MY110836A - Method and an apparatus for selectively electroplanting apertured metal or metallized products - Google Patents

Method and an apparatus for selectively electroplanting apertured metal or metallized products

Info

Publication number
MY110836A
MY110836A MYPI94000207A MYPI19940207A MY110836A MY 110836 A MY110836 A MY 110836A MY PI94000207 A MYPI94000207 A MY PI94000207A MY PI19940207 A MYPI19940207 A MY PI19940207A MY 110836 A MY110836 A MY 110836A
Authority
MY
Malaysia
Prior art keywords
products
photoresist layer
selectively
electroplanting
apertured metal
Prior art date
Application number
MYPI94000207A
Inventor
Jorg Werner Rischke
Sprang Wilhelmus Gijsbertus Leonardus Van
Original Assignee
Meco Equipment Eng B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equipment Eng B V filed Critical Meco Equipment Eng B V
Publication of MY110836A publication Critical patent/MY110836A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

THE INVENTION RELATES TO A METHOD AND AN APPARATUS FOR SELECTIVELY ELECTROPLATING APERTURED PRODUCTS (31, 32). THE PRODUCTS (31, 32) ARE MASKED IN ACCORDANCE WITH THE INTENDED PLATING AND SUBSEQUENTLY EXPOSED TO AN ELECTROLYTE IN ORDER TO ELECTROPLATE THE PRODUCTS (31, 32). FOR MASKING PURPOSES A FULLY CLOSED PHOTORESIST LAYER IS ELECTROPHORETICALLY APPLIED (18) TO THE PRODUCTS (31, 32) , AND AFTER DRYING (20) OF THE PHOTORESIST LAYER, THE PRODUCTS (31, 32) ARE COVERED WITH A PHOTOMASK (21) IN ACCORDANCE WITH THE LOCATIONS TO BE PLATED, AFTER WHICH EXPOSURE TAKES PLACE. THEN THE PHOTORESIST LAYER IS PARTIALLY REMOVED (22), WHILST THE REMAINING PART OF THE PHOTORESIST LAYER REMAINS BEHIND ON THE PRODUCTS (31, 32), TO SERVE AS A MASK FOR THE METAL PRODUCTS UPON ELECTROPLATING (24, 25). (FIG. 22)
MYPI94000207A 1993-01-28 1994-01-26 Method and an apparatus for selectively electroplanting apertured metal or metallized products MY110836A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9300174A NL9300174A (en) 1993-01-28 1993-01-28 Method and apparatus for electrolytically applying metal coatings to apertured metal or metallized products locally.

Publications (1)

Publication Number Publication Date
MY110836A true MY110836A (en) 1999-05-31

Family

ID=19861992

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94000207A MY110836A (en) 1993-01-28 1994-01-26 Method and an apparatus for selectively electroplanting apertured metal or metallized products

Country Status (11)

Country Link
US (2) US5512154A (en)
EP (1) EP0616052B1 (en)
JP (1) JP2780920B2 (en)
KR (1) KR100314946B1 (en)
AT (1) ATE154835T1 (en)
DE (1) DE69403926T2 (en)
HK (1) HK1000135A1 (en)
MY (1) MY110836A (en)
NL (1) NL9300174A (en)
SG (1) SG48345A1 (en)
TW (1) TW410818U (en)

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US5609995A (en) * 1995-08-30 1997-03-11 Micron Technology, Inc. Method for forming a thin uniform layer of resist for lithography
US5925410A (en) * 1997-05-06 1999-07-20 Micron Technology, Inc. Vibration-enhanced spin-on film techniques for semiconductor device processing
US5985123A (en) * 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating
TW522455B (en) * 1998-11-09 2003-03-01 Ebara Corp Plating method and apparatus therefor
EP1071000A1 (en) * 1999-07-23 2001-01-24 Damian Rickenbach Method for shaping surfaces of parts of watch
DE10135349A1 (en) † 2001-07-20 2003-02-06 Imo Ingo Mueller E K Process for selectively galvanizing strip-like metallic carrier material in continuous pass involves selectively coating carrier material with electrophoretic lacquer in electrophoretic lacquer coating device forming strips
EP1563119A4 (en) * 2001-08-31 2006-03-22 Semitool Inc Apparatus and method for deposition of an electrophoretic emulsion
US20040055893A1 (en) * 2002-09-23 2004-03-25 Applied Materials, Inc. Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing
DE102005031948B3 (en) 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Device for electrolytically treating strip-like material comprises contact rollers made from metal arranged on at least one side of the material and counter rollers arranged on the opposite-lying side of the strip as a contact pair
JP4836628B2 (en) * 2006-03-27 2011-12-14 株式会社中央製作所 Long sheet plating method and apparatus
US7887687B2 (en) * 2006-08-22 2011-02-15 Deere & Company Method and system for coating a workpiece
DE102007009671A1 (en) * 2007-02-28 2008-09-04 Hirschmann Automotive Gmbh Method for covering several punched grids
NL1035265C2 (en) * 2008-04-07 2009-10-08 Meco Equip Eng Method and device for the electroplating of non-metallic glassy substrates.
KR101268297B1 (en) * 2011-07-12 2013-05-28 주식회사 에이에스티젯텍 Feeding belt for strip-shaped elements
KR101288347B1 (en) * 2011-09-29 2013-07-22 주식회사 에이에스티젯텍 Feeding belt for strip-shaped elements
JP6736395B2 (en) * 2016-07-12 2020-08-05 ヒロセ電機株式会社 Terminal manufacturing method, connector manufacturing method, terminal manufacturing apparatus and connector manufacturing apparatus
US20180088628A1 (en) * 2016-09-28 2018-03-29 Intel Corporation Leadframe for surface mounted contact fingers
JP2021021126A (en) * 2019-07-30 2021-02-18 三共株式会社 Plating jig, and plating method
CN111455438B (en) * 2020-03-11 2022-07-15 贵州振华群英电器有限公司（国营第八九一厂） Local electroplating fixture for relay base
CN113652733A (en) * 2021-08-18 2021-11-16 刘智 Circuit board silver plating equipment capable of saving electroplating materials for integrated circuit production

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Publication number Priority date Publication date Assignee Title
US3471389A (en) * 1966-08-26 1969-10-07 Du Pont Electrocoating process wherein the initial amperage surge is controlled
NL170027C (en) * 1971-05-25 1982-09-16 Galentan Ag IMPROVEMENT OF AN ELECTROLYTE DISTRIBUTOR DIVIDABLE BY A FIXED AXLE.
US3879277A (en) * 1973-04-27 1975-04-22 Armco Steel Corp Method and apparatus for electropainting small articles
DE2324834C2 (en) * 1973-05-17 1978-09-07 Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Device for continuous selective strip electroplating
JPS5648198A (en) * 1979-09-26 1981-05-01 Matsushita Electric Industrial Co Ltd Method of manufacturing flexible printed circuit board
EP0055130B1 (en) * 1980-12-23 1984-07-25 S.G. Owen Limited Improvements in or relating to selective plating
NL8101106A (en) * 1981-03-07 1982-10-01 Galentan Ag DEVICE FOR GALVANIC APPLICATION OF STAIN COATINGS.
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
US4404079A (en) * 1982-02-08 1983-09-13 National Semiconductor Corporation Plating mask support
DE3230660C1 (en) * 1982-08-02 1984-01-26 Basf Farben + Fasern Ag, 2000 Hamburg Method and device for carrying out electro-dipping and application
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JPH0660440B2 (en) * 1986-07-22 1994-08-10 トヨタ自動車株式会社 Electrodeposition coating method
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JPH0774475B2 (en) * 1989-09-20 1995-08-09 株式会社ジャパンエナジー Pretreatment liquid for silver plating
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US5202222A (en) * 1991-03-01 1993-04-13 Shipley Company Inc. Selective and precise etching and plating of conductive substrates

Also Published As

Publication number Publication date
JP2780920B2 (en) 1998-07-30
SG48345A1 (en) 1998-04-17
US5512154A (en) 1996-04-30
KR940018487A (en) 1994-08-18
NL9300174A (en) 1994-08-16
DE69403926D1 (en) 1997-07-31
KR100314946B1 (en) 2002-02-19
DE69403926T2 (en) 1998-01-02
EP0616052A1 (en) 1994-09-21
ATE154835T1 (en) 1997-07-15
JPH0774300A (en) 1995-03-17
TW410818U (en) 2000-11-01
EP0616052B1 (en) 1997-06-25
HK1000135A1 (en) 1997-12-19
US5702583A (en) 1997-12-30

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