MY120645A - Lead frame and method of manufacturing the lead frame - Google Patents

Lead frame and method of manufacturing the lead frame

Info

Publication number
MY120645A
MY120645A MYPI20005787A MYPI20005787A MY120645A MY 120645 A MY120645 A MY 120645A MY PI20005787 A MYPI20005787 A MY PI20005787A MY PI20005787 A MYPI20005787 A MY PI20005787A MY 120645 A MY120645 A MY 120645A
Authority
MY
Malaysia
Prior art keywords
lead frame
thin plate
plate material
manufacturing
inclusion
Prior art date
Application number
MYPI20005787A
Inventor
Se-Chul Park
Dong-Il Shin
Sung-Il Kang
Sang-Hoon Lee
Bae-Soon Jang
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of MY120645A publication Critical patent/MY120645A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Punching Or Piercing (AREA)

Abstract

A METHOD FOR MANUFACTURING A LEAD FRAME INCLUDING THE STEPS OF ELECTROCLEANING THE SURFACE OF A THIN PLATE MATERIAL, ELECTROPOLISHING THE ELECTROCLEANED THIN PLATE MATERIAL, REMOVING INCLUSIONS ON THE SURFACE OF THE ELETROPOLISHED THIN PLATE MATERIAL, RINSING THE INCLUSION-REMOVED THIN PLATE MATERIAL WITH AN ACIDIC SOLUTION, AND FORMING MULTI-PLATED LAYER ON THE RINSE MATERIAL. THE LEAD FRAME MANUFACTURED BY THE METHOD HAS 5 OR LESS INCLUSION EACH HAVING APPROXIMATELY 1 ( )M, ON THE SURFACE AREA OF 1600 ( )M2, WHICH INPEDE A WIRE ONDING P[ROPERTY OR SOLDER WETTABILITY ON THE LEAD FRAME.
MYPI20005787A 2000-08-17 2000-12-08 Lead frame and method of manufacturing the lead frame MY120645A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20000047498 2000-08-17
KR10-2000-0068500A KR100378485B1 (en) 2000-08-17 2000-11-17 Lead frame and method of manufacturing the same

Publications (1)

Publication Number Publication Date
MY120645A true MY120645A (en) 2005-11-30

Family

ID=19683526

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20005787A MY120645A (en) 2000-08-17 2000-12-08 Lead frame and method of manufacturing the lead frame

Country Status (2)

Country Link
KR (1) KR100378485B1 (en)
MY (1) MY120645A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819797B1 (en) * 2002-05-02 2008-04-07 삼성테크윈 주식회사 Manufacturing method of lead frame and lead frame manufactured thereby

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225455A (en) * 1984-04-24 1985-11-09 Kobe Steel Ltd Lead frame
JPH0368788A (en) * 1989-08-03 1991-03-25 Hitachi Cable Ltd Production of copper bar for lead frame
US5167794A (en) * 1990-04-16 1992-12-01 Mitsubishi Denki Kabushiki Kaisha Method for producing lead frame material
JPH0866830A (en) * 1994-08-29 1996-03-12 Sumitomo Metal Mining Co Ltd Electrolytic polishing method for lead frame made of copper and copper alloy
JPH08168924A (en) * 1994-12-19 1996-07-02 Sumitomo Metal Mining Co Ltd Electrolytic polishing method and lead frame manufacturing method using the same
JPH0964264A (en) * 1995-08-28 1997-03-07 Dainippon Printing Co Ltd Lead frame partial plating method
US5660708A (en) * 1994-11-21 1997-08-26 Sumitomo Metal Mining Company, Limited Process for manufacturing a lead frame
JPH10237694A (en) * 1997-02-24 1998-09-08 Kobe Steel Ltd Production of copper alloy for lead frame excellent in resin adhesion

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225455A (en) * 1984-04-24 1985-11-09 Kobe Steel Ltd Lead frame
JPH0368788A (en) * 1989-08-03 1991-03-25 Hitachi Cable Ltd Production of copper bar for lead frame
US5167794A (en) * 1990-04-16 1992-12-01 Mitsubishi Denki Kabushiki Kaisha Method for producing lead frame material
JPH0866830A (en) * 1994-08-29 1996-03-12 Sumitomo Metal Mining Co Ltd Electrolytic polishing method for lead frame made of copper and copper alloy
US5660708A (en) * 1994-11-21 1997-08-26 Sumitomo Metal Mining Company, Limited Process for manufacturing a lead frame
US5843290A (en) * 1994-11-21 1998-12-01 Sumitomo Metal Mining Co., Limited Electrolytic polishing apparatus
JPH08168924A (en) * 1994-12-19 1996-07-02 Sumitomo Metal Mining Co Ltd Electrolytic polishing method and lead frame manufacturing method using the same
JPH0964264A (en) * 1995-08-28 1997-03-07 Dainippon Printing Co Ltd Lead frame partial plating method
JPH10237694A (en) * 1997-02-24 1998-09-08 Kobe Steel Ltd Production of copper alloy for lead frame excellent in resin adhesion

Also Published As

Publication number Publication date
KR100378485B1 (en) 2003-03-29
KR20020014644A (en) 2002-02-25

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