MX2020007086A - Tarjeta flexible de circuito impreso. - Google Patents

Tarjeta flexible de circuito impreso.

Info

Publication number
MX2020007086A
MX2020007086A MX2020007086A MX2020007086A MX2020007086A MX 2020007086 A MX2020007086 A MX 2020007086A MX 2020007086 A MX2020007086 A MX 2020007086A MX 2020007086 A MX2020007086 A MX 2020007086A MX 2020007086 A MX2020007086 A MX 2020007086A
Authority
MX
Mexico
Prior art keywords
ground plane
circuit board
printed circuit
flexible printed
shielding via
Prior art date
Application number
MX2020007086A
Other languages
English (en)
Inventor
Scott G Blanc
Original Assignee
Nortech Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nortech Systems Inc filed Critical Nortech Systems Inc
Publication of MX2020007086A publication Critical patent/MX2020007086A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Una tarjeta flexible de circuito impreso comprende una capa de conducción que incluye una primera línea de señal, un primer plano de conexión a tierra y un segundo plano de conexión a tierra. Una primera vía de blindaje se extiende de un tercer plano de conexión a tierra a un cuarto plano de conexión a tierra y se extiende a través del primer plano de conexión a tierra para conectar eléctricamente el primer plano de conexión a tierra, el tercer plano de conexión a tierra y el cuarto plano de conexión a tierra. Una segunda vía de blindaje se extiende del tercer plano de conexión a tierra al cuarto plano de conexión a tierra. El primer plano de conexión a tierra, el segundo plano de conexión a tierra, el tercer plano de conexión a tierra, el cuarto plano de conexión a tierra, la primera vía de blindaje y la segunda vía de blindaje, juntos, rodean circunferencialmente la primera línea de señal para minimizar la interferencia electromagnética con la primera línea de señal.
MX2020007086A 2018-01-12 2019-01-11 Tarjeta flexible de circuito impreso. MX2020007086A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862616821P 2018-01-12 2018-01-12
PCT/US2019/013337 WO2019140290A1 (en) 2018-01-12 2019-01-11 Flexible printed circuit board

Publications (1)

Publication Number Publication Date
MX2020007086A true MX2020007086A (es) 2021-01-08

Family

ID=67219855

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020007086A MX2020007086A (es) 2018-01-12 2019-01-11 Tarjeta flexible de circuito impreso.

Country Status (6)

Country Link
US (2) US11412608B2 (es)
EP (1) EP3738141A4 (es)
CN (1) CN112074933B (es)
CA (1) CA3087351A1 (es)
MX (1) MX2020007086A (es)
WO (1) WO2019140290A1 (es)

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KR102922810B1 (ko) * 2019-12-24 2026-02-04 삼성전자 주식회사 회로 기판 및 이를 포함하는 전자 장치
KR102908325B1 (ko) * 2020-12-10 2026-01-05 삼성전기주식회사 인쇄회로기판
EP4550945A4 (en) 2022-10-25 2026-03-04 Samsung Electronics Co Ltd Electronic device comprising wirings
CN118102600B (zh) * 2024-04-22 2024-06-21 成都光创联科技有限公司 高速光器件电路板的设计方法
WO2026054525A1 (ko) * 2024-09-04 2026-03-12 삼성전자주식회사 전송 선로를 포함하는 전자 장치

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Also Published As

Publication number Publication date
US20200383202A1 (en) 2020-12-03
CN112074933B (zh) 2025-01-07
US20220377878A1 (en) 2022-11-24
CA3087351A1 (en) 2019-07-18
WO2019140290A1 (en) 2019-07-18
EP3738141A1 (en) 2020-11-18
EP3738141A4 (en) 2021-10-06
US11412608B2 (en) 2022-08-09
CN112074933A (zh) 2020-12-11

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