LT5997B - Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas - Google Patents

Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas Download PDF

Info

Publication number: LT5997B
Authority: LT; Lithuania
Prior art keywords: solution; etching; plastic; plastics; chlorate
Prior art date: 2012-06-05

Application number

LT2012042A

Other languages

English (en)

Lithuanian (lt)

Other versions

LT2012042A (lt

Inventor

Leonas NARUŠKEVIČIUS

Ona GYLIENĖ

TAMAŠIŪNAITĖ Loreta TAMAŠAUSKAITĖ

Original Assignee

Atotech Deutschland Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-06-05

Filing date

2012-06-05

Publication date

2014-02-25

2012-06-05 Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh

2012-06-05 Priority to LT2012042A priority Critical patent/LT5997B/lt

2013-06-05 Priority to PT137275954T priority patent/PT2855731E/pt

2013-06-05 Priority to JP2015515506A priority patent/JP6180518B2/ja

2013-06-05 Priority to BR112014029353-8A priority patent/BR112014029353B1/pt

2013-06-05 Priority to CA2875323A priority patent/CA2875323C/en

2013-06-05 Priority to US14/399,987 priority patent/US20150129540A1/en

2013-06-05 Priority to EP13727595.4A priority patent/EP2855731B1/en

2013-06-05 Priority to ES13727595.4T priority patent/ES2575001T3/es

2013-06-05 Priority to PL13727595.4T priority patent/PL2855731T3/pl

2013-06-05 Priority to KR1020147034195A priority patent/KR102130947B1/ko

2013-06-05 Priority to PCT/EP2013/061568 priority patent/WO2013182590A1/en

2013-06-05 Priority to CN201380029727.6A priority patent/CN104364421B/zh

2013-12-27 Publication of LT2012042A publication Critical patent/LT2012042A/lt

2014-02-25 Publication of LT5997B publication Critical patent/LT5997B/lt

Links

239000004033 plastic Substances 0.000 title claims abstract description 46
229920003023 plastic Polymers 0.000 title claims abstract description 46
239000000126 substance Substances 0.000 title claims abstract description 24
238000001465 metallisation Methods 0.000 title claims abstract description 15
238000000034 method Methods 0.000 title claims abstract description 9
239000000243 solution Substances 0.000 claims abstract description 76
238000005530 etching Methods 0.000 claims abstract description 40
XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims abstract description 21
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 21
230000004913 activation Effects 0.000 claims abstract description 15
239000007800 oxidant agent Substances 0.000 claims abstract description 9
230000001590 oxidative effect Effects 0.000 claims abstract description 7
150000002941 palladium compounds Chemical class 0.000 claims abstract description 7
150000002940 palladium Chemical class 0.000 claims abstract description 5
239000012266 salt solution Substances 0.000 claims abstract description 4
150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 3
150000007522 mineralic acids Chemical class 0.000 claims abstract description 3
230000003213 activating effect Effects 0.000 claims abstract 2
229940005989 chlorate ion Drugs 0.000 claims abstract 2
230000003647 oxidation Effects 0.000 claims abstract 2
238000007254 oxidation reaction Methods 0.000 claims abstract 2
238000000576 coating method Methods 0.000 abstract description 13
229910052751 metal Inorganic materials 0.000 abstract description 10
239000002184 metal Substances 0.000 abstract description 10
238000002360 preparation method Methods 0.000 abstract description 7
230000000711 cancerogenic effect Effects 0.000 abstract description 2
231100000315 carcinogenic Toxicity 0.000 abstract description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
239000004417 polycarbonate Substances 0.000 description 12
229920001944 Plastisol Polymers 0.000 description 11
239000004999 plastisol Substances 0.000 description 11
239000011248 coating agent Substances 0.000 description 10
229910052759 nickel Inorganic materials 0.000 description 9
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
238000009413 insulation Methods 0.000 description 7
NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
239000000725 suspension Substances 0.000 description 6
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 5
239000000203 mixture Substances 0.000 description 4
VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 4
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
239000002253 acid Substances 0.000 description 3
229910052763 palladium Inorganic materials 0.000 description 3
235000011007 phosphoric acid Nutrition 0.000 description 3
239000012286 potassium permanganate Substances 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
230000001133 acceleration Effects 0.000 description 2
229910000147 aluminium phosphate Inorganic materials 0.000 description 2
238000005234 chemical deposition Methods 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
150000001875 compounds Chemical class 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
229920001577 copolymer Polymers 0.000 description 2
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
238000007747 plating Methods 0.000 description 2
239000000047 product Substances 0.000 description 2
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
206010007269 Carcinogenicity Diseases 0.000 description 1
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
101150003085 Pdcl gene Proteins 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
238000013459 approach Methods 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
231100000260 carcinogenicity Toxicity 0.000 description 1
230000007670 carcinogenicity Effects 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
238000009388 chemical precipitation Methods 0.000 description 1
239000007795 chemical reaction product Substances 0.000 description 1
239000003638 chemical reducing agent Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
-1 chlorate ions Chemical class 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 1
238000012937 correction Methods 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
239000008367 deionised water Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
239000010410 layer Substances 0.000 description 1
238000006386 neutralization reaction Methods 0.000 description 1
239000002245 particle Substances 0.000 description 1
ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
239000002574 poison Substances 0.000 description 1
231100000614 poison Toxicity 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000001103 potassium chloride Substances 0.000 description 1
235000011164 potassium chloride Nutrition 0.000 description 1
125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Inorganic materials [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
239000011780 sodium chloride Substances 0.000 description 1
229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 1
229910001488 sodium perchlorate Inorganic materials 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
239000011550 stock solution Substances 0.000 description 1
239000002344 surface layer Substances 0.000 description 1
238000012360 testing method Methods 0.000 description 1
230000008719 thickening Effects 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Electroplating Methods And Accessories (AREA)

LT2012042A 2012-06-05 2012-06-05 Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas LT5997B (lt)

Priority Applications (12)

Application Number	Priority Date	Filing Date	Title
LT2012042A LT5997B (lt)	2012-06-05	2012-06-05	Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
PT137275954T PT2855731E (pt)	2012-06-05	2013-06-05	Processo para a metalização de superfícies plásticas não condutoras
JP2015515506A JP6180518B2 (ja)	2012-06-05	2013-06-05	非導電性プラスチック表面を金属化するための方法
BR112014029353-8A BR112014029353B1 (pt)	2012-06-05	2013-06-05	processo para metalizar superfícies plásticas não condutoras
CA2875323A CA2875323C (en)	2012-06-05	2013-06-05	Process for metallizing nonconductive plastic surfaces
US14/399,987 US20150129540A1 (en)	2012-06-05	2013-06-05	Process for metallizing nonconductive plastic surfaces
EP13727595.4A EP2855731B1 (en)	2012-06-05	2013-06-05	Process for metallizing nonconductive plastic surfaces
ES13727595.4T ES2575001T3 (es)	2012-06-05	2013-06-05	Procedimiento para metalizar superficies plásticas no conductoras
PL13727595.4T PL2855731T3 (pl)	2012-06-05	2013-06-05	Proces metalizacji nieprzewodzących powierzchni z tworzywa sztucznego
KR1020147034195A KR102130947B1 (ko)	2012-06-05	2013-06-05	비전도성 플라스틱 표면의 금속화 방법
PCT/EP2013/061568 WO2013182590A1 (en)	2012-06-05	2013-06-05	Process for metallizing nonconductive plastic surfaces
CN201380029727.6A CN104364421B (zh)	2012-06-05	2013-06-05	使非导电塑料表面金属化的方法

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LT2012042A LT5997B (lt)	2012-06-05	2012-06-05	Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas

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LT2012042A LT2012042A (lt)	2013-12-27
LT5997B true LT5997B (lt)	2014-02-25

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US (1)	US20150129540A1 (es)
EP (1)	EP2855731B1 (es)
JP (1)	JP6180518B2 (es)
KR (1)	KR102130947B1 (es)
CN (1)	CN104364421B (es)
BR (1)	BR112014029353B1 (es)
CA (1)	CA2875323C (es)
ES (1)	ES2575001T3 (es)
LT (1)	LT5997B (es)
PL (1)	PL2855731T3 (es)
PT (1)	PT2855731E (es)
WO (1)	WO2013182590A1 (es)

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US10920321B2 (en)	2014-05-30	2021-02-16	Uab Rekin International	Chrome-free adhesion pre-treatment for plastics
US9506150B2 (en)	2014-10-13	2016-11-29	Rohm And Haas Electronic Materials Llc	Metallization inhibitors for plastisol coated plating tools
EP3181726A1 (en)	2015-12-18	2017-06-21	ATOTECH Deutschland GmbH	Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces
WO2018220946A1 (ja) *	2017-06-01	2018-12-06	株式会社Ｊｃｕ	樹脂表面の多段エッチング方法およびこれを利用した樹脂へのめっき方法
FR3074808B1 (fr)	2017-12-13	2020-05-29	Maxence RENAUD	Outillage de galvanoplastie
CN108624907A (zh) *	2018-04-26	2018-10-09	复旦大学	非金属基体高效催化电极及其制备方法

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2012
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2013
- 2013-06-05 PT PT137275954T patent/PT2855731E/pt unknown
- 2013-06-05 BR BR112014029353-8A patent/BR112014029353B1/pt not_active IP Right Cessation
- 2013-06-05 CA CA2875323A patent/CA2875323C/en active Active
- 2013-06-05 WO PCT/EP2013/061568 patent/WO2013182590A1/en not_active Ceased
- 2013-06-05 KR KR1020147034195A patent/KR102130947B1/ko not_active Expired - Fee Related
- 2013-06-05 JP JP2015515506A patent/JP6180518B2/ja not_active Expired - Fee Related
- 2013-06-05 CN CN201380029727.6A patent/CN104364421B/zh not_active Expired - Fee Related
- 2013-06-05 US US14/399,987 patent/US20150129540A1/en not_active Abandoned
- 2013-06-05 PL PL13727595.4T patent/PL2855731T3/pl unknown
- 2013-06-05 ES ES13727595.4T patent/ES2575001T3/es active Active
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Also Published As

Publication number	Publication date
PL2855731T3 (pl)	2016-09-30
EP2855731B1 (en)	2016-03-23
JP2015518924A (ja)	2015-07-06
BR112014029353A2 (pt)	2017-06-27
US20150129540A1 (en)	2015-05-14
PT2855731E (pt)	2016-06-15
KR20150024327A (ko)	2015-03-06
JP6180518B2 (ja)	2017-08-16
CA2875323C (en)	2020-08-25
CA2875323A1 (en)	2013-12-12
CN104364421B (zh)	2017-07-21
CN104364421A (zh)	2015-02-18
ES2575001T3 (es)	2016-06-23
BR112014029353B1 (pt)	2021-04-20
LT2012042A (lt)	2013-12-27
WO2013182590A1 (en)	2013-12-12
EP2855731A1 (en)	2015-04-08
KR102130947B1 (ko)	2020-07-08

Legal Events

Date	Code	Title	Description
2013-12-27	BB1A	Patent application published	Effective date: 20131227
2014-02-25	FG9A	Patent granted	Effective date: 20140225
2024-12-27	MM9A	Lapsed patents	Effective date: 20240605

Publication	Publication Date	Title
LT5997B (lt)	2014-02-25	Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
US9657226B2 (en)	2017-05-23	Composition for etching treatment of resin material
TWI677600B (zh)	2019-11-21	用於電解鈍化最外側鉻或最外側鉻合金層以增加其抗腐蝕性之方法
KR102422608B1 (ko)	2022-07-18	크롬 마감 표면의 처리 방법
EP1785507B1 (en)	2009-10-14	Method for etching non-conductive substrate surfaces
KR20060049441A (ko)	2006-05-19	플라스틱 표면의 금속화 방법
KR20150118173A (ko)	2015-10-21	비전도성 폴리머상에 제 1 금속 층을 퇴적시키는 방법
CA2893664C (en)	2016-03-15	Process for metallizing nonconductive plastic surfaces
EP3323910B1 (en)	2018-11-14	Chromium-free plating-on-plastic etch
EP3181726A1 (en)	2017-06-21	Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces
EP4484609A1 (en)	2025-01-01	Metal member, metal-resin composite body, and method for producing metal member
US10526709B2 (en)	2020-01-07	Pretreatment of plastic surfaces for metallization to improve adhesion