MY121234A - Process for manufacturing contacts for electronics devices, manufacturing apparatus for carrying out the same process and continuous strip material for stamping used for the same process - Google Patents
Process for manufacturing contacts for electronics devices, manufacturing apparatus for carrying out the same process and continuous strip material for stamping used for the same processInfo
- Publication number
- MY121234A MY121234A MYPI97003018A MYPI9703018A MY121234A MY 121234 A MY121234 A MY 121234A MY PI97003018 A MYPI97003018 A MY PI97003018A MY PI9703018 A MYPI9703018 A MY PI9703018A MY 121234 A MY121234 A MY 121234A
- Authority
- MY
- Malaysia
- Prior art keywords
- portions
- lead
- manufacturing
- same process
- contacts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W78/00—Detachable holders for supporting packaged chips in operation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Press Drives And Press Lines (AREA)
- Connecting Device With Holders (AREA)
- Punching Or Piercing (AREA)
Abstract
A PROCESS FOR SUCCESSIVELY MANUFACTURING SEVERAL KINDS OF CONTACTS 25 HAVING CONTACT PORTIONS 25A OF AN IDENTICAL PROFILE AND LEAD PORTIONS 25B WHICH ARE DISPOSED IN TWO OR MORE DIFFERENT POSITIONS FROM A METAL STRIP, COMPRISES THE STEPS OF A) STAMPING A BLANK METAL STRIP INTO A PRELIMINARY BLANK METAL STRIP IN WHICH EACH CONTACT PORTION 2SA IS INTEGRALLY FORMED WITH THE LEAD PORTIONS 25B WHICH ARE DISPOSED IN TWO OR MORE DIFFERENT POSITIONS SO THAT SAID EACH CONTACT PORTION 25A IS CONNECTED WITH A CONTINUOUS CARRIER PORTION 28 VIA THE PLURALITY OF LEAD PORTIONS 25B; B) CUTTING CONNECTIONS 26 BETWEEN ADJACENT ENDS OF THE LEAD PORTIONS 25B, WHICH ARE CONNECTED WITH SAID CONTACT PORTIONS 25A, AND THE CARRIER PORTION 28 AND CONNECTIONS 27 BETWEEN ADJACENT ENDS OF THE LEAD PORTIONS 25B OTHER THAN CONTACT PORTIONS 25A HAVING LEAD PORTION PROFILE A AND SAID CONTACT PORTIONS 25A THEREBY MANUFACTURING FIRST CONTACTS 25 FOR ELECTRONIC DEVICES HAVING THE LEAD PORTION PROFILE A; AND C) CUTTING CONNECTIONS 26 BETWEEN ADJACENT ENDS OF LEAD PORTIONS 25B, WHICH ARE CONNECTED WITH SAID CONTACT PORTIONS 25A, AND THE CARRIER PORTION 28 AND CONNECTIONS 27 BETWEEN ADJACENT ENDS OF THE LEAD PORTIONS 25B OTHER THAN CONTACT PORTIONS 25A HAVING LEAD PORTION PROFILE B AND SAID CONTACT PORTIONS 25A THEREBY MANUFACTURING SECOND CONTACTS FOR ELECTRONIC DEVICES HAVING THE LEAD PORTION PROFILE B.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8305499A JPH10134928A (en) | 1996-11-01 | 1996-11-01 | Manufacturing method of electronic device contact, manufacturing apparatus for performing the same, and continuous punched contact strip used therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY121234A true MY121234A (en) | 2006-01-28 |
Family
ID=17945902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI97003018A MY121234A (en) | 1996-11-01 | 1997-07-03 | Process for manufacturing contacts for electronics devices, manufacturing apparatus for carrying out the same process and continuous strip material for stamping used for the same process |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH10134928A (en) |
| KR (1) | KR100335790B1 (en) |
| CN (1) | CN1070743C (en) |
| MY (1) | MY121234A (en) |
| TW (1) | TW381046B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1067493C (en) * | 1998-11-06 | 2001-06-20 | 富金精密工业(深圳)有限公司 | Terminal strip structure for electric connector and its making method |
| CN101950908B (en) * | 2010-09-14 | 2012-12-12 | 番禺得意精密电子工业有限公司 | Method for breaking terminal material tape combination |
| CN103261125B (en) * | 2010-12-21 | 2016-03-30 | 埃克森美孚化学专利公司 | Process for producing monocycloalkyl substituted aromatic compounds |
| CN103084653B (en) * | 2011-10-31 | 2016-04-20 | 西门子数控(南京)有限公司 | A kind of terminal Preparation equipment and terminal preparation method |
| CN102922660B (en) * | 2012-11-02 | 2015-12-16 | 苏州技泰精密部件有限公司 | Punching press injection moulding continuous strip material and manufacture method thereof |
| CN105921622B (en) * | 2016-06-08 | 2018-07-31 | 惠州智科实业有限公司 | It is used to prepare the mold of the radiator with length cooling fin |
| CN106350859B (en) * | 2016-10-19 | 2019-01-25 | 东莞市杰精精密工业有限公司 | Continuous material belt, connector shell continuous electroplating equipment and continuous electroplating process thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60101888A (en) * | 1983-10-31 | 1985-06-05 | アンプ インコーポレーテッド | Electric connector |
| US5235743A (en) * | 1990-07-11 | 1993-08-17 | Yazaki Corporation | Method of manufacturing a pair of terminals having a low friction material on a mating surface to facilitate connection of the terminals |
-
1996
- 1996-11-01 JP JP8305499A patent/JPH10134928A/en active Pending
-
1997
- 1997-06-28 TW TW086109221A patent/TW381046B/en not_active IP Right Cessation
- 1997-07-03 MY MYPI97003018A patent/MY121234A/en unknown
- 1997-07-15 KR KR1019970032785A patent/KR100335790B1/en not_active Expired - Fee Related
- 1997-07-15 CN CN97114887A patent/CN1070743C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1181290A (en) | 1998-05-13 |
| KR19980041784A (en) | 1998-08-17 |
| CN1070743C (en) | 2001-09-12 |
| KR100335790B1 (en) | 2003-04-16 |
| JPH10134928A (en) | 1998-05-22 |
| TW381046B (en) | 2000-02-01 |
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