦焦距的方法
CN111360415B (zh) * 2020-03-20 2021-03-30 吉林大学 一种利用化学处理辅助激光加工制备金刚石涡旋光束发生器的方法及其应用
US11630265B2 (en) 2020-04-15 2023-04-18 Google Llc Glass fiber hole plates for 2D fiber collimators and methods for alignment and fabrication for optical switching applications
WO2021262537A1 (en) * 2020-06-25 2021-12-30 Corning Incorporated Methods for laser processing transparent workpieces using radially variable laser beam focal columns
CN112130439B (zh) * 2020-09-25 2021-07-13 北京理工大学 一种基于飞秒激光制备的可变防伪计算机全息图
CN112317961B (zh) * 2020-10-09 2022-06-24 哈尔滨工业大学 一种超薄水膜辅助脉冲激光微加工装置及其加工方法
CN112388185B (zh) * 2020-11-23 2022-09-30 西安中科微精光子科技股份有限公司 针对非线性形变的激光切割补偿方法、装置及存储介质
JP7584658B2 (ja) * 2021-07-16 2024-11-15 三菱電機株式会社 レーザ加工装置及びレーザ加工方法
DE102022101094A1 (de) * 2022-01-18 2023-07-20 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Laserbohren einer Bohrung in ein Werkstück sowie Laserbohrvorrichtung
CN116551195A (zh) * 2022-01-28 2023-08-08 山东大学 一种飞秒涡旋激光加工装置及方法
CN118151467B (zh) * 2024-04-09 2025-02-11 山东师范大学 一种有聚焦能力的光波导制备方法、光波导及频率转换器
WO2025220344A1 (ja) * 2024-04-18 2025-10-23 住友電工ハードメタル株式会社 可変光ビームシェイパ及びレーザ加工装置

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Also Published As

Publication number Publication date
WO2015055779A1 (fr) 2015-04-23
FR3012059B1 (fr) 2016-01-08
FR3012059A1 (fr) 2015-04-24
EP3057736B1 (fr) 2018-01-10
EP3057736A1 (fr) 2016-08-24
US20160271727A1 (en) 2016-09-22
US11059129B2 (en) 2021-07-13
JP6512612B2 (ja) 2019-05-15
JP2016535675A (ja) 2016-11-17

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