MX2014005116A - Adhesivo estructural y aplicación de union del mismo. - Google Patents

Adhesivo estructural y aplicación de union del mismo.

Info

Publication number
MX2014005116A
MX2014005116A MX2014005116A MX2014005116A MX2014005116A MX 2014005116 A MX2014005116 A MX 2014005116A MX 2014005116 A MX2014005116 A MX 2014005116A MX 2014005116 A MX2014005116 A MX 2014005116A MX 2014005116 A MX2014005116 A MX 2014005116A
Authority
MX
Mexico
Prior art keywords
part system
structural adhesive
adhesive composition
resinous
rheology
Prior art date
Application number
MX2014005116A
Other languages
English (en)
Other versions
MX362835B (es
Inventor
Junjie Jeffrey Sang
Dalip Kumar Kohli
Kunal Gaurang Shah
Original Assignee
Cytec Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Tech Corp filed Critical Cytec Tech Corp
Publication of MX2014005116A publication Critical patent/MX2014005116A/es
Publication of MX362835B publication Critical patent/MX362835B/es

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0207—Particles made of materials belonging to B32B25/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995—Two or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995—Two or more layers
    • Y10T428/249951—Including a free metal or alloy constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995—Two or more layers
    • Y10T428/249952—At least one thermosetting synthetic polymeric material layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Una composición adhesiva estructural que es adecuada para la unión de alta resistencia de metales y materiales estructurales aeroespaciales. En una modalidad, la composición adhesiva estructural basada en un sistema de dos partes, que es curable a o por debajo de 200°F (93°C). El sistema de dos partes está compuesto de una parte resinosa (A) y una parte catalizadora (B), que pueden almacenarse por separado a temperatura ambiente hasta que estén listas para usarse. La parte resinosa (A) incluye al menos dos resinas epoxi multifuncionales diferentes con funcionalidad diferente seleccionadas a partir de resinas epoxi difuncionales, trifuncionales, y tetrafuncionales, ciertos componentes endurecedores, y partículas de carga inorgánica como un componente modificador de la reología/tixotropía. Los componentes endurecedores incluyen partículas de caucho con núcleo-envoltura con diferentes tamaños de partículas y al menos uno de un polímero elastomérico y un polímero de poliétersulfona. La parte catalizadora (B) incluye un compuesto alifático o amina cíclica como un agente de curado y carga inorgánica como un componente modificador de la reología/tixotropía. La relación de peso de la parte (A) a la parte (B) está dentro del intervalo de 3:2 a 10:2. En otra modalidad, la composición adhesiva estructural se basa en un sistema de una parte que incluye los componentes de la parte resinosa (A) en el sistema de dos partes mezclado con un agente de curado de amina latente. El sistema de una parte puede incluir además un imidazol y/o una amina alifática. El sistema de una parte es curable dentro del intervalo de temperatura de 140-300°F (60-150°C). El adhesivo en pasta descrito en la presente tiene propiedades similares a una película y es particularmente útil en aplicaciones de unión de estructuras aeroespaciales de ensamblaje rápido.
MX2014005116A 2011-11-09 2012-10-19 Adhesivo estructural y aplicación de union del mismo. MX362835B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161557538P 2011-11-09 2011-11-09
PCT/US2012/060975 WO2013070415A1 (en) 2011-11-09 2012-10-19 Structural adhesive and bonding application thereof

Publications (2)

Publication Number Publication Date
MX2014005116A true MX2014005116A (es) 2014-05-28
MX362835B MX362835B (es) 2019-02-19

Family

ID=47178308

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014005116A MX362835B (es) 2011-11-09 2012-10-19 Adhesivo estructural y aplicación de union del mismo.

Country Status (14)

Country Link
US (2) US8895148B2 (es)
EP (1) EP2776487A1 (es)
JP (1) JP5964980B2 (es)
KR (1) KR102052389B1 (es)
CN (1) CN103797043B (es)
AU (1) AU2012336202B2 (es)
BR (1) BR112014010798B1 (es)
CA (2) CA2854825C (es)
IN (1) IN2014CN03459A (es)
MX (1) MX362835B (es)
MY (2) MY187410A (es)
RU (1) RU2592274C2 (es)
TW (1) TWI576404B (es)
WO (1) WO2013070415A1 (es)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
US9254622B2 (en) * 2012-04-23 2016-02-09 University Of Washington Bond ply for adhesive bonding of composites and associated systems and methods
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
JP6463271B2 (ja) 2013-10-11 2019-01-30 株式会社カネカ コアシェルポリマー含有エポキシ樹脂組成物、その硬化物、及びその製造方法
JP6061837B2 (ja) * 2013-12-05 2017-01-18 アイシン化工株式会社 構造用接着剤組成物
US9890306B2 (en) * 2014-05-28 2018-02-13 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
WO2016007324A1 (en) * 2014-07-08 2016-01-14 Dow Global Technologies Llc DELAYED CURING HIGH Tg CRASH DURABLE ADHESIVE
EP3233438B1 (en) 2014-12-18 2021-02-17 Cytec Industries Inc. Modified resin systems suitable for liquid resin infusion
GB2533776B (en) * 2014-12-23 2020-11-04 Hexcel Composites Ltd Resin Composition
FR3031109B1 (fr) * 2014-12-24 2018-08-17 Arkema France Composition de polymeres, son procede de preparation, son utilisation et composition la comprenant
CN104559064A (zh) * 2015-01-28 2015-04-29 江苏恒神纤维材料有限公司 一种高韧性高Tg环氧树脂及其制备方法
EP3263647A4 (en) * 2015-02-27 2018-10-10 Toray Industries, Inc. Epoxy resin composition, cured epoxy resin product, prepreg, and fiber-reinforced composite material
ES2964815T3 (es) * 2015-03-19 2024-04-09 Zephyros Inc Acidos esterificados para su uso en materiales poliméricos
DE102015105553A1 (de) * 2015-04-12 2016-10-13 ATN Hölzel GmbH Verfahren zur Herstellung einer lastoptimierten Klebeverbindung
KR20170141744A (ko) * 2015-04-30 2017-12-26 헨켈 아게 운트 코. 카게아아 1 액형 경화성 접착제 조성물 및 이의 용도
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
CN204994154U (zh) * 2015-09-08 2016-01-20 中兴通讯股份有限公司 一种通讯设备结构
EP3347398B1 (en) * 2015-09-10 2024-07-31 DDP Specialty Electronic Materials US, LLC One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance
US11242427B2 (en) * 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
EP3170877B1 (en) 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) * 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
DE102015224997A1 (de) * 2015-12-11 2017-06-14 Henkel Ag & Co. Kgaa Verfahren zur Konfektionierung und Auftragung von Klebstoffen
WO2017124664A1 (en) 2016-01-21 2017-07-27 3M Innovative Properties Company Optical camouflage filters
CN105647124A (zh) * 2016-04-12 2016-06-08 苏州甫众塑胶有限公司 一种电子封装塑胶材料及其制备方法
TW201816024A (zh) * 2016-05-09 2018-05-01 漢高智慧財產控股公司 含有反應性倍半矽氧烷的黏著組合物
JP2018016672A (ja) * 2016-07-25 2018-02-01 アイカ工業株式会社 グリース状エポキシ樹脂組成物
KR101806739B1 (ko) * 2016-09-28 2017-12-07 현대자동차주식회사 테이프형 구조용 접착제 조성물
RU2627419C1 (ru) * 2016-10-12 2017-08-08 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Эпоксидное клеевое связующее и пленочный клей на его основе
EP3630883A4 (en) * 2017-05-25 2020-12-09 Henkel IP & Holding GmbH Curable compositions
US11279795B2 (en) 2017-06-29 2022-03-22 3M Innovative Properties Company Curable composition
WO2019087258A1 (ja) * 2017-10-30 2019-05-09 日立化成株式会社 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法
CN107828360A (zh) * 2017-11-16 2018-03-23 西安长峰机电研究所 一种常温固化固体火箭发动机喷管结构粘接剂
FR3074178B1 (fr) * 2017-11-29 2020-05-22 Adhex Technologies Composition latente d'adhesif structural activable par la chaleur et son procede de fabrication
KR101880003B1 (ko) * 2017-12-29 2018-07-18 국방과학연구소 저온경화가 가능한 고온구조용 혼합 페이스트 접착제
CN108192550A (zh) * 2018-02-02 2018-06-22 东莞市精滤电子科技有限公司 高导热绝缘胶及其制备方法与应用
US11732125B2 (en) 2018-02-09 2023-08-22 Ppg Industries Ohio, Inc. Coating compositions
US12233623B2 (en) 2018-02-28 2025-02-25 Nippon Steel Corporation Metal-fiber reinforced resin material composite body and method for producing metal-fiber reinforced resin material composite body
JP7184874B2 (ja) * 2018-03-28 2022-12-06 株式会社カネカ 接着剤組成物
WO2020003122A1 (en) * 2018-06-27 2020-01-02 3M Innovative Properties Company Curable compositions and related methods
RU2686919C1 (ru) * 2018-07-02 2019-05-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное клеевое связующее, пленочный клей и клеевой препрег на его основе
RU2686917C1 (ru) * 2018-07-02 2019-05-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное клеевое связующее и пленочный клей на его основе
EP3830169B1 (en) * 2018-07-27 2025-04-16 Henkel AG & Co. KGaA Two-part epoxy based composition
WO2020082006A1 (en) * 2018-10-18 2020-04-23 Illinois Tool Works Inc. Low halogen two component toughened epoxy adhesive
CN113242884B (zh) * 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
KR20210142588A (ko) * 2018-12-18 2021-11-25 사이텍 인더스트리스 인코포레이티드 난연성 에폭시 조성물 및 이의 사용 방법
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
CN113646383A (zh) * 2019-03-25 2021-11-12 3M创新有限公司 可固化组合物、由其制得的制品，及其制造和使用方法
KR20210144717A (ko) * 2019-03-28 2021-11-30 닛토덴코 가부시키가이샤 경화형 점접착 시트, 및 경화형 점접착 시트의 제조 방법
KR20240122588A (ko) 2019-04-03 2024-08-12 제피로스, 인크. 2-부분 인산 에스테르 에폭시 조성물
EP3956368A4 (en) * 2019-04-18 2022-11-30 Dow Global Technologies LLC LATENT CATALYST
US20220177695A1 (en) * 2019-04-23 2022-06-09 Dic Corporation Curable composition, cured product, fiber reinforced composite material, and molded article and method for producing same
RU2706661C1 (ru) * 2019-05-13 2019-11-19 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное связующее, препрег на его основе и изделие, выполненное из него
KR102197044B1 (ko) * 2019-06-18 2020-12-30 (주)유니테크 자동차용 접착 조성물
US20220372207A1 (en) * 2019-09-23 2022-11-24 Ppg Industries Ohio, Inc. Curable compositions
EP3798246B1 (en) * 2019-09-27 2024-01-31 Henkel AG & Co. KGaA One component (1k) composition based on modified epoxy resin
RU2718831C1 (ru) * 2019-10-10 2020-04-14 Акционерное общество "Препрег-Современные Композиционные Материалы" Эпоксидное связующее, препрег на его основе и изделие, выполненное из него
CN110903661B (zh) * 2019-11-20 2021-12-14 中路交科科技股份有限公司 一种U-pave专用改性沥青及其制备方法和应用方法
EP3825355A1 (de) * 2019-11-22 2021-05-26 Henkel AG & Co. KGaA Formulierungen mit hohen glasübergangstemperaturen für laminate
CN111303816B (zh) * 2020-04-07 2021-08-20 山东送变电工程有限公司 一种电力放线滑车轮片用环氧树脂胶粘剂
US11958938B2 (en) 2020-04-28 2024-04-16 3M Innovative Properties Company Curable composition
CN111574938B (zh) * 2020-06-02 2021-09-07 黑龙江省科学院石油化学研究院 一种自吸热核壳增韧材料、含有自吸热核壳增韧材料的热破结构胶膜及其制备方法与应用
US12234370B2 (en) * 2020-07-02 2025-02-25 Carboline International Corporation Epoxy compositions
WO2022133880A1 (en) * 2020-12-24 2022-06-30 Sika Technology Ag One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
KR20240055820A (ko) * 2021-09-09 2024-04-29 피피지 인더스트리즈 오하이오 인코포레이티드 경량 충전제를 갖는 접착제 조성물
JP2024539943A (ja) * 2021-10-29 2024-10-31 ゼフィロス インコーポレイテッド 反応誘発性の変色組成物
CN115975566B (zh) * 2022-12-30 2025-05-02 惠创科技(台州)有限公司 一种适用于汽车雷达的单组份灌封胶及其制备方法
CN115975346B (zh) * 2023-03-13 2023-07-28 北京天仁道和新材料有限公司 一种ooa固化预浸料用环氧树脂预混物及其制备方法
WO2024203143A1 (ja) * 2023-03-30 2024-10-03 株式会社カネカ 積層体の製造方法
CN116879110B (zh) * 2023-09-06 2023-12-01 道生天合材料科技(上海)股份有限公司 结构胶施胶后发生滑落行为的风险评估方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5877229A (en) 1995-07-26 1999-03-02 Lockheed Martin Energy Systems, Inc. High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
DE10228649A1 (de) * 2002-06-26 2004-01-22 Bakelite Ag Verfahren zur Herstellung eines faserverstärkten Produktes auf Epoxidharzbasis
US20050137357A1 (en) * 2003-12-18 2005-06-23 Skoglund Michael J. Epoxy adhesive composition method of preparing and using
WO2006019041A1 (ja) * 2004-08-18 2006-02-23 Kaneka Corporation 半導体封止剤用エポキシ樹脂組成物およびエポキシ樹脂成形材料
KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
RU2432367C2 (ru) * 2006-06-07 2011-10-27 Зефирос, Инк. Способ уплотнения, экранирования и упрочнения части самоходного транспортного средства
ES2691528T3 (es) * 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
EP2121861B1 (en) 2007-01-17 2010-07-21 Hexcel Composites, Ltd. Low temperature curing of toughened epoxy adhesives
WO2008127925A2 (en) 2007-04-11 2008-10-23 Dow Global Technologies, Inc. Structural epoxy resins containing core-shell rubbers
CN101412896B (zh) * 2007-10-17 2012-07-25 比亚迪股份有限公司 一种双组分环氧树脂粘合剂及其制备方法
GB0806434D0 (en) * 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
ES2662646T3 (es) 2008-06-12 2018-04-09 Henkel IP & Holding GmbH Composiciones adhesivas epóxicas estructurales de dos partes, altamente reforzadas, de nueva generación
US8309633B2 (en) 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
JP4416046B1 (ja) * 2008-08-08 2010-02-17 横浜ゴム株式会社 エポキシ樹脂組成物および構造用接着剤
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
WO2010099440A1 (en) * 2009-02-27 2010-09-02 Hexion Specialty Chemicals, Inc. Compositions useful for non-cellulose fiber sizing, coating or binding compositions, and composites incorporating same
CA2772333C (en) * 2009-08-31 2017-01-17 Cytec Technology Corp. High performance adhesive compositions
ES2483143T3 (es) 2009-12-17 2014-08-05 Essilor International (Compagnie Générale d'Optique) Composición epoxi-funcional termocurable y revestimientos duros cáustico-resistentes termocurados transparentes, preparados a partir de la misma
WO2013070478A1 (en) * 2011-11-08 2013-05-16 Dow Global Technologies Llc Bimodal toughening agents for thermosettable epoxy resin compositions
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof

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