MY112247A - Chip carrier with protective coating for circuitized surface - Google Patents

Chip carrier with protective coating for circuitized surface

Info

Publication number
MY112247A
MY112247A MYPI94001948A MYPI19941948A MY112247A MY 112247 A MY112247 A MY 112247A MY PI94001948 A MYPI94001948 A MY PI94001948A MY PI19941948 A MYPI19941948 A MY PI19941948A MY 112247 A MY112247 A MY 112247A
Authority
MY
Malaysia
Prior art keywords
encapsulant
chip carrier
circuitized surface
composition
protective coating
Prior art date
Application number
MYPI94001948A
Inventor
Walter Chase Alan
Warren Wilson James
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of MY112247A publication Critical patent/MY112247A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A CHIP CARRIER IS DISCLOSED WHICH INCLUDES A CHIP CARRIER SUBSTRATE AND AT LEAST ONE SEMICONDUCTOR CHIP MOUNTED IN A FLIP CHIP CONFIGURATION, VIA SOLDER BALLS, ON A CIRCUITIZED SURFACE OF THE CHIP CARRIER SUBSTRATE. THE SOLDER BALLS ARE ENCAPSULATED IN A FIRST ENCAPSULANT HAVING A COMPOSITION WHICH INCLUDES AN EPOXY. IN ADDITION, AT LEAST A PORTION OF THE CIRCUITRY ON THE CIRCUITIZED SURFACE IS ENCAPSULATED IN A SECOND ENCAPSULANT HAVING A COMPOSITION WHICH INCLUDES A URETHANE, AND WHICH COMPOSITION IS CHOSEN SO THAT THE SECOND ENCAPSULANT EXHIBITS A MODULUS OF ELASTICITY WHICH IS EQUAL TO OR LESS THAN ABOUT 10,000 PSI. AS A CONSEQUENCE, THE SECOND ENCAPSULANT EXHIBITS NEITHER INTERNAL CRACKS, NOR INTERFACIAL CRACKS AT THE INTERFACE WITH THE FIRST ENCAPSULANT, NOR DOES THE SECOND ENCAPSULANT DELAMINATE FROM THE CIRCUITIZED SURFACE, WHEN THE CHIP CARRIER IS THERMALLY CYCLED.FIG. 1
MYPI94001948A 1993-08-03 1994-07-27 Chip carrier with protective coating for circuitized surface MY112247A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/101,168 US5390082A (en) 1992-07-06 1993-08-03 Chip carrier with protective coating for circuitized surface

Publications (1)

Publication Number Publication Date
MY112247A true MY112247A (en) 2001-05-31

Family

ID=22283349

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94001948A MY112247A (en) 1993-08-03 1994-07-27 Chip carrier with protective coating for circuitized surface

Country Status (10)

Country Link
US (1) US5390082A (en)
EP (1) EP0637839B1 (en)
JP (1) JP2723123B2 (en)
KR (1) KR0177138B1 (en)
CN (2) CN1051402C (en)
BR (1) BR9402986A (en)
CA (1) CA2126121C (en)
DE (1) DE69418395T2 (en)
MY (1) MY112247A (en)
TW (1) TW265464B (en)

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* Cited by examiner, † Cited by third party
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JP2643074B2 (en) * 1993-03-17 1997-08-20 インターナショナル・ビジネス・マシーンズ・コーポレイション Electrical connection structure
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
US6150716A (en) * 1995-01-25 2000-11-21 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US5677511A (en) * 1995-03-20 1997-10-14 National Semiconductor Corporation Overmolded PC board with ESD protection and EMI suppression
US6404049B1 (en) 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
KR100386018B1 (en) * 1996-06-24 2003-08-25 인터내셔널 비지네스 머신즈 코포레이션 Stacked Semiconductor Device Package
US5811883A (en) * 1996-09-30 1998-09-22 Intel Corporation Design for flip chip joint pad/LGA pad
US5760337A (en) * 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
US5840215A (en) * 1996-12-16 1998-11-24 Shell Oil Company Anisotropic conductive adhesive compositions
HUP9701377A3 (en) * 1997-01-15 2000-01-28 Ibm Case and method for mouting an ic chip onto a carrier board or similar
US6403882B1 (en) * 1997-06-30 2002-06-11 International Business Machines Corporation Protective cover plate for flip chip assembly backside
GB9814317D0 (en) * 1997-07-23 1998-09-02 Murata Manufacturing Co Ceramic electronic part and method for producing the same
US6326696B1 (en) 1998-02-04 2001-12-04 International Business Machines Corporation Electronic package with interconnected chips
US6177726B1 (en) * 1999-02-11 2001-01-23 Philips Electronics North America Corporation SiO2 wire bond insulation in semiconductor assemblies
US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
US6506448B1 (en) 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
KR100672130B1 (en) * 1999-07-08 2007-01-19 산스타 기켄 가부시키가이샤 Underfill Materials for Semiconductor Packages
US6439698B1 (en) 2000-01-14 2002-08-27 Lexmark International, Inc Dual curable encapsulating material
JP2001222751A (en) * 2000-02-14 2001-08-17 Toshiba Electric Appliance Co Ltd Vending machine temperature controller
JP3604988B2 (en) 2000-02-14 2004-12-22 シャープ株式会社 Semiconductor device and manufacturing method thereof
CN1310573C (en) * 2000-10-11 2007-04-11 奥尔约恩有限责任公司 Membranous EL structure with UV-cured urethane envelope
US6425655B1 (en) 2001-06-05 2002-07-30 Lexmark International, Inc. Dual curable encapsulating material
EP1424728A1 (en) * 2002-11-27 2004-06-02 Abb Research Ltd. Power semiconductor module
JP2005002335A (en) * 2003-05-21 2005-01-06 Japan Gore Tex Inc Adhesive film and semiconductor device using the same
JP4378239B2 (en) * 2004-07-29 2009-12-02 株式会社日立製作所 A semiconductor device, a power conversion device using the semiconductor device, and a hybrid vehicle using the power conversion device.
US8710618B2 (en) 2007-03-12 2014-04-29 Honeywell International Inc. Fibrous laminate interface for security coatings
US8957509B2 (en) * 2011-06-23 2015-02-17 Stats Chippac Ltd. Integrated circuit packaging system with thermal emission and method of manufacture thereof
US9064820B2 (en) 2012-04-05 2015-06-23 Mekiec Manufacturing Corporation (Thailand) Ltd Method and encapsulant for flip-chip assembly
JP6386746B2 (en) * 2014-02-26 2018-09-05 株式会社ジェイデバイス Semiconductor device
CN116536155B (en) * 2023-05-17 2024-04-09 扬州大学 A chip culture device and its use method

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JPS6018145B2 (en) * 1980-09-22 1985-05-09 株式会社日立製作所 Resin-encapsulated semiconductor device
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Also Published As

Publication number Publication date
CN1228613A (en) 1999-09-15
KR950007621A (en) 1995-03-21
CN1103734A (en) 1995-06-14
US5390082A (en) 1995-02-14
CN1051402C (en) 2000-04-12
CA2126121C (en) 1997-09-16
DE69418395T2 (en) 1999-12-16
DE69418395D1 (en) 1999-06-17
BR9402986A (en) 1995-07-18
EP0637839A3 (en) 1995-06-28
KR0177138B1 (en) 1999-03-20
TW265464B (en) 1995-12-11
EP0637839B1 (en) 1999-05-12
CN1142589C (en) 2004-03-17
JP2723123B2 (en) 1998-03-09
JPH0778914A (en) 1995-03-20
CA2126121A1 (en) 1995-02-04
EP0637839A2 (en) 1995-02-08

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