MY113701A - Flame-resistant adhessive coated copper foil and copper clad laminate manufactured using the same. - Google Patents
Flame-resistant adhessive coated copper foil and copper clad laminate manufactured using the same.Info
- Publication number
- MY113701A MY113701A MYPI93002832A MYPI19932832A MY113701A MY 113701 A MY113701 A MY 113701A MY PI93002832 A MYPI93002832 A MY PI93002832A MY PI19932832 A MYPI19932832 A MY PI19932832A MY 113701 A MY113701 A MY 113701A
- Authority
- MY
- Malaysia
- Prior art keywords
- clad laminate
- copper foil
- adhessive
- flame
- resistant
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 6
- 239000010949 copper Substances 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000011889 copper foil Substances 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical compound BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052794 bromium Inorganic materials 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 239000005056 polyisocyanate Substances 0.000 abstract 1
- 229920001228 polyisocyanate Polymers 0.000 abstract 1
- 229920006324 polyoxymethylene Polymers 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
- ORGHESHFQPYLAO-UHFFFAOYSA-N vinyl radical Chemical class C=[CH] ORGHESHFQPYLAO-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
ADHESIVE COATED COPPER FOIL AND COPPER CLAD LAMINATE MANUFACTURED BY LAMINATING THE ADHESIVE COATED COPPER FOIL TO AT LEAST ONE SIDE OF BASE MATERIAL. THE ADHESIVE COMPRISES POLY(VINYL ACETAL) RESIN, EPOXY RESIN, POLYISOCYANATE RESIN, AND POLYESTER RESIN CONTAINING BROMINE. PRINTED CIRCUIT BOARDS MADE OF THE COPPER CLAD LAMINATE HAVE BOTH OF A HIGH ANTI-TRACKING PROPERTY AND A HIGH FLAME RESISTANCE ALONG WITH A PEEL STRENGTH AND HEAT RESISTANCE EQUAL TO THOSE OF CONVENTIONAL PRINTED CIRCUIT BOARDS
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5476593A JPH06240214A (en) | 1993-02-19 | 1993-02-19 | Flame-retardant adhesive coated copper foil and copper clad laminate using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY113701A true MY113701A (en) | 2002-05-31 |
Family
ID=12979873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI93002832A MY113701A (en) | 1993-02-19 | 1993-12-24 | Flame-resistant adhessive coated copper foil and copper clad laminate manufactured using the same. |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH06240214A (en) |
| MY (1) | MY113701A (en) |
| TW (1) | TW263468B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI354152B (en) | 2007-08-28 | 2011-12-11 | Au Optronics Corp | Backlight module and liquid crystal display contai |
| JP4707700B2 (en) * | 2007-11-02 | 2011-06-22 | 東洋アルミニウム株式会社 | Metal foil laminate for etching and method for producing etched metal foil |
| CN102264855B (en) * | 2008-12-26 | 2014-03-12 | 东洋纺织株式会社 | Resin composition for adhesive, adhesive comprising same, adhesive sheet, and printed wiring board including same as adhesive layer |
-
1993
- 1993-02-19 JP JP5476593A patent/JPH06240214A/en active Pending
- 1993-10-26 TW TW82108892A patent/TW263468B/zh active
- 1993-12-24 MY MYPI93002832A patent/MY113701A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06240214A (en) | 1994-08-30 |
| TW263468B (en) | 1995-11-21 |
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