MY116826A - Solder alloy. - Google Patents

Solder alloy.

Info

Publication number
MY116826A
MY116826A MYPI9403119A MY116826A MY 116826 A MY116826 A MY 116826A MY PI9403119 A MYPI9403119 A MY PI9403119A MY 116826 A MY116826 A MY 116826A
Authority
MY
Malaysia
Prior art keywords
alloy
soft
soldered
weight
solder alloy
Prior art date
Application number
Inventor
Toshihiko Taguchi
Rikiya Katoh
Osamu Munekata
Yoshitaka Toyoda
Original Assignee
Senju Metal Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Company Ltd filed Critical Senju Metal Industry Company Ltd
Publication of MY116826A publication Critical patent/MY116826A/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

THE SOLDERED PARTS OF ELECTRONIC MACHINES, WHILE SUBJECTED TO REPEATED ALTERNATING PHASES OF LOW AND HIGH TEMPERATURES, TEND TO CRACK DUE TO LONG - TERM CYCLES OF HEAT CHANGES. THE FOLLOWING INVENTION IS MEANT TO RECTIFY SUCH A PHYSICAL ANOMALY BY PROVIDING A TYPE OF SOFT SOLDERING ALLOY TO PREVENT CRACKS CAUSED BY SUCH THERMAL CHANGES. THE INVENTION ADDS ON TO THE SOFT SOLDERED ALLOY EUTECTIC WHICH IS COMPOSED OF 60 TO 70TIN IN WEIGHT AS WELL AS THE FOLLOWING ELEMENTS (BY WEIGHT) : 0.2 TO 2.0 ANTIMONY, 0.005 TO 0.2 NICKEL, AND/OR 0.1 TO 2.0 ILVER. THIS GIVES RISE TO A SOFT SOLDERED ALLOY WITH GREATER FATIGUE STRENGTH.
MYPI9403119 1994-05-06 1994-11-23 Solder alloy. MY116826A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11608594A JP3254901B2 (en) 1994-05-06 1994-05-06 Solder alloy

Publications (1)

Publication Number Publication Date
MY116826A true MY116826A (en) 2004-04-30

Family

ID=14678345

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9403119 MY116826A (en) 1994-05-06 1994-11-23 Solder alloy.

Country Status (3)

Country Link
JP (1) JP3254901B2 (en)
MY (1) MY116826A (en)
TW (1) TW323304B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033488A (en) * 1996-11-05 2000-03-07 Samsung Electronics Co., Ltd. Solder alloy
JP3752064B2 (en) * 1997-05-23 2006-03-08 内橋エステック株式会社 Solder material and electronic component using the same
CN101279406B (en) 2008-05-27 2011-04-13 重庆理工大学 A lead-containing solder that suppresses lead volatilization and pollutes the environment
CN108788511A (en) * 2018-06-25 2018-11-13 深圳市博士达焊锡制品有限公司 It is a kind of to have kupper solder and preparation method thereof with high anti-oxidation ability

Also Published As

Publication number Publication date
JPH07299585A (en) 1995-11-14
JP3254901B2 (en) 2002-02-12
TW323304B (en) 1997-12-21

Similar Documents

Publication Publication Date Title
US10322471B2 (en) Low temperature high reliability alloy for solder hierarchy
NO20032185D0 (en) Lead-free solder
TW360578B (en) Lead-free solder used for connecting electronic parts on organic substrate
KR870005940A (en) Copper-silver-titanium filler metal for direct brazing of structural ceramics
TW528638B (en) Lead-free solders
EP1381066A3 (en) Alloy type thermal fuse and wire member for a thermal fuse element
ES8502167A1 (en) Nickel-chromium-molybdenum alloy.
JPS5464049A (en) Bonding of metals or alloys
CA2122376A1 (en) Solder alloy having decreased fatigue rupture occurring on soldered joints exposed to heat cycle stress
GB1062006A (en) Semiconductor device with flexible lead
JPH0671480A (en) Solder alloy
JP2002153990A (en) Alloy for solder balls
JPS5471747A (en) Copper base brazing alloy
JPS57169048A (en) High strength copper alloy with high electric conductivity
Adile et al. Effect of the geometry of soldered joints on mechanical fatigue behavior in the soldering of surface mounted electronic devices
Duret et al. Presentation of a" User's Guide to Materials for Gas Turbine Corrosion Prevention"
JPS5693862A (en) Adhering method of exterior parts for portable watch
JPS60257031A (en) Method of producing fuse
DE59206877D1 (en) Handle for a saucepan
Lavelle et al. Metal-Enamel Interfacial Thermal Stress Estimation by a Vickers Indentation Method
Kawashima et al. Solder
Kremmler Recent Analyses and Uses of Hardenable Spring Materials
TH1302C3 (en) High temperature solder Lead-free
TH1302A3 (en) High temperature solder Lead-free
DE50000257D1 (en) Use of a copper-tin-iron alloy