LT3735332T - Tiesioginio lazerio interferencijos struktūrų sudarymo optinis įrenginys - Google Patents
Tiesioginio lazerio interferencijos struktūrų sudarymo optinis įrenginysInfo
- Publication number
- LT3735332T LT3735332T LTEPPCT/EP2018/081895T LTEP2018081895T LT3735332T LT 3735332 T LT3735332 T LT 3735332T LT EP2018081895 T LTEP2018081895 T LT EP2018081895T LT 3735332 T LT3735332 T LT 3735332T
- Authority
- LT
- Lithuania
- Prior art keywords
- optical arrangement
- laser interference
- direct laser
- interference structuring
- structuring
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02057—Optical fibres with cladding with or without a coating comprising gratings
- G02B6/02076—Refractive index modulation gratings, e.g. Bragg gratings
- G02B6/02123—Refractive index modulation gratings, e.g. Bragg gratings characterised by the method of manufacture of the grating
- G02B6/02133—Refractive index modulation gratings, e.g. Bragg gratings characterised by the method of manufacture of the grating using beam interference
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018200036.0A DE102018200036B3 (de) | 2018-01-03 | 2018-01-03 | Optische Anordnung zur direkten Laserinterferenzstrukturierung |
| PCT/EP2018/081895 WO2019134769A1 (de) | 2018-01-03 | 2018-11-20 | Optische anordnung zur direkten laserinterferenzstrukturierung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LT3735332T true LT3735332T (lt) | 2022-02-10 |
Family
ID=64402224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LTEPPCT/EP2018/081895T LT3735332T (lt) | 2018-01-03 | 2018-11-20 | Tiesioginio lazerio interferencijos struktūrų sudarymo optinis įrenginys |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11370061B2 (lt) |
| EP (1) | EP3735332B1 (lt) |
| JP (1) | JP7116174B2 (lt) |
| KR (1) | KR102539160B1 (lt) |
| DE (1) | DE102018200036B3 (lt) |
| ES (1) | ES2904663T3 (lt) |
| LT (1) | LT3735332T (lt) |
| WO (1) | WO2019134769A1 (lt) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018204250B4 (de) * | 2018-03-20 | 2023-10-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Laserstrahlschneiden von Werkstücken |
| DE102018212495B3 (de) | 2018-07-26 | 2019-12-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anordnung zur Erkennung des Vorhandenseins von Pathogenen |
| CN111457843B (zh) * | 2019-04-26 | 2021-07-30 | 上海微电子装备（集团）股份有限公司 | 位移测量装置、位移测量方法及光刻设备 |
| DE102019206179B4 (de) | 2019-04-30 | 2023-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anordnung zur Modifizierung von Oberflächen metallischer Bauteile |
| DE102019208106B3 (de) * | 2019-06-04 | 2020-09-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anordnung zur Überwachung von Laserstrukturierungsprozessen, die an Oberflächen von Bauteilen durchgeführt werden |
| DE102019119790A1 (de) | 2019-07-22 | 2021-01-28 | 4Jet Microtech Gmbh | Laserbearbeitungsvorrichtung |
| DE102020205849B4 (de) | 2020-05-08 | 2026-04-02 | DLIP UG (haftungsbeschränkt) | Anordnung optischer Elemente für die Ausbildung von Strukturmustern |
| DE112021006991A5 (de) | 2021-02-05 | 2023-11-30 | HS Kontec GmbH | Hochstromkondensator |
| DE102021201655A1 (de) | 2021-02-22 | 2022-08-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Bauelement mit einer Oberfläche, die von einem Partikel enthaltenden Gasstrom angeströmt oder umströmt und mit der ein Anhaften von Partikeln verhindert oder reduziert wird sowie ein Herstellungsverfahren |
| CN112846546B (zh) * | 2021-03-10 | 2022-04-26 | 武汉华工激光工程有限责任公司 | 一种激光切割系统 |
| EP4367558B1 (de) * | 2021-07-03 | 2025-10-29 | Fusion Bionic GmbH | Vorrichtung und verfahren zur laserinterferenzstrukturierung von substraten mit periodischen punktstrukturen für antireflexionseigenschaften |
| CN113654656B (zh) * | 2021-10-18 | 2022-02-11 | 之江实验室 | 一种基于三光束干涉的光束漂移检测装置与方法 |
| EP4438221A4 (en) * | 2021-11-24 | 2025-10-15 | Nikon Corp | TREATMENT DEVICE AND TREATMENT METHOD |
| DE102022100262A1 (de) | 2022-01-07 | 2023-07-13 | Gebr. Heller Maschinenfabrik Gmbh | Beschichtungsverfahren und beschichtetes Bauteil |
| JP7882316B2 (ja) * | 2022-05-11 | 2026-06-30 | 株式会社ニコン | 加工光学系、加工装置及び加工方法 |
| DE102023102170A1 (de) | 2023-01-30 | 2024-08-01 | Trumpf Laser Gmbh | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks |
| WO2024160647A1 (de) | 2023-01-30 | 2024-08-08 | Trumpf Laser Gmbh | Vorrichtung und verfahren zum bearbeiten eines werkstücks |
| DE102023201553A1 (de) | 2023-02-22 | 2024-08-22 | 3D-Micromac Ag | Verfahren und System zur Herstellung mikroelektronischer Komponenten mit Schichtaufbau |
| DE102024113460A1 (de) | 2024-05-14 | 2025-11-20 | 3D-Micromac Ag | Verfahren zur Herstellung einer mikrostrukturierten Komponente mit Schichtaufbau |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE1548703B2 (de) * | 1966-07-16 | 1971-04-15 | Ernst Leitz Gmbh, 6330 Wetzlar | Fotoelektrischer schrittgeber fuer vierphasen signale |
| US3488104A (en) * | 1966-09-12 | 1970-01-06 | Fairchild Camera Instr Co | Dual focal plane microscope |
| CH471368A (de) * | 1968-01-25 | 1969-04-15 | Bbc Brown Boveri & Cie | Verfahren und Einrichtung zur interferometrischen Messung von mehreren Längen mit monochromatischen Lichtbündeln |
| JP2002196502A (ja) | 1991-03-22 | 2002-07-12 | Hitachi Ltd | 露光方法 |
| EP0668519A1 (en) * | 1994-02-18 | 1995-08-23 | AT&T Corp. | Spatially-varying distributed bragg-reflectors in optical media |
| US6549309B1 (en) | 1998-02-10 | 2003-04-15 | Illinois Tool Works Inc. | Holography apparatus, method and product |
| JP3201375B2 (ja) | 1999-02-22 | 2001-08-20 | 日本電気株式会社 | 基板表面粗化方法および基板表面粗化装置ならびに印刷配線板の製造方法および印刷配線板の製造装置 |
| US6853772B2 (en) | 2003-05-13 | 2005-02-08 | 3M Innovative Properties Company | Fiber grating writing interferometer with continuous wavelength tuning and chirp capability |
| WO2007020738A1 (ja) | 2005-08-16 | 2007-02-22 | Tokyo Seimitsu Co., Ltd. | レーザ測長器 |
| JP2007110064A (ja) * | 2005-09-14 | 2007-04-26 | Ishikawajima Harima Heavy Ind Co Ltd | レーザアニール方法及び装置 |
| US20080083886A1 (en) * | 2006-09-14 | 2008-04-10 | 3M Innovative Properties Company | Optical system suitable for processing multiphoton curable photoreactive compositions |
| DE102007033124B4 (de) * | 2007-07-16 | 2012-12-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur optischen Detektion von Substanzen in einem flüssigen oder gasförmigen Medium |
| DE102008011527B4 (de) * | 2008-02-28 | 2015-05-21 | Leica Instruments (Singapore) Pte. Ltd. | Beleuchtungseinrichtung für ein Mikroskop |
| DE102009057566A1 (de) * | 2009-12-09 | 2011-06-16 | Osram Opto Semiconductors Gmbh | Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren |
| US8405836B2 (en) * | 2010-03-19 | 2013-03-26 | Interfiber Analysis, LLC | System and method for measuring an optical fiber |
| US9164397B2 (en) * | 2010-08-03 | 2015-10-20 | Kla-Tencor Corporation | Optics symmetrization for metrology |
| LT5833B (lt) * | 2010-09-16 | 2012-05-25 | Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras | Būdas periodinėms struktūroms ploname medžiagos sluoksnyje formuoti interferuojančiais lazerio pluoštais |
| DE102011011734B4 (de) | 2011-02-10 | 2014-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung, Anordnung und Verfahren zur Interferenzstrukturierung von flächigen Proben |
| DE202011110732U1 (de) | 2011-05-10 | 2015-12-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Optische Anordnung zur Laserinterferenzstrukturierung einer Probe mit Strahlführung gleicher Weglänge |
| US9793673B2 (en) * | 2011-06-13 | 2017-10-17 | Kla-Tencor Corporation | Semiconductor inspection and metrology system using laser pulse multiplier |
| DE102011119764B4 (de) | 2011-11-24 | 2015-04-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur Interferenzstrukturierung von flächigen Proben und deren Verwendung |
| DE102012011343B4 (de) | 2012-06-11 | 2017-05-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur Interferenzstrukturierung von Proben |
| US8546762B1 (en) * | 2012-06-29 | 2013-10-01 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method and arrangement for carrying out time-domain measurements |
| DE102012217655B4 (de) * | 2012-09-27 | 2014-05-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Bestimmen der relativen Zeitlage elektromagnetischer Pulse und Bestimmungsvorrichtung |
| CN103091772B (zh) * | 2013-01-21 | 2014-11-05 | 清华大学 | 制作任意反射波长超长光纤光栅的方法及装置 |
| KR102302777B1 (ko) * | 2014-08-05 | 2021-09-15 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 |
-
2018
- 2018-01-03 DE DE102018200036.0A patent/DE102018200036B3/de not_active Expired - Fee Related
- 2018-11-20 KR KR1020207019957A patent/KR102539160B1/ko active Active
- 2018-11-20 JP JP2020537017A patent/JP7116174B2/ja active Active
- 2018-11-20 LT LTEPPCT/EP2018/081895T patent/LT3735332T/lt unknown
- 2018-11-20 ES ES18807073T patent/ES2904663T3/es active Active
- 2018-11-20 EP EP18807073.4A patent/EP3735332B1/de active Active
- 2018-11-20 US US16/954,666 patent/US11370061B2/en active Active
- 2018-11-20 WO PCT/EP2018/081895 patent/WO2019134769A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR102539160B1 (ko) | 2023-06-01 |
| KR20200127976A (ko) | 2020-11-11 |
| WO2019134769A1 (de) | 2019-07-11 |
| EP3735332B1 (de) | 2021-11-10 |
| JP7116174B2 (ja) | 2022-08-09 |
| EP3735332A1 (de) | 2020-11-11 |
| ES2904663T3 (es) | 2022-04-05 |
| US20200306879A1 (en) | 2020-10-01 |
| DE102018200036B3 (de) | 2019-01-17 |
| US11370061B2 (en) | 2022-06-28 |
| JP2021509864A (ja) | 2021-04-08 |
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