Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/06—Solder feeding devices; Solder melting pans
  • B23K3/0607—Solder feeding devices
  • B23K3/063—Solder feeding devices for wire feeding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/40—Leadframes
  • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=25457774

Family Applications (1)

Country Status (2)

Families Citing this family (3)

Family Cites Families (3)

• 1978
  • 1978-07-31 US US05/929,384 patent/US4212265A/en not_active Expired - Lifetime
• 1979
  • 1979-03-20 MX MX177011A patent/MX149085A/es unknown

Also Published As

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