MY112694A - Metallic electronic component packaging arrangement - Google Patents
Metallic electronic component packaging arrangementInfo
- Publication number
- MY112694A MY112694A MYPI97000108A MYPI19970108A MY112694A MY 112694 A MY112694 A MY 112694A MY PI97000108 A MYPI97000108 A MY PI97000108A MY PI19970108 A MYPI19970108 A MY PI19970108A MY 112694 A MY112694 A MY 112694A
- Authority
- MY
- Malaysia
- Prior art keywords
- bonding layer
- electronic component
- aluminum base
- semiconductor chip
- packaging arrangement
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 5
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 230000002411 adverse Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A PACKAGING ARRANGEMENT SUITABLE FOR SEMICONDUCTOR DEVICES, IN WHICH A SEMICONDUCTOR CHIP IS MOUNTED ON A SURFACE OF AN ALUMINUM BASE WITH A BONDING LAYER INTERPOSED THEREBETWEEN. THE ALUMINUM BASE HAS A CAPABILITY TO FAVORABLY DISSIPATE HEAT FROM THE SEMICONDUCTOR CHIP. THE BONDING LAYER CONSISTS OF A RESILIENT AND HEAT CONDUCTIVE MATERIAL SUCH AS SILICONE RESIN MIXED WITH SILVER POWDER SO THAT THERMAL STRAIN OF THE METAL BASE IS ACCOMMODATED BY THE RESILIENCY OF THE BONDING LAYER, AND IS PREVENTED FROM ADVERSELY AFFECTING THE ELECTRONIC COMPONENT CHIP EVEN THOUGH THE ALUMINUM BASE DEMONSTRATES A SUBSTANTIALLY MORE SIGNIFICANT THERMAL EXPANSION THAN THE SEMICONDUCTOR CHIP. IN IS THEREFORE POSSIBLE TO ACHIEVE A HIGH RELIABILITY IN THE PACKAGING OF SEMICONDUCTOR DEVICES AT A MINIMUM COST.(FIG. 2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8079435A JPH09186266A (en) | 1995-10-31 | 1996-03-06 | Semiconductor package |
| JP8238612A JPH1064928A (en) | 1996-08-21 | 1996-08-21 | Semiconductor device using metal base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY112694A true MY112694A (en) | 2001-07-31 |
Family
ID=81345061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI97000108A MY112694A (en) | 1996-03-06 | 1997-01-10 | Metallic electronic component packaging arrangement |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY112694A (en) |
-
1997
- 1997-01-10 MY MYPI97000108A patent/MY112694A/en unknown
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