MY115159A - Solder. - Google Patents

Solder.

Info

Publication number
MY115159A
MY115159A MYPI94002985A MYPI9402985A MY115159A MY 115159 A MY115159 A MY 115159A MY PI94002985 A MYPI94002985 A MY PI94002985A MY PI9402985 A MYPI9402985 A MY PI9402985A MY 115159 A MY115159 A MY 115159A
Authority
MY
Malaysia
Prior art keywords
tin
lead alloy
alloy solder
solder
condinations
Prior art date
Application number
MYPI94002985A
Inventor
Yasuji Kawashima
Takashi Nagashima
Akihiko Matsuike
Takeshi Meguro
Kaoru Shimizu
Hideo Chaki
Toshiaki Ogura
Original Assignee
Nippon Genma Kk
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Genma Kk, Matsushita Electric Industrial Co Ltd filed Critical Nippon Genma Kk
Publication of MY115159A publication Critical patent/MY115159A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Paper (AREA)

Abstract

A TIN - LEAD ALLOY SOLDER IS PROVIDED WHICH EXHIBITS HIGH JOIN STRENGTH UNDER CONDINATIONS WHICE ARE LIKELY TO INDUCE FATIGUE FRACTURE. THE TIN - LEAD ALLOY SOLDER COMPIRSES 15 - 80 WT. EAD, 0.1-5 WT. ILVER, 0.1-10 WT. ANTIOMONY, AND 0.0005 - 0.3 PHOSPHORUS, THE BALANCE BEING TIN. (FIG.1)
MYPI94002985A 1993-11-09 1994-11-09 Solder. MY115159A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27938193 1993-11-09
JP6053489A JP2677760B2 (en) 1993-11-09 1994-03-24 Solder

Publications (1)

Publication Number Publication Date
MY115159A true MY115159A (en) 2003-04-30

Family

ID=17610354

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94002985A MY115159A (en) 1993-11-09 1994-11-09 Solder.

Country Status (4)

Country Link
JP (1) JP2677760B2 (en)
KR (1) KR100259311B1 (en)
MY (1) MY115159A (en)
TW (2) TW291455B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033488A (en) * 1996-11-05 2000-03-07 Samsung Electronics Co., Ltd. Solder alloy
KR100230269B1 (en) * 1996-12-31 1999-11-15 윤종용 Solder Alloys for Soldering
JP2002153990A (en) 2000-11-21 2002-05-28 Senju Metal Ind Co Ltd Alloy for solder balls
JP3599101B2 (en) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ Solder, surface treatment method of printed wiring board using the same, and mounting method of electronic component using the same
CN100413633C (en) * 2003-09-05 2008-08-27 中国科学院金属研究所 A kind of oxidation-resistant tin-lead alloy solder
US8493746B2 (en) 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
US8128868B2 (en) 2009-02-12 2012-03-06 International Business Machines Corporation Grain refinement by precipitate formation in PB-free alloys of tin
CN101920405B (en) * 2010-08-23 2013-07-31 中国电力科学研究院 Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof
CN115781100B (en) * 2023-01-29 2023-05-02 河北钢研德凯科技有限公司 Magnesium alloy welding wire and preparation method and application thereof
CN117620515A (en) * 2023-12-08 2024-03-01 北京有色金属与稀土应用研究所有限公司 Preparation method of high thermal conductivity eutectic medium temperature solder and foil strip for TR component packaging

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153857A (en) * 1983-02-21 1984-09-01 Taruchin Kk Alloy for forming joint
JPS61273296A (en) * 1985-05-29 1986-12-03 Taruchin Kk Corrosion resistant solder alloy
JPH02101132A (en) * 1988-10-11 1990-04-12 Ichiro Kawakatsu Low melting point solder
JP2731277B2 (en) * 1990-02-28 1998-03-25 株式会社東芝 Die bonding solder

Also Published As

Publication number Publication date
JP2677760B2 (en) 1997-11-17
TW291455B (en) 1996-11-21
TW305899B (en) 1997-05-21
JPH07178587A (en) 1995-07-18
KR100259311B1 (en) 2000-06-15
KR950014341A (en) 1995-06-15

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