MD940200A - Soluţie regenerată electrolitic pentru decaparea plăcilor cu cablaj imprimat - Google Patents
Soluţie regenerată electrolitic pentru decaparea plăcilor cu cablaj imprimatInfo
- Publication number
- MD940200A MD940200A MD94-0200A MD940200A MD940200A MD 940200 A MD940200 A MD 940200A MD 940200 A MD940200 A MD 940200A MD 940200 A MD940200 A MD 940200A
- Authority
- MD
- Moldova
- Prior art keywords
- etching
- printed circuit
- circuit boards
- regenerated solution
- vanadium
- Prior art date
Links
- 238000005530 etching Methods 0.000 title abstract 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 abstract 2
- 229910052720 vanadium Inorganic materials 0.000 abstract 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 235000019270 ammonium chloride Nutrition 0.000 abstract 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 abstract 1
- 239000001166 ammonium sulphate Substances 0.000 abstract 1
- 235000011130 ammonium sulphate Nutrition 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 150000003682 vanadium compounds Chemical class 0.000 abstract 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Se propune o soluţie regenerată electrolitic pentru decaparea plăcilor cu cablaj imprimat şi detalii modelate din cupru şi aliaje de cupru, cu conţinut de tetraminsulfat de cupru, amoniac, sulfat de amoniu, clorură de amoniu, în caz de necesitate - nitrat de amoniu, precum şi catalizator, care majorează viteza de decapare.Conform invenţiei o astfel de compoziţie pentru decapare diferă prin conţinutul vanadiului sau compuşilor vanadiului în calitate de catalizator în cantitate de la 1 mg până la 99 mg/l de soluţie pentru decapare, recalculate pentru vanadiu.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0143390A AT395177B (de) | 1990-07-05 | 1990-07-05 | Aetzloesung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MD940200A true MD940200A (ro) | 1996-01-31 |
Family
ID=62142642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MD94-0200A MD940200A (ro) | 1990-07-05 | 1994-07-12 | Soluţie regenerată electrolitic pentru decaparea plăcilor cu cablaj imprimat |
Country Status (1)
| Country | Link |
|---|---|
| MD (1) | MD940200A (ro) |
-
1994
- 1994-07-12 MD MD94-0200A patent/MD940200A/ro unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY101567A (en) | Low toxicity corrosion resistant solder. | |
| EP0877831A4 (ro) | ||
| KR960705078A (ko) | 구리 부식제 용액 첨가제(Copper etchant solution additives) | |
| KR930004195A (ko) | 수성 과산화산 또는 과산화 염으로부터 금속을 제거하는 방법 | |
| KR900014641A (ko) | 동 및 동합금의 표면처리제 | |
| JPS5350246A (en) | Rubber composition having good adhesion to metal | |
| DE3165416D1 (en) | Amorphous metal alloys having enhanced ac magnetic properties | |
| HUT64109A (en) | Electrolytically regenerable etching solutioin for etching copper and copper alloys | |
| AU571392B2 (en) | Aqueous flux for hot dip metallizing process | |
| MD940200A (ro) | Soluţie regenerată electrolitic pentru decaparea plăcilor cu cablaj imprimat | |
| KR850008505A (ko) | 과산화수소 및 금속이온을 함유하는 안정화된 산성 수용액 조성물 | |
| GB2194961B (en) | A copper-based metal alloy of improved type, particularly for the construction of electronic components | |
| CA2074276A1 (en) | Agent for the treatment of cast iron melts | |
| ES8601323A1 (es) | Procedimiento para la fabricacion de aleaciones de ferrosilicio o de silicio, que contienen estroncio | |
| TW361059B (en) | Peeling liquid for tin and tin alloy | |
| KR910003127A (ko) | 납 금은 지금으로부터 탈륨을 제거시키는 방법 | |
| JPS5738313A (en) | Purifying method for phosphoric acid solution | |
| KONSTANTOUROS et al. | Aqueous ammoniacal etching solution for etching copper and copper alloys(galvanized printed wiring boards) | |
| JPS52143998A (en) | Production of iron chloride solution | |
| Yang et al. | Effects of Trace Elements on the Limiting Temperature for G--P Zone Formation in Aluminum--Zinc--Magnesium Alloys | |
| KR860004168A (ko) | 훼로 망간 슬랙으로부터 전해 금속 망간의 제조방법 | |
| SU1144399A1 (ru) | Сплав на основе свинца | |
| ATE80154T1 (de) | Verfahren zur verringerung des kupfersalzgehalts in oxamid. | |
| KR970070237A (ko) | 동 합금 및 철-니켈 합금 소재의 팔라듐- 주석 합금 도금 조성물 및 도금 방법 | |
| JPS6452083A (en) | Electroless gold plating solution |