MX2015016094A - Anodo y dispositivo de platinado de alta velocidad provisto con el mismo. - Google Patents

Anodo y dispositivo de platinado de alta velocidad provisto con el mismo.

Info

Publication number
MX2015016094A
MX2015016094A MX2015016094A MX2015016094A MX2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A
Authority
MX
Mexico
Prior art keywords
anode
same
device provided
plating device
cylindrical section
Prior art date
Application number
MX2015016094A
Other languages
English (en)
Inventor
Yoshitaka Mochizuki
Toshihisa Miyazaki
Akira Takamatsu
Original Assignee
Kyb Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyb Corp filed Critical Kyb Corp
Publication of MX2015016094A publication Critical patent/MX2015016094A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Se provee un ánodo capaz de platinar favorablemente durante un largo tiempo. El ánodo (10) es cilíndrico, forma un espacio a través del cual fluye una solución de platinado entre sí mismo y un artículo (1) que será platinado y colocado en el interior del mismo, y tiene un voltaje positivo impartido al mismo. El ánodo (10) se provee con una sección cilíndrica externa conductiva (11), y una sección cilíndrica interna (12) que comprende un material de placa de platino (12A) soldada de manera que está en contacto con la superficie interna de la sección cilíndrica externa (11).
MX2015016094A 2013-06-14 2014-06-06 Anodo y dispositivo de platinado de alta velocidad provisto con el mismo. MX2015016094A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013125552A JP6189655B2 (ja) 2013-06-14 2013-06-14 アノードの製造方法
PCT/JP2014/065049 WO2014199907A1 (ja) 2013-06-14 2014-06-06 アノード及びそれを備えた高速めっき装置

Publications (1)

Publication Number Publication Date
MX2015016094A true MX2015016094A (es) 2016-05-31

Family

ID=52022203

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015016094A MX2015016094A (es) 2013-06-14 2014-06-06 Anodo y dispositivo de platinado de alta velocidad provisto con el mismo.

Country Status (8)

Country Link
US (1) US20160108542A1 (es)
EP (1) EP3009537A4 (es)
JP (1) JP6189655B2 (es)
CN (1) CN105324521A (es)
BR (1) BR112015030429A2 (es)
MX (1) MX2015016094A (es)
TW (1) TWI646225B (es)
WO (1) WO2014199907A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193005B2 (ja) 2013-06-14 2017-09-06 Ｋｙｂ株式会社 保持装置及びそれを備えた高速めっき装置
JP6189656B2 (ja) 2013-06-14 2017-08-30 Ｋｙｂ株式会社 給電部材及びそれを備えた高速めっき装置
US11542626B2 (en) 2020-10-08 2023-01-03 Honeywell International Inc. Systems and methods for enclosed electroplating chambers
WO2023067864A1 (ja) 2021-10-19 2023-04-27 日立Astemo株式会社 ロッドの製造方法およびアノード装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6046195B2 (ja) * 1979-04-13 1985-10-15 ヤマハ発動機株式会社 高速メツキ装置
US4543172A (en) * 1981-03-03 1985-09-24 Toshiyuki Suzuki High speed plating apparatus
DE3938160A1 (de) * 1989-11-16 1991-05-23 Peroxid Chemie Gmbh Elektrolysezelle zur herstellung von peroxo- und perhalogenatverbindungen
DE10102145B4 (de) * 2000-01-19 2008-04-03 Suzuki Motor Corp., Hamamatsu Galvanisiervorbehandlungsvorrichtung und Galvanisierbehandlungsvorrichtung
DE10029837B4 (de) * 2000-06-16 2005-02-17 Degussa Galvanotechnik Gmbh Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen
JP3513657B2 (ja) * 2001-03-05 2004-03-31 ダイソー株式会社 不溶性陽極
ITMI20050373A1 (it) * 2005-03-09 2006-09-10 Nora Elettrodi S P A Elettrodo cilindrico
JP4873695B2 (ja) * 2006-04-14 2012-02-08 ダイソー株式会社 電着塗装用膜付き中空電極
JP5467374B2 (ja) * 2011-08-25 2014-04-09 ユケン工業株式会社 軸体に電気めっきを形成するための装置、めっき皮膜を有する軸体の製造方法および軸体上に亜鉛系めっき皮膜を形成するためのめっき液

Also Published As

Publication number Publication date
EP3009537A4 (en) 2017-03-22
JP2015001005A (ja) 2015-01-05
BR112015030429A2 (pt) 2017-08-29
CN105324521A (zh) 2016-02-10
US20160108542A1 (en) 2016-04-21
EP3009537A1 (en) 2016-04-20
TW201510292A (zh) 2015-03-16
TWI646225B (zh) 2019-01-01
JP6189655B2 (ja) 2017-08-30
WO2014199907A1 (ja) 2014-12-18

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