MX2020002248A - Material compuesto para el blindaje de la radiacion electromagnetica, materia prima para metodos de fabricacion aditiva y un producto que comprende el material compuesto asi como un metodo de fabricacion del producto. - Google Patents
Material compuesto para el blindaje de la radiacion electromagnetica, materia prima para metodos de fabricacion aditiva y un producto que comprende el material compuesto asi como un metodo de fabricacion del producto.Info
- Publication number
- MX2020002248A MX2020002248A MX2020002248A MX2020002248A MX2020002248A MX 2020002248 A MX2020002248 A MX 2020002248A MX 2020002248 A MX2020002248 A MX 2020002248A MX 2020002248 A MX2020002248 A MX 2020002248A MX 2020002248 A MX2020002248 A MX 2020002248A
- Authority
- MX
- Mexico
- Prior art keywords
- product
- composite material
- electromagnetic radiation
- well
- shielding electromagnetic
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- G—PHYSICS
- G12—INSTRUMENT DETAILS
- G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
- G12B17/00—Screening
- G12B17/02—Screening from electric or magnetic fields, e.g. radio waves
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Composite Materials (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compounds Of Iron (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
La invención se refiere a un material compuesto para el blindaje de la radiación electromagnética, una materia prima para métodos de fabricación aditiva y un producto que comprende el material así como un método de fabricación del producto. El material compuesto según la invención puede servir como material de protección de los elementos electrónicos, dispositivos electrónicos u organismos vivos de la radiación electromagnética en el rango de microondas y terahercios (0.3-10000 GHz).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19461516.7A EP3703479B1 (en) | 2019-02-28 | 2019-02-28 | Composite material for shielding electromagnetic radiation, raw material for additive manufacturing methods and a product comprising the composite material as well as a method of manufacturing the product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2020002248A true MX2020002248A (es) | 2021-02-09 |
Family
ID=65955152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2020002248A MX2020002248A (es) | 2019-02-28 | 2020-02-27 | Material compuesto para el blindaje de la radiacion electromagnetica, materia prima para metodos de fabricacion aditiva y un producto que comprende el material compuesto asi como un metodo de fabricacion del producto. |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US11766854B2 (es) |
| EP (1) | EP3703479B1 (es) |
| JP (1) | JP7566296B2 (es) |
| KR (1) | KR20200105625A (es) |
| CN (1) | CN111621072A (es) |
| AU (1) | AU2020201098A1 (es) |
| BR (1) | BR102020003875A2 (es) |
| CA (1) | CA3073670A1 (es) |
| ES (1) | ES2939245T3 (es) |
| MX (1) | MX2020002248A (es) |
| PL (1) | PL3703479T3 (es) |
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| EP3224024A1 (en) | 2014-11-24 | 2017-10-04 | PPG Industries Ohio, Inc. | Coreactive materials and methods for three-dimensional printing |
| US12384097B2 (en) | 2017-08-18 | 2025-08-12 | Ppg Industries Ohio, Inc. | Additive manufacturing using reactive compositions |
| US10434704B2 (en) | 2017-08-18 | 2019-10-08 | Ppg Industries Ohio, Inc. | Additive manufacturing using polyurea materials |
| KR102537828B1 (ko) | 2019-02-11 | 2023-05-26 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 내약품성 밀봉 컴포넌트를 제조하는 방법 |
| WO2020167633A1 (en) | 2019-02-11 | 2020-08-20 | Ppg Industries Ohio, Inc. | 3d printing of seal caps |
| JP7350080B2 (ja) | 2019-02-11 | 2023-09-25 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド | 多層系および多層系を製造する方法 |
| AU2020221556B2 (en) | 2019-02-11 | 2023-02-09 | Ppg Industries Ohio, Inc. | Elastomeric compositions and methods of use |
| AU2020419333A1 (en) | 2020-01-03 | 2022-07-21 | Nanotech Energy, Inc. | Electromagnetic interference shielding materials, devices, and methods of manufacture thereof |
| EP3960454B1 (en) * | 2020-08-31 | 2024-02-21 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing with polyolefin and metal oxide build materials |
| CN115109369A (zh) * | 2021-03-22 | 2022-09-27 | 南开大学 | 复合材料、其制备方法及用途 |
| CN113133298A (zh) * | 2021-04-21 | 2021-07-16 | 赛福纳米科技(徐州)有限公司 | 纳米碳基电磁屏蔽材料的制备方法 |
| CN113174118B (zh) * | 2021-04-26 | 2022-04-12 | 广东粤港澳大湾区黄埔材料研究院 | 一种具有电磁屏蔽功能的形状记忆高分子复合材料及其制备方法 |
| CN113248883B (zh) * | 2021-06-04 | 2022-03-25 | 山东大学 | 一种医用柔性电磁屏蔽薄膜及其制备方法与应用 |
| CN113321247B (zh) * | 2021-06-16 | 2022-08-02 | 哈尔滨工业大学 | 一种有序孔隙木质衍生碳负载钴酸镍吸波材料的制备方法 |
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| CN111630095A (zh) | 2017-12-04 | 2020-09-04 | 华沙工业大学 | 屏蔽波长在亚太赫兹和太赫兹范围内的电磁辐射的聚合物-碳材料的应用 |
| US20200123379A1 (en) | 2018-10-23 | 2020-04-23 | Lockheed Martin Corporation | Toughened, high conductivity emi thermoplastic with nanomaterials and articles and methods thereof |
| KR102125262B1 (ko) | 2019-01-11 | 2020-06-22 | 주식회사 엘지화학 | 내열성과 전자파 차폐능이 우수한 열가소성 수지 조성물, 이의 제조방법 및 이로부터 제조된 사출성형품 |
| EP3736251A1 (en) * | 2019-05-07 | 2020-11-11 | NanoEMI sp.z o.o. | Method of manufacturing flake graphene |
-
2019
- 2019-02-28 ES ES19461516T patent/ES2939245T3/es active Active
- 2019-02-28 EP EP19461516.7A patent/EP3703479B1/en active Active
- 2019-02-28 PL PL19461516.7T patent/PL3703479T3/pl unknown
-
2020
- 2020-02-14 AU AU2020201098A patent/AU2020201098A1/en not_active Abandoned
- 2020-02-25 CA CA3073670A patent/CA3073670A1/en active Pending
- 2020-02-26 KR KR1020200023735A patent/KR20200105625A/ko not_active Ceased
- 2020-02-27 CN CN202010125377.5A patent/CN111621072A/zh active Pending
- 2020-02-27 BR BR102020003875-3A patent/BR102020003875A2/pt not_active Application Discontinuation
- 2020-02-27 MX MX2020002248A patent/MX2020002248A/es unknown
- 2020-02-27 JP JP2020031334A patent/JP7566296B2/ja active Active
- 2020-02-27 US US16/803,511 patent/US11766854B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020143275A (ja) | 2020-09-10 |
| PL3703479T3 (pl) | 2023-03-20 |
| CN111621072A (zh) | 2020-09-04 |
| CA3073670A1 (en) | 2020-08-28 |
| EP3703479A1 (en) | 2020-09-02 |
| AU2020201098A1 (en) | 2020-09-17 |
| JP7566296B2 (ja) | 2024-10-15 |
| KR20200105625A (ko) | 2020-09-08 |
| US20200276797A1 (en) | 2020-09-03 |
| BR102020003875A2 (pt) | 2020-11-24 |
| EP3703479B1 (en) | 2022-11-30 |
| US11766854B2 (en) | 2023-09-26 |
| ES2939245T3 (es) | 2023-04-20 |
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