MY106164A - Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces. - Google Patents

Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces.

Info

Publication number
MY106164A
MY106164A MYPI91000187A MYPI19910187A MY106164A MY 106164 A MY106164 A MY 106164A MY PI91000187 A MYPI91000187 A MY PI91000187A MY PI19910187 A MYPI19910187 A MY PI19910187A MY 106164 A MY106164 A MY 106164A
Authority
MY
Malaysia
Prior art keywords
emulsion
substrate
selectively protect
autodeposition
methods
Prior art date
Application number
MYPI91000187A
Inventor
Joseph Hart Daniel
Robert Browne Alan
Frederick Becknell Alan
Elzufen Betsy
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Publication of MY106164A publication Critical patent/MY106164A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A COATING OF RESIN AND PHOTOACTIVE FUNCTIONALITY IS AUTODEPOSITED FROM AN EMULSION ONTO A METALLIC SUBSTRATE IN ORDER TO SELECTIVELY PROTECT THE SUBSTRATE FROM CORROSIVE ENVIRONMENTS SUCH AS ETCHANT PROCESSES. AN ACID OXIDIZING AGENT ARE INCLUDED IN THE EMULSION SO THAT WHEN THE SUBSTRATE IS IMMERSED IN THE EMULSION THE RESIN AND PHOTOACTIVE FUNCTIONALITY AUTODEPOSITS. THE RESULTING COATING CAN BE EXPOSED TO ACTINIC RADIATION IN AN IMAGE-WISE FASHION AND DEVELOPED IN AN ALKALINE SOLUTION TO DEVELOP THE IMAGE CREATED. IN INSTANCES WHERE THE EMULSION AND PROCESS ARE USED TO MAKE CIRCUIT BOARDS,THE METALLIC SURFACE UNCOVERED DURING DEVELOPING IS THEN ETCHED AWAY, LEAVING ONLY THE COATED SECTIONS OF THE SURFACE. THE RESULTING COATED SURFACE WILL BE THE CIRCUIT TRACES OF THE CIRCUIT BOARD.
MYPI91000187A 1990-12-07 1991-02-07 Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces. MY106164A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62136190A 1990-12-07 1990-12-07

Publications (1)

Publication Number Publication Date
MY106164A true MY106164A (en) 1995-03-31

Family

ID=24489847

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI91000187A MY106164A (en) 1990-12-07 1991-02-07 Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces.

Country Status (3)

Country Link
JP (1) JPH04314877A (en)
KR (1) KR920012518A (en)
MY (1) MY106164A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374500A (en) * 1993-04-02 1994-12-20 International Business Machines Corporation Positive photoresist composition containing photoacid generator and use thereof
KR100764374B1 (en) * 2005-10-31 2007-10-08 주식회사 하이닉스반도체 Composition for removing immersion lithography solution and method of manufacturing semiconductor device including immersion lithography process using same
JP6735717B2 (en) 2017-09-21 2020-08-19 栗田工業株式会社 Steam heating efficiency improvement method and papermaking method

Also Published As

Publication number Publication date
JPH04314877A (en) 1992-11-06
KR920012518A (en) 1992-07-27

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