MY122999A - Copper foil for use in laser beam drilling - Google Patents

Copper foil for use in laser beam drilling

Info

Publication number
MY122999A
MY122999A MYPI20011627A MYPI20011627A MY122999A MY 122999 A MY122999 A MY 122999A MY PI20011627 A MYPI20011627 A MY PI20011627A MY PI20011627 A MYPI20011627 A MY PI20011627A MY 122999 A MY122999 A MY 122999A
Authority
MY
Malaysia
Prior art keywords
laser beam
copper foil
beam drilling
copper
drilling
Prior art date
Application number
MYPI20011627A
Inventor
Sakamoto Masaru
Kitano Kouji
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18617204&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY122999(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY122999A publication Critical patent/MY122999A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)

Abstract

THERE IS PROVIDE A COPPER FOIL WITH AN IMPROVED SURFACE WHICH MAKES THE LASER PROCESSING EASIER AND IS SUITABLE FOR FORMING AN INTERLAYER CONNECTION MICROHOLE IN THE PRODUCTION OF PRINTED CIRCUIT BOARDS. SPECIFICALLY, THE COPPER FOIL IS SUCH THAT IT IS USED IN LASER BEAM DRILLING, CHARACTERIZED IN THAT AT LEAST THE PORTION OF THE SURFACE THEREOF WHICH THE LASER BEAM ENTERS IS PLATED WITH AT LEAST ONE OR MORE KINDS OF METALS COMPRISING COPPER, SO AS TO FORM A PARTICLE LAYER 0.01 TO 3 ?m THICK THEREON . FIGURE 1
MYPI20011627A 2000-04-05 2001-04-05 Copper foil for use in laser beam drilling MY122999A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000103505A JP3330925B2 (en) 2000-04-05 2000-04-05 Copper foil for laser drilling

Publications (1)

Publication Number Publication Date
MY122999A true MY122999A (en) 2006-05-31

Family

ID=18617204

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20011627A MY122999A (en) 2000-04-05 2001-04-05 Copper foil for use in laser beam drilling

Country Status (4)

Country Link
JP (1) JP3330925B2 (en)
KR (1) KR100495481B1 (en)
MY (1) MY122999A (en)
TW (1) TWI238027B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3869352B2 (en) * 2002-11-12 2007-01-17 日鉱金属株式会社 Calorie measurement method of metal foil, adjustment method of surface characteristics, laser drilling method or calorimeter
US7476449B2 (en) 2003-02-27 2009-01-13 Furukawa Circuit Foil Co., Ltd. Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
JP4458519B2 (en) * 2003-07-28 2010-04-28 三井金属鉱業株式会社 Surface-treated copper foil having a blackened surface, a method for producing the surface-treated copper foil, and an electromagnetic shielding conductive mesh for a front panel of a plasma display using the surface-treated copper foil
JP4458521B2 (en) * 2004-03-02 2010-04-28 三井金属鉱業株式会社 Surface-treated copper foil having a grayed surface, a method for producing the surface-treated copper foil, and an electromagnetic shielding conductive mesh for a front panel of a plasma display using the surface-treated copper foil
KR100654737B1 (en) * 2004-07-16 2006-12-08 일진소재산업주식회사 Manufacturing method of surface-treated copper foil for microcircuit board and copper foil
JP2006210689A (en) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd Copper foil for high frequency printed wiring board and method for producing the same
US7886437B2 (en) 2007-05-25 2011-02-15 Electro Scientific Industries, Inc. Process for forming an isolated electrically conductive contact through a metal package
KR101289803B1 (en) 2008-05-16 2013-07-26 삼성테크윈 주식회사 Circuit board and method of manufacturing the same
JP2009235580A (en) * 2009-07-22 2009-10-15 Furukawa Electric Co Ltd:The Copper foil sheet for opening laser-drilled hole
JP6346556B2 (en) 2012-03-01 2018-06-20 三井金属鉱業株式会社 Copper foil with carrier foil, method for producing copper foil with carrier foil, and copper-clad laminate for laser drilling obtained using the copper foil with carrier foil
CN104160792B (en) * 2012-03-09 2017-05-17 三井金属矿业株式会社 Method for manufacturing printed wiring board and copper foil for laser processing
KR101400778B1 (en) * 2012-10-05 2014-06-02 일진머티리얼즈 주식회사 Copper foil for laser hole drilling, copper-clad laminate and preparation method of the foil
CN103972513B (en) * 2013-02-06 2016-08-17 永箔科技股份有限公司 Continuous Processing Method of Porous Current Collector Metal Material
JP6304829B2 (en) * 2013-03-05 2018-04-04 三井金属鉱業株式会社 Copper foil for laser processing, copper foil for laser processing with carrier foil, copper-clad laminate, and method for producing printed wiring board
CN109788658B (en) * 2017-11-15 2021-10-19 鹏鼎控股(深圳)股份有限公司 Circuit board and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3615973B2 (en) 1998-10-21 2005-02-02 三井金属鉱業株式会社 Novel composite foil and manufacturing method thereof, copper-clad laminate
JP2000228582A (en) 1999-02-08 2000-08-15 Mitsubishi Gas Chem Co Inc Method for manufacturing printed wiring board having through hole with excellent reliability

Also Published As

Publication number Publication date
KR100495481B1 (en) 2005-06-14
KR20020084243A (en) 2002-11-04
JP3330925B2 (en) 2002-10-07
TWI238027B (en) 2005-08-11
JP2001288595A (en) 2001-10-19

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