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Application filed by Sumitomo Bakelite CofiledCriticalSumitomo Bakelite Co
Priority to MYPI91000434ApriorityCriticalpatent/MY105849A/en
Publication of MY105849ApublicationCriticalpatent/MY105849A/en
A COVER TAPE USED FOR PACKAGING OF CHIP TYPE ELECTRONIC PARTS, WHICH IS HEAT-SEALABLE TO A PLASTIC CARRIER TAPE HAVING AT GIVEN INTERVALS POCKETS FOR ACCOMMDATION OF CHIP TYPE ELECTRONIC PARTS, CHARACTERIZED IN THAT OUTER LAYER IS A BIAXIALLY ORIENTED FILM CONSISTING OF POLYESTER, POLYPROPYLENE OR NYLON AND THE ADHESION LAYER CONSISTS OF A DISPERSION OF CONDUCTIVE FINE POWDERS IN A THERMOPLASTIC RESIN, SAID CONDUCTIVE FINE POWDERS CONSISTING OF TIN OXIDE, ZINC OXIDE, TITANIUM OXIDE, CARBON BLACK OR A SI-BASED ORGANIC COMPOUND, OR THEIR COMBINATION, SAID THERMOPLASTIC RESIN CONSISTING OF POLYURETHANE RESIN, ACRYLIC RESIN, POLYVINYL CHLORIDE RESIN, ETHYLENE-VINYL ACETATE RESIN OR POLYESTER RESIN, OR THEIR COMBINATION.(FIG 2)
MYPI91000434A1991-03-161991-03-16Cover tape for packaging chip type electronic parts.
MY105849A
(en)