MY104094A - Method of making a hermetically sealed package having an electronic component. - Google Patents

Method of making a hermetically sealed package having an electronic component.

Info

Publication number
MY104094A
MY104094A MYPI89000982A MYPI19890982A MY104094A MY 104094 A MY104094 A MY 104094A MY PI89000982 A MYPI89000982 A MY PI89000982A MY PI19890982 A MYPI19890982 A MY PI19890982A MY 104094 A MY104094 A MY 104094A
Authority
MY
Malaysia
Prior art keywords
electronic component
leads
opening
making
hermetically sealed
Prior art date
Application number
MYPI89000982A
Inventor
Marshall Andrews Daniel
Original Assignee
Microelectronics And Computer Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microelectronics And Computer Tech filed Critical Microelectronics And Computer Tech
Priority to MYPI89000982A priority Critical patent/MY104094A/en
Publication of MY104094A publication Critical patent/MY104094A/en

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  • Packaging Frangible Articles (AREA)

Abstract

FORMING A BODY OF INSULATING MATERIAL WITH A SHELF AND AN OPENING THERE THROUGH WITH A PLURALITY OF ELECTRICAL CONDUCTORS EXTENDING FROM THE SHELF TO THE EXTERIOR OF THE BODY. A PLURALITY OF TAPE AUTOMATED BONDING LEADS ARE PLACED IN THE OPENING IN WHICH THE INNER ENDS OF THE LEADS ARE CONNECTED TOGETHER. THE OUTER ENDS OF THE LEADS ARE ALIGNED WITH THE ELECTRICAL CONDUCTORS AND BONDED THERETO AND THE INNER ENDS OF THE LEADS ARE DISCONNECTED FROM EACH OTHER. AN ELECTRONIC COMPONENT IS BONDED TO A BOTTOM COVER, ALIGNED IN THE OPENING, AND THE INNER ENDS OF THE LEADS ARE BONDED TO THE ELECTRICAL COMPONENT. THE BOTTOM AND A TOP COVER ARE SEALABLY CONNECTED TO THE BODY ENCLOSING THE OPENING AND THE ELECTRONIC COMPONENT.(FIG. 3)
MYPI89000982A 1989-07-20 1989-07-20 Method of making a hermetically sealed package having an electronic component. MY104094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI89000982A MY104094A (en) 1989-07-20 1989-07-20 Method of making a hermetically sealed package having an electronic component.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI89000982A MY104094A (en) 1989-07-20 1989-07-20 Method of making a hermetically sealed package having an electronic component.

Publications (1)

Publication Number Publication Date
MY104094A true MY104094A (en) 1993-11-30

Family

ID=79553778

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI89000982A MY104094A (en) 1989-07-20 1989-07-20 Method of making a hermetically sealed package having an electronic component.

Country Status (1)

Country Link
MY (1) MY104094A (en)

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