MY109013A - Reusable fixture for carrier tape - Google Patents

Reusable fixture for carrier tape

Info

Publication number
MY109013A
MY109013A MYPI93001418A MYPI19931418A MY109013A MY 109013 A MY109013 A MY 109013A MY PI93001418 A MYPI93001418 A MY PI93001418A MY PI19931418 A MYPI19931418 A MY PI19931418A MY 109013 A MY109013 A MY 109013A
Authority
MY
Malaysia
Prior art keywords
carrier tape
tape
bottom element
holding members
reusable fixture
Prior art date
Application number
MYPI93001418A
Other languages
English (en)
Inventor
Oshino Fumio
Yamaki Masahiko
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of MY109013A publication Critical patent/MY109013A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5327—Means to fasten by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Packages (AREA)
MYPI93001418A 1992-07-21 1993-07-20 Reusable fixture for carrier tape MY109013A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19417092 1992-07-21

Publications (1)

Publication Number Publication Date
MY109013A true MY109013A (en) 1996-11-30

Family

ID=16320096

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI93001418A MY109013A (en) 1992-07-21 1993-07-20 Reusable fixture for carrier tape

Country Status (6)

Country Link
US (1) US5349236A (2)
EP (1) EP0580410B1 (2)
KR (1) KR960015925B1 (2)
DE (1) DE69306683T2 (2)
MY (1) MY109013A (2)
SG (1) SG48711A1 (2)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0883866A (ja) * 1994-07-15 1996-03-26 Shinko Electric Ind Co Ltd 片面樹脂封止型半導体装置の製造方法及びこれに用いるキャリアフレーム
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
EP0793904B1 (en) 1995-09-22 2003-01-29 Matsushita Electric Industrial Co., Ltd. Part retainer and its manufacturing method as well as part supply apparatus using the part retainer
US5706082A (en) * 1996-05-14 1998-01-06 Alimenterics Inc. Optogalvanic spectroscopy with phase independent detection
US5758776A (en) * 1996-09-12 1998-06-02 Kinetrix, Inc. Integrated circuit tray with flexural bearings
US6687980B1 (en) * 1997-03-04 2004-02-10 Tessera, Inc. Apparatus for processing flexible tape for microelectronic assemblies
US6048744A (en) 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
US5949137A (en) * 1997-09-26 1999-09-07 Lsi Logic Corporation Stiffener ring and heat spreader for use with flip chip packaging assemblies
US7023087B1 (en) * 1998-08-05 2006-04-04 Agere Systems Inc. Integrated circuit carrier and method of manufacturing and integrated circuit
US6991960B2 (en) 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4547794A (en) * 1984-10-17 1985-10-15 Amdahl Corporation Reusable fixture for holding a segment of a flexible strip
US4696526A (en) * 1985-07-26 1987-09-29 Intel Corporation Carrier for tape automated bonded semiconductor device
JPH0628273B2 (ja) * 1987-10-05 1994-04-13 富士通株式会社 Ｉｃ支持フィルムとそれを塔載したキャリア
US4949159A (en) * 1988-08-03 1990-08-14 Byers Photo Equipment Company Carrier for film-mounted integrated circuit
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
EP0472435B1 (en) * 1990-08-22 1995-11-02 Nec Corporation Carrier for film carrier type semiconductor device

Also Published As

Publication number Publication date
EP0580410A2 (en) 1994-01-26
KR940006227A (ko) 1994-03-23
KR960015925B1 (ko) 1996-11-23
SG48711A1 (en) 1998-05-18
EP0580410A3 (2) 1994-03-23
EP0580410B1 (en) 1996-12-18
US5349236A (en) 1994-09-20
DE69306683D1 (de) 1997-01-30
DE69306683T2 (de) 1997-07-03

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