MY108188A - Electrically conductive copper paste. - Google Patents

Electrically conductive copper paste.

Info

Publication number
MY108188A
MY108188A MYPI92002385A MYPI19922385A MY108188A MY 108188 A MY108188 A MY 108188A MY PI92002385 A MYPI92002385 A MY PI92002385A MY PI19922385 A MYPI19922385 A MY PI19922385A MY 108188 A MY108188 A MY 108188A
Authority
MY
Malaysia
Prior art keywords
parts
weight
electrically conductive
conductive copper
copper paste
Prior art date
Application number
MYPI92002385A
Inventor
Suzuki Kazumi
Machida Koichi
Hatanaka Hirofumi
Fukuda Toru
Nakayama Ichiro
Hoshino Tatsumi
Yokode Seiji
Nishihara Kunio
Original Assignee
Mitsui Toatsu Chemicals Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Incorporated filed Critical Mitsui Toatsu Chemicals Incorporated
Publication of MY108188A publication Critical patent/MY108188A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

AN ELECTRICALLY CONDUCTIVE COPPER PASTE COMPRISING 100 PARTS BY WEIGHT OF A POWDER, 14-25 PARTS BY WEIGHT IN TOTAL OF A MODIFIED HYDROQUINONE RESIN AND A LIQUID EPOXY RESIN AND 5-20 PARTS BY WEIGHT OF AN INORGANIC FILLER. THIS PASTE HAS A FURTHER IMPROVED BALANCE IN PROPERTIES WHEN THE AMOUNT OF THE LIQUID EPOXY RESIN IS 65-80 PARTS BY WEIGHT PER 100 PARTS BY WEIGHT OF THE MODIFIED HYDROQUINONE RESIN AND THE PARTICLE DIAMETER OF THE INORGANIC FILLER IS 0.1 UM TO UM.THE ELECTRICALLY CONDUCTIVE COPPER PASTE HAS A LOW ELECTRICAL RESISTANCE, IS BALANCED IN PRINTABILITY, ADHESION, HEAT RESISTANCE DURING SOLDERING, HEAT STABILITY, HUMIDITY STABILITY, ETC., AND IS BEST SUITED FOR THE PURPOSE OF ELECTROMAGNETIC SHIELDING. ETC.
MYPI92002385A 1991-12-27 1992-12-24 Electrically conductive copper paste. MY108188A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34604891 1991-12-27

Publications (1)

Publication Number Publication Date
MY108188A true MY108188A (en) 1996-08-30

Family

ID=18380787

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92002385A MY108188A (en) 1991-12-27 1992-12-24 Electrically conductive copper paste.

Country Status (4)

Country Link
JP (1) JPH05325636A (en)
KR (1) KR930016000A (en)
GB (1) GB2262743B (en)
MY (1) MY108188A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2320728A (en) * 1996-12-30 1998-07-01 Coates Brothers Plc Depositing a metallic film involving pretreatment
JPH10256687A (en) * 1997-03-14 1998-09-25 Matsushita Electric Ind Co Ltd Conductor paste composition for filling via holes and printed wiring board using the same
JP4803910B2 (en) * 2001-06-27 2011-10-26 三菱鉛筆株式会社 Manufacturing method of fiber guide ink guide member
KR100390638B1 (en) * 2001-07-09 2003-07-07 남애전자 주식회사 Electrically conductive silicone paste
KR20020061469A (en) * 2001-08-04 2002-07-24 김병만 Electric Conduition Nature Pasted For An Electron Parts
KR100403549B1 (en) * 2001-10-31 2003-10-30 남애전자 주식회사 A method for shielding electromagnetic interference waves by using form-in- place type electrically conductive silicone pastes
KR100484246B1 (en) * 2001-12-17 2005-04-20 (주)그린폴 Electroconductive composition containing waste electric wires
JP5907305B1 (en) * 2015-09-10 2016-04-26 東洋インキＳｃホールディングス株式会社 Conductive paste for laser processing
JP6566008B2 (en) * 2017-11-24 2019-08-28 東洋インキＳｃホールディングス株式会社 Electromagnetic shielding sheet and printed wiring board
JP7466348B2 (en) * 2020-03-25 2024-04-12 株式会社タムラ製作所 Anisotropic conductive paste and method for manufacturing electronic substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155114A (en) * 1988-12-06 1990-06-14 Mitsui Toatsu Chem Inc Conductive copper paste
JPH10125311A (en) * 1996-10-25 1998-05-15 Toyota Motor Corp Battery electrode manufacturing method

Also Published As

Publication number Publication date
JPH05325636A (en) 1993-12-10
GB2262743B (en) 1995-11-01
GB2262743A (en) 1993-06-30
KR930016000A (en) 1993-07-24
GB9226903D0 (en) 1993-02-17

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