MX2020009210A - Sistema de soldadura por refusion para soldadura por conveccion y soldadura en fase de vapor combinadas. - Google Patents

Sistema de soldadura por refusion para soldadura por conveccion y soldadura en fase de vapor combinadas.

Info

Publication number
MX2020009210A
MX2020009210A MX2020009210A MX2020009210A MX2020009210A MX 2020009210 A MX2020009210 A MX 2020009210A MX 2020009210 A MX2020009210 A MX 2020009210A MX 2020009210 A MX2020009210 A MX 2020009210A MX 2020009210 A MX2020009210 A MX 2020009210A
Authority
MX
Mexico
Prior art keywords
soldering
condensation
reflow
convection
combined convection
Prior art date
Application number
MX2020009210A
Other languages
English (en)
Inventor
Johannes Rehm
Original Assignee
Rehm Thermal Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rehm Thermal Systems Gmbh filed Critical Rehm Thermal Systems Gmbh
Publication of MX2020009210A publication Critical patent/MX2020009210A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0282—Carriages forming part of a welding unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La presente invención se refiere a un sistema de soldadura por refusión (10) que comprende una o una pluralidad de zonas de proceso de soldadura calentables individualmente (11, 12, 13). El sistema de soldadura por refusión de acuerdo con la presente invención está configurado para suministrar calor a una pieza de trabajo (20) selectivamente mediante condensación o mediante convección o como una combinación de convección y condensación.
MX2020009210A 2019-09-05 2020-09-03 Sistema de soldadura por refusion para soldadura por conveccion y soldadura en fase de vapor combinadas. MX2020009210A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102019213511.0A DE102019213511A1 (de) 2019-09-05 2019-09-05 Reflow-Lötanlage zum kombinierten Konvektionslöten und Kondensationslöten

Publications (1)

Publication Number Publication Date
MX2020009210A true MX2020009210A (es) 2021-03-08

Family

ID=72266172

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020009210A MX2020009210A (es) 2019-09-05 2020-09-03 Sistema de soldadura por refusion para soldadura por conveccion y soldadura en fase de vapor combinadas.

Country Status (6)

Country Link
US (1) US11504786B2 (es)
EP (1) EP3789148B1 (es)
CN (1) CN112439965B (es)
DE (1) DE102019213511A1 (es)
MX (1) MX2020009210A (es)
RU (1) RU2751016C1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019211212B4 (de) * 2019-07-29 2025-03-27 Rehm Thermal Systems Gmbh Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
DE102019125983B4 (de) * 2019-09-26 2022-10-20 Ersa Gmbh Reflowlötanlage zum Durchlauflöten von Lötgut
US11445650B2 (en) * 2019-10-22 2022-09-13 International Business Machines Corporation Localized rework using liquid media soldering
CN113618240B (zh) * 2021-08-19 2023-02-28 深圳市尚拓激光技术有限公司 一种锂电池防爆阀激光焊接设备
KR20240053281A (ko) * 2022-10-17 2024-04-24 삼성전자주식회사 솔더 리플로우 시스템 및 이를 이용한 솔더 리플로우 방법
KR20250015009A (ko) * 2023-07-24 2025-02-03 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
CN117583684A (zh) * 2024-01-16 2024-02-23 无锡市古德电子有限公司 一种smt焊接方法
EP4613412A1 (de) * 2024-03-07 2025-09-10 Siemens Aktiengesellschaft Wiederaufschmelzlötanlage zum durchführen eines lötprozesses für zumindest ein bauteil, sowie verfahren zum betreiben einer wiederaufschmelzlötanlage
EP4686522A1 (en) * 2024-08-02 2026-02-04 Illinois Tool Works Inc. Apparatus for joining electronic components to electronic substrate

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2418034A1 (fr) * 1978-02-28 1979-09-21 Sagem Perfectionnements apportes aux appareils pour le traitement de surfaces impliquant l'utilisation d'au moins un solvant
EP0023107B1 (en) * 1979-07-09 1983-09-07 Electrovert Ltd. Method and apparatus for vapour phase soldering
US4886449A (en) * 1982-12-04 1989-12-12 General Motors Corporation Vacuum brazing of aluminum alloy workpieces
JPS60108162A (ja) * 1983-11-16 1985-06-13 Hitachi Ltd 蒸気槽
JPS62234658A (ja) * 1986-04-02 1987-10-14 Matsushita Electric Ind Co Ltd 蒸気処理装置
US4735001A (en) * 1986-04-25 1988-04-05 Hitachi Techno Engineering Co., Ltd. Vapor reflow type soldering apparatus
JPS62270275A (ja) * 1986-05-19 1987-11-24 Kenji Kondo 蒸気相はんだ付け装置
JPS6330172A (ja) * 1986-07-24 1988-02-08 Nec Corp リフロ−はんだ付け装置
US4698915A (en) * 1986-08-04 1987-10-13 American Telephone And Telegraph Company Method and apparatus for condensation heating
US4804128A (en) * 1986-12-04 1989-02-14 General Motors Corporation Vacuum brazing of aluminum alloy workpieces
JPS63154261A (ja) * 1986-12-16 1988-06-27 Fujitsu Ltd 気相半田付け装置
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH03118962A (ja) * 1989-10-03 1991-05-21 Hitachi Techno Eng Co Ltd ベーパリフロー式はんだ付け装置
JP2933403B2 (ja) * 1991-03-15 1999-08-16 株式会社日立製作所 半導体パッケージ気密封止方法及び半導体パッケージ気密封止装置
DE29704601U1 (de) * 1997-03-13 1997-06-19 Rehm Anlagenbau GmbH + Co., 89143 Blaubeuren Heizvorrichtung
US6005225A (en) * 1997-03-28 1999-12-21 Silicon Valley Group, Inc. Thermal processing apparatus
US6005224A (en) 1997-10-30 1999-12-21 U.S. Philips Corporation Method of soldering components to at least one carrier
FR2774013B1 (fr) * 1998-01-23 2000-04-07 Jean Paul Garidel Procede de traitement thermique d'une piece a l'aide d'au moins un liquide de transfert thermique et four a condensation pour sa mise en oeuvre
US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
DE19911887C1 (de) * 1999-03-17 2000-12-21 Asscon Systech Elektronik Gmbh Verfahren zum Reflow-Löten in einer Dampfphasenvakuumlötanlage
DE10025472C2 (de) * 2000-05-23 2003-04-24 Rehm Anlagenbau Gmbh Dampfphasenlötanlage mit überhitztem Dampf
JP3974525B2 (ja) * 2000-12-21 2007-09-12 富士通株式会社 リフロー半田付け装置及びリフロー半田付け方法
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US6749655B2 (en) * 2002-04-17 2004-06-15 Speedline Technologies, Inc. Filtration of flux contaminants
US6780225B2 (en) * 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
EP1536909A2 (en) * 2002-06-14 2005-06-08 Vapour Phase Technology Aps Method and apparatus for vapour phase soldering
US20130175323A1 (en) * 2002-07-01 2013-07-11 Jian Zhang Serial thermal linear processor arrangement
DE10350699B3 (de) * 2003-10-30 2005-06-30 Rehm Anlagenbau Gmbh Verfahren und Vorrichtung zum Aufschmelzlöten mit Volumenstromsteuerung
EP1727640B1 (de) 2004-03-11 2008-09-10 IBL Löttechnik GmbH Verfahren und vorrichtung für das löten mit unterdruck in der dampfphase
DE102004019635B4 (de) * 2004-04-22 2007-12-27 Rehm Anlagenbau Gmbh Dampfbetriebene Lötanlage und Dampferzeugungssystem für eine Lötanlage
JP3942623B2 (ja) * 2005-12-12 2007-07-11 富士通テン株式会社 フラットディップ装置およびフラットディップ装置のはんだ付け方法
KR101355255B1 (ko) * 2006-05-29 2014-01-27 키르스텐 솔더링 아게 솔더링 모듈과 솔더링 모듈 내로 삽입될 수 있는 적어도 하나의 이동가능 및 교환가능 솔더링 스테이션을 포함하는 솔더링 장치
DE102007005345B4 (de) * 2007-02-02 2014-06-18 Seho Systemtechnik Gmbh Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens
RU2567963C2 (ru) * 2008-12-10 2015-11-10 Кевин Стефен ДЭВИС Способ и устройство для пайки оплавлением
JP2015002325A (ja) * 2013-06-18 2015-01-05 株式会社Ｓｓテクノ 水蒸気リフロー装置及び水蒸気リフロー方法
EP3009220B1 (de) 2014-10-17 2018-12-19 Rehm Thermal Systems GmbH Rolle-zu-Rolle-Fertigungsanlage und -verfahren für verkettete kontinuierliche und diskontinuierliche Verarbeitungsprozesse
JP6188671B2 (ja) * 2014-12-12 2017-08-30 株式会社Ｓｓテクノ 水蒸気リフロー装置及び水蒸気リフロー方法
EP3053691A1 (en) * 2015-02-04 2016-08-10 Illinois Tool Works Inc. Reflow soldering oven with enhanced gas purification system
CN204922973U (zh) * 2015-05-08 2015-12-30 广东顺德圣堡莱热能科技有限公司 一种冷凝式燃气模块炉空气对流装置
EP3618993B1 (de) * 2017-05-05 2021-07-07 PINK GmbH Thermosysteme Verfahren zum herstellen einer lötverbindung von bauteilen unter verwendung von haftmaterial für provisorische verbindung der bauteile
JP6909999B2 (ja) * 2018-11-07 2021-07-28 パナソニックＩｐマネジメント株式会社 気相式加熱方法及び気相式加熱装置

Also Published As

Publication number Publication date
DE102019213511A1 (de) 2021-03-11
US20210069810A1 (en) 2021-03-11
EP3789148B1 (de) 2024-07-17
EP3789148C0 (de) 2024-07-17
US11504786B2 (en) 2022-11-22
EP3789148A1 (de) 2021-03-10
RU2751016C1 (ru) 2021-07-07
CN112439965B (zh) 2022-07-26
CN112439965A (zh) 2021-03-05

Similar Documents

Publication Publication Date Title
MX2020009210A (es) Sistema de soldadura por refusion para soldadura por conveccion y soldadura en fase de vapor combinadas.
PH12019500155A1 (en) Method of generating aerosol
MY196964A (en) Apparatus for heating smokable material
ZA202108746B (en) Non-contact heat not burn heating device
NZ735178A (en) Treatment of wood
MX2020002291A (es) Procedimiento para calentar un componente metalico a una temperatura objetivo y horno con solera de rodillos correspondiente.
MX2018016407A (es) Metodo para controlar la transferencia de calor entre un sistema de enfriamiento local y un sistema de calentamiento local.
CA3019927A1 (en) Microwave tempering of glass substrates
TW201614760A (en) Heater apparatus for substrate processing and liquid processing arraratus for substrate comprising the same
MX2022002068A (es) Dispositivo de coccion.
DK3660438T3 (da) Den foreliggende opfindelse angår en pladevarmeveksler, en varmevekslerplade og fremgangsmåde til behandling af en tilførsel såsom havvand
MX2017001321A (es) Sistema y metodo roboticos de tratamiento termico por calentamiento por induccion.
PL3420111T3 (pl) Sposób ukierunkowanej obróbki cieplnej poszczególnych obszarów elementu konstrukcyjnego
MX2022002107A (es) Sistema mejorado de utensilios de cocina combinados.
HUE046592T2 (hu) Eljárás hõkezelést követõen nagy állékonysággal rendelkezõ bevonatolt acél munkadarabok készítésére
MX2018000099A (es) Parches termicos con celdas termicas en forma de anillo.
PL3803217T3 (pl) System ogrzewania i chłodzenia, odpowiedni sposób i zastosowanie systemu
PH12018500084A1 (en) A heater for use in curing tobacco or for other similar processes
MX2017008435A (es) Sistema y metodo a base de plasma en linea para el tratamiento termico de productos continuos.
MY192246A (en) Heat exchanger support structure
PH22020050066U1 (en) Heat treatment furnace
DK3583366T3 (da) Indretning og fremgangsmåde til forøgelse af en varmekildes varmeeffekt
GB202210562D0 (en) Low-grade heat
MX2018006515A (es) Preparacion de sal de carbonato y tratamiento de la carne con esta.
PL4348113T3 (pl) Palnik, aparatura i sposób wypalania wyrobów ceramicznych