MY111987A - Heat resistant resin composition, heat resistant film adhesive and process for producing the same - Google Patents
Heat resistant resin composition, heat resistant film adhesive and process for producing the sameInfo
- Publication number
- MY111987A MY111987A MYPI95000472A MYPI19950472A MY111987A MY 111987 A MY111987 A MY 111987A MY PI95000472 A MYPI95000472 A MY PI95000472A MY PI19950472 A MYPI19950472 A MY PI19950472A MY 111987 A MY111987 A MY 111987A
- Authority
- MY
- Malaysia
- Prior art keywords
- heat resistant
- resin composition
- film adhesive
- producing
- resistant film
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 229920006015 heat resistant resin Polymers 0.000 title abstract 3
- 239000011342 resin composition Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- -1 HYDROGEN GROUP Chemical group 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
A HEAT RESISTANT RESIN COMPOSITION COMPRISING, AS THE MAIN COMPONENTS,(A) 100 PARTS BY WEIGHT OF AN ORGANIC SOLVENT-SOLUBLE POLYIMIDE RESIN HAVING A GLASS TRANSITION TEMPERA-TURE .OF 350?C OR LESS,(B) 5 TO 100 PARTS BY WEIGHT OF AN EPOXY COMPOUND HAVING AT LEAST TWO EPOXY GROUPS IN ONE MOLECULE,AND(C) 0.1 TO 20 PARTS BY WEIGHT OF A COMPOUND HAVING AN ACTIVE HYDROGEN GROUP WHICH CAN REACT WITH THEEPOXY COMPOUND (B),A HEAT RESISTANT FILM ADHESIVE COMPRISING, AS THE MAIN COMPONENTS, THE ABOVE COMPONENTS (A), (B) AND (C), AND A PROCESS FOR PRODUCING A HEAT RESISTANT FILM ADHESIVE BY CASTING A SOLUTION OF THE ABOVE HEAT RESISTANT RESIN COMPOSITION ON ONE SIDE OR BOTH SIDES OF A SUPPORT.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6036887A JP3014578B2 (en) | 1994-03-08 | 1994-03-08 | Resin composition with improved properties at high temperatures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY111987A true MY111987A (en) | 2001-03-31 |
Family
ID=12482296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI95000472A MY111987A (en) | 1994-03-08 | 1995-02-24 | Heat resistant resin composition, heat resistant film adhesive and process for producing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3014578B2 (en) |
| MY (1) | MY111987A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996029730A1 (en) | 1994-12-26 | 1996-09-26 | Hitachi Chemical Company, Ltd. | Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device |
| US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| TW310481B (en) | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
| DE69738783D1 (en) | 1996-10-08 | 2008-07-31 | Hitachi Chemical Co Ltd | SEMICONDUCTOR ARRANGEMENT, SEMICONDUCTOR CHIP SUPPLEMENT, ARRANGEMENT METHOD FOR ARRANGEMENT AND SUBSTRATE, ADHESIVE AND DOUBLE-SIDED ADHESIVE TAPE |
| JP4008249B2 (en) * | 2001-01-31 | 2007-11-14 | 住友ベークライト株式会社 | Insulating resin composition, insulating resin sheet and printed wiring board |
| DE60327695D1 (en) * | 2002-05-30 | 2009-07-02 | Mitsui Chemicals Inc | ADHESIVE RESIN AND PRODUCED FILM ADHESIVES THEREOF |
| JP4695512B2 (en) | 2003-06-05 | 2011-06-08 | 株式会社カネカ | Phosphazene compound, photosensitive resin composition and use thereof |
| KR101058632B1 (en) | 2006-08-04 | 2011-08-22 | 히다치 가세고교 가부시끼가이샤 | Film adhesive, adhesive sheet and semiconductor device using same |
| JP5445455B2 (en) | 2008-08-04 | 2014-03-19 | 日立化成株式会社 | Adhesive composition, film adhesive, adhesive sheet and semiconductor device |
| SG11201805612PA (en) * | 2016-02-08 | 2018-07-30 | Toray Industries | Resin Composition, Resin Layer, Permanent Adhesive, Adhesive For Temporary Bonding, Laminated Film, Processed Wafer, And Method For Manufacturing Electronic Component Or Semiconductor Device |
-
1994
- 1994-03-08 JP JP6036887A patent/JP3014578B2/en not_active Expired - Fee Related
-
1995
- 1995-02-24 MY MYPI95000472A patent/MY111987A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07242820A (en) | 1995-09-19 |
| JP3014578B2 (en) | 2000-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE208410T1 (en) | LIQUID SILICONE RUBBER WITH REDUCED COMPRESSION SET | |
| NO954435L (en) | Process for resin injection molding | |
| AU564441B2 (en) | Epoxy resin composition | |
| MY111987A (en) | Heat resistant resin composition, heat resistant film adhesive and process for producing the same | |
| ATE107677T1 (en) | EPOXY RESIN BLENDS. | |
| MY110415A (en) | Polyarylene sulfide resin compositions | |
| GB2148900B (en) | Curable compositions | |
| TW354793B (en) | Polycarbonate resin with high flowability and process for producing the same | |
| FI906436A0 (en) | ORGANISKA, SVAVEL INNEHAOLLANDE POLYFLUORFOERENINGAR. | |
| FR2434118B1 (en) | ||
| JPS53120761A (en) | Polyamide resin composition | |
| BR8406282A (en) | PROCESS FOR THE PREPARATION OF ITEMS HAVING HIGH RESISTANCE TO TRACTION AND A HIGH MODULE, ITEMS SO OBTAINED AND POLYACRYLONITRILLA FILAMENTS | |
| ES8404970A1 (en) | DECOMPOSITION PROCEDURE OF ORTHOBENZOILBENZOIC ACID COMPLEXES, HYDROGEN FLUORIDE, BORO TRIFLUORIDE | |
| EP0397860A4 (en) | Epoxy resin composition | |
| DE59501989D1 (en) | CONDENSATION AND ADDITION POLYMERS WITH N, N'-BRIDGED TO TETRAMETHYL PIPERIDINYLOXY GROUPS | |
| TW200505957A (en) | Curable resin composition | |
| FR2605636B1 (en) | DIAMINE-FREE IMIDE GROUP POLYMERS AND PROCESSES FOR THEIR PREPARATION | |
| JPS6420241A (en) | Primer composition | |
| JPS5514226A (en) | Method of molding carbon fiber reinforced plastics | |
| JPS6411238A (en) | Organic nonlinear optical material | |
| JPS52117388A (en) | Method of bonding treatment | |
| JPS5670030A (en) | Production of prepreg | |
| IT1215403B (en) | PROTECTIVE HELMETS CONSISTING OF ESSENTIAL POLYISOCYANURIC BASED COMPOSITES | |
| JPS5794720A (en) | Liquid crystal display element | |
| JPS56159218A (en) | Epoxy resin composition |