MX147809A - Mejoras a paquete semiconductor sellado hermeticamente con una camara de refuerzo y sellamiento - Google Patents

Mejoras a paquete semiconductor sellado hermeticamente con una camara de refuerzo y sellamiento

Info

Publication number
MX147809A
MX147809A MX180195A MX18019579A MX147809A MX 147809 A MX147809 A MX 147809A MX 180195 A MX180195 A MX 180195A MX 18019579 A MX18019579 A MX 18019579A MX 147809 A MX147809 A MX 147809A
Authority
MX
Mexico
Prior art keywords
reinforcement
camera
sealing
semiconductor package
hermetically sealed
Prior art date
Application number
MX180195A
Other languages
English (en)
Inventor
Julie Yung Fichot
Alfred Roesch
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of MX147809A publication Critical patent/MX147809A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/624—Strap connectors having multiple distinct cores
MX180195A 1978-11-27 1979-11-26 Mejoras a paquete semiconductor sellado hermeticamente con una camara de refuerzo y sellamiento MX147809A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/963,807 US4249034A (en) 1978-11-27 1978-11-27 Semiconductor package having strengthening and sealing upper chamber

Publications (1)

Publication Number Publication Date
MX147809A true MX147809A (es) 1983-01-13

Family

ID=25507743

Family Applications (1)

Application Number Title Priority Date Filing Date
MX180195A MX147809A (es) 1978-11-27 1979-11-26 Mejoras a paquete semiconductor sellado hermeticamente con una camara de refuerzo y sellamiento

Country Status (7)

Country Link
US (1) US4249034A (es)
JP (1) JPS5595344A (es)
DE (1) DE2945972C2 (es)
FR (1) FR2442508B1 (es)
GB (1) GB2039144B (es)
IE (1) IE48638B1 (es)
MX (1) MX147809A (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349831A (en) * 1979-09-04 1982-09-14 General Electric Company Semiconductor device having glass and metal package
JPS5746662A (en) * 1980-09-04 1982-03-17 Toshiba Corp Semiconductor rectifier
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
FR2503526A1 (fr) * 1981-04-03 1982-10-08 Silicium Semiconducteur Ssc Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.
DE3127456A1 (de) * 1981-07-11 1983-02-03 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichteranordnung
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
DE3228457A1 (de) * 1982-07-30 1984-02-02 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches bauelement
US4721543A (en) * 1982-09-30 1988-01-26 Burr-Brown Corporation Hermetic sealing device
US4568962A (en) * 1982-11-08 1986-02-04 Motorola, Inc. Plastic encapsulated semiconductor power device means and method
DE3241509A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
GB8410847D0 (en) * 1984-04-27 1984-06-06 Westinghouse Brake & Signal Semiconductor housings
GB8625472D0 (en) * 1986-10-24 1986-11-26 Bicc Plc Circuit board installation
US5105262A (en) * 1988-09-19 1992-04-14 Ford Motor Company Thick film circuit housing assembly design
GB2249869B (en) * 1990-09-17 1994-10-12 Fuji Electric Co Ltd Semiconductor device
US5097319A (en) * 1991-03-21 1992-03-17 Harris Corporation Cover with through terminals for a hermetically sealed electronic package
CA2106981A1 (en) * 1992-01-27 1993-07-28 Victor Albert Keith Temple Semiconductor devices and methods of mass production thereof
JP3092307B2 (ja) * 1992-04-16 2000-09-25 富士電機株式会社 半導体圧力センサ
US5699152A (en) * 1995-04-03 1997-12-16 Alltrista Corporation Electro-optical inspection system and method
AU6761996A (en) * 1995-07-20 1997-02-18 Dallas Semiconductor Corporation Method and apparatus for encryption key creation
DE19534607C2 (de) * 1995-09-18 2002-02-07 Eupec Gmbh & Co Kg Gehäuse mit Leistungs-Halbleiterbauelementen
US6554774B1 (en) * 2000-03-23 2003-04-29 Tensys Medical, Inc. Method and apparatus for assessing hemodynamic properties within the circulatory system of a living subject
US6991969B2 (en) * 2003-02-19 2006-01-31 Octavian Scientific, Inc. Methods and apparatus for addition of electrical conductors to previously fabricated device
DE102004040596A1 (de) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Elektrische Vorrichtung mit einem Gehäuse und einem Kühlkörper
US8536062B2 (en) * 2007-09-21 2013-09-17 Advanced Inquiry Systems, Inc. Chemical removal of oxide layer from chip pads
US20100066395A1 (en) 2008-03-13 2010-03-18 Johnson Morgan T Wafer Prober Integrated With Full-Wafer Contacter
JP5767932B2 (ja) * 2011-09-30 2015-08-26 新電元工業株式会社 半導体装置
DE102016209577A1 (de) * 2016-06-01 2017-12-07 Siemens Aktiengesellschaft Leistungsmodul

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3217213A (en) * 1961-06-02 1965-11-09 Slater Electric Inc Semiconductor diode construction with heat dissipating housing
CH397058A (de) * 1962-01-10 1965-08-15 Bbc Brown Boveri & Cie Anordnung für das Anschliessen der Steuerelektrode bei einem steuerbaren Halbleiter-Gleichrichter
BE629939A (es) * 1962-03-24
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3268309A (en) * 1964-03-30 1966-08-23 Gen Electric Semiconductor contact means
FR1471889A (fr) * 1965-03-22 1967-03-03 Gen Electric Perfectionnements aux dispositifs semiconducteurs
DE1564567C3 (de) * 1966-04-16 1975-03-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung
DE1564749A1 (de) * 1966-10-27 1970-01-08 Semikron Gleichrichterbau Halbleiteranordnung
DE1639402B2 (de) * 1968-02-08 1976-12-16 Siemens AG, 1000 Berlin und 8000 München Steuerbares halbleiterbauelement
DE1935227A1 (de) * 1969-07-11 1971-01-14 Siemens Ag Halbleiterbauelement
DE2042333A1 (de) * 1970-08-26 1972-03-02 Siemens Ag Verfahren zum gasdichten Verschließen von Halbleiterbauelementen
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US3904939A (en) * 1974-02-11 1975-09-09 Gen Electric Capacitor case seal and venting means
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung
DE2624226A1 (de) * 1976-05-29 1977-12-15 Semikron Gleichrichterbau Halbleitergleichrichteranordnung

Also Published As

Publication number Publication date
US4249034A (en) 1981-02-03
GB2039144A (en) 1980-07-30
JPS617025B2 (es) 1986-03-03
GB2039144B (en) 1983-06-15
IE48638B1 (en) 1985-04-03
IE792037L (en) 1980-05-27
DE2945972C2 (de) 1986-09-11
JPS5595344A (en) 1980-07-19
FR2442508A1 (fr) 1980-06-20
FR2442508B1 (fr) 1986-02-28
DE2945972A1 (de) 1980-06-04

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