MY117193A - Radio frequency identification tag circuit chip having printed interconnection pads - Google Patents

Radio frequency identification tag circuit chip having printed interconnection pads

Info

Publication number
MY117193A
MY117193A MYPI99003902A MYPI9903902A MY117193A MY 117193 A MY117193 A MY 117193A MY PI99003902 A MYPI99003902 A MY PI99003902A MY PI9903902 A MYPI9903902 A MY PI9903902A MY 117193 A MY117193 A MY 117193A
Authority
MY
Malaysia
Prior art keywords
circuit chip
radio frequency
frequency identification
identification tag
tag circuit
Prior art date
Application number
MYPI99003902A
Inventor
Noel H Eberhardt
Original Assignee
Motorola Mobility Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Mobility Inc filed Critical Motorola Mobility Inc
Publication of MY117193A publication Critical patent/MY117193A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Burglar Alarm Systems (AREA)

Abstract

A RADIO FREQUENCY IDENTIFICATION TAG CIRCUIT CHIP (10) INCLUDES A CIRCUIT CHIP (11) HAVING A SURFACE (18) AND AT LEAST ONE INTERCONNECTION PAD (12, 14) FORMED IN THE SURFACE (18). A LAYER (24) OF INSULATING MATERIAL IS DEPOSITED ON THE SURFACE AND ABOUT THE AT LEAST ONE INTERCONNECTION PAD (12, 14), AND A LAYER OF CONDUCTIVEMATERIAL (26) IS DEPOSITED ON THE INSULATING MATERIAL AND COUPLING TO THE INTERCONNECTION PAD (12, 14). (FIGURE 1)
MYPI99003902A 1998-09-11 1999-09-09 Radio frequency identification tag circuit chip having printed interconnection pads MY117193A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9991398P 1998-09-11 1998-09-11

Publications (1)

Publication Number Publication Date
MY117193A true MY117193A (en) 2004-05-31

Family

ID=22277221

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99003902A MY117193A (en) 1998-09-11 1999-09-09 Radio frequency identification tag circuit chip having printed interconnection pads

Country Status (4)

Country Link
AU (1) AU5704499A (en)
MY (1) MY117193A (en)
TW (1) TW455826B (en)
WO (1) WO2000016279A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693541B2 (en) 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
US8698262B2 (en) 2004-09-14 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and manufacturing method of the same
US20060202269A1 (en) 2005-03-08 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and electronic appliance having the same
CN112163659A (en) * 2020-09-09 2021-01-01 北京智芯微电子科技有限公司 Miniature electronic tag and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3154713B2 (en) * 1990-03-16 2001-04-09 株式会社リコー Anisotropic conductive film and method for manufacturing the same
JP2716336B2 (en) * 1993-03-10 1998-02-18 日本電気株式会社 Integrated circuit device
US5495250A (en) * 1993-11-01 1996-02-27 Motorola, Inc. Battery-powered RF tags and apparatus for manufacturing the same
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5654693A (en) * 1996-04-10 1997-08-05 X-Cyte, Inc. Layered structure for a transponder tag

Also Published As

Publication number Publication date
AU5704499A (en) 2000-04-03
TW455826B (en) 2001-09-21
WO2000016279A1 (en) 2000-03-23

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