MY105936A - Manufacture of printed circuit board assemblies. - Google Patents

Manufacture of printed circuit board assemblies.

Info

Publication number: MY105936A
Authority: MY; Malaysia
Prior art keywords: manufacture; circuit board; printed circuit; board assemblies; paste composition
Prior art date: 1989-08-14

Application number

MYPI90001231A

Other languages

English (en)

Inventor

Rubin Wallace

Stanley Hedges Philip

Original Assignee

Multicore Solders Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-08-14

Filing date

1990-07-25

Publication date

1995-02-28

1989-08-14 Priority claimed from US07/393,590 external-priority patent/US4960236A/en

1990-07-25 Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd

1995-02-28 Publication of MY105936A publication Critical patent/MY105936A/en

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Manufacturing Of Printed Wiring (AREA)

MYPI90001231A 1989-08-14 1990-07-25 Manufacture of printed circuit board assemblies. MY105936A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US07/393,590 US4960236A (en)	1986-12-03	1989-08-14	Manufacture of printed circuit board assemblies

Publications (1)

Publication Number	Publication Date
MY105936A true MY105936A (en)	1995-02-28

Family

ID=23555376

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
MYPI90001231A MY105936A (en)	1989-08-14	1990-07-25	Manufacture of printed circuit board assemblies.

Country Status (4)

Country	Link
EP (1)	EP0413540A3 (de)
JP (1)	JPH0388386A (de)
AU (1)	AU5919890A (de)
MY (1)	MY105936A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5064481A (en) *	1990-05-17	1991-11-12	Motorola, Inc.	Use or organic acids in low residue solder pastes
US5069730A (en) *	1991-01-28	1991-12-03	At&T Bell Laboratories	Water-soluble soldering paste
US5150832A (en) *	1991-06-28	1992-09-29	At&T Bell Laboratories	Solder paste
US5125560A (en) *	1991-11-04	1992-06-30	At&T Bell Laboratories	Method of soldering including removal of flux residue
GB9126498D0 (en) *	1991-12-13	1992-02-12	Cookson Group Plc	Paste formulations for use in the electronics industry
US5196070A (en) *	1991-12-31	1993-03-23	International Business Machines Corporation	Thermally stable water soluble solder flux and paste
US5211764A (en) *	1992-11-10	1993-05-18	At&T Bell Laboratories	Solder paste and method of using the same
JPH07290277A (ja) *	1994-04-25	1995-11-07	Nippon Genma:Kk	フラックス
HUE045153T2 (hu) *	2013-12-17	2019-12-30	Heraeus Deutschland Gmbh & Co Kg	Forrasztópaszta adipinsavval, oxálsavval és aminkomponenssel
EP2886244A1 (de) *	2013-12-17	2015-06-24	Heraeus Deutschland GmbH & Co. KG	Verfahren zur Befestigung eines Bauteils auf einem Substrat
TWI733301B (zh) *	2020-01-09	2021-07-11	廣化科技股份有限公司	焊料膏組成物及包含其之焊接方法
JP7032686B1 (ja) *	2021-10-12	2022-03-09	千住金属工業株式会社	フラックス及びソルダペースト

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB8628916D0 (en) *	1986-12-03	1987-01-07	Multicore Solders Ltd	Solder composition

1990
- 1990-07-20 AU AU59198/90A patent/AU5919890A/en not_active Abandoned
- 1990-07-25 MY MYPI90001231A patent/MY105936A/en unknown
- 1990-08-13 JP JP2211738A patent/JPH0388386A/ja active Pending
- 1990-08-13 EP EP19900308886 patent/EP0413540A3/en not_active Withdrawn

Also Published As

Publication number	Publication date
AU5919890A (en)	1991-02-14
EP0413540A3 (en)	1992-06-10
JPH0388386A (ja)	1991-04-12
EP0413540A2 (de)	1991-02-20

Publication	Publication Date	Title
MY105936A (en)	1995-02-28	Manufacture of printed circuit board assemblies.
SE7706771L (sv)	1977-12-12	Flussmedelskomposition
KR100186786B1 (en)	1999-04-01	No-clean soldering flux and method using the same
ATE181452T1 (de)	1999-07-15	Kupferlegierungszusammensetzung
GB2139132B (en)	1986-08-20	Vapour phase soldering
GB1442970A (en)	1976-07-21	Solder alloy composition
GB1508560A (en)	1978-04-26	Thick-film circuits
GB2367834A (en)	2002-04-17	Solder alloy
JPS5419614A (en)	1979-02-14	Digital input circuit
JPS5510357A (en)	1980-01-24	Fused flux for submerged arc welding
ES8501276A1 (es)	1984-11-16	Procedimiento para soldar directamente productos semiacabados a base de materiales de contacto sobre soportes de contactos electricos.
JPS564395A (en)	1981-01-17	Silver braze alloy
JPS5447845A (en)	1979-04-14	Low melting point copper alloys for welding and soldering
JPS5516732A (en)	1980-02-05	Brazing material for portable watch
Slima et al.	1991	Selecting a solder paste.
JPS53131457A (en)	1978-11-16	Constant voltage circuit
JPS564394A (en)	1981-01-17	Silver braze alloy
JPS5425645A (en)	1979-02-26	Clock circuit
JPS53131458A (en)	1978-11-16	Constant voltage circuit
JPS53118243A (en)	1978-10-16	Bond flux submerged-arc welding
JPS53122611A (en)	1978-10-26	Desulfurizing agent for molten metal
JPS53110942A (en)	1978-09-28	Low melting point autogeneous hard solder material
JPS51111419A (en)	1976-10-01	Alloy for sealing the soft glass
JPS548286A (en)	1979-01-22	Slit cleaning method by conduction
JPS548862A (en)	1979-01-23	Low power circuit