MY123003A - Copper foil for copper-clad laminate - Google Patents
Copper foil for copper-clad laminateInfo
- Publication number
- MY123003A MY123003A MYPI9500715A MY123003A MY 123003 A MY123003 A MY 123003A MY PI9500715 A MYPI9500715 A MY PI9500715A MY 123003 A MY123003 A MY 123003A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper
- clad laminate
- resin
- room temperature
- copper foil
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 239000011889 copper foil Substances 0.000 title abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 239000007787 solid Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A COPPER FOIL HAVING AN ADHESIVE LAYER AND USABLE FOR THE PRODUCTION OF A COPPER-CLAD LAMINATE FOR A PRINTED WIRING BOARD, CHARACTERIZED IN THAT THE ADHESIVE FORMING THE ADHESIVE LAYER IS A RESIN COMPOSITION COMPRISING: (A) A THERMOPLASTIC RESIN, (B) A THERMOSETTING RESIN OTHER THAN THE FOLLOWING (C) AND (D), (C) A POLYFUNCTIONAL SOLID EPOXY RESIN WHICH HAS AT LEAST THREE EPOXY GROUPS PER MOLECULE AND A SOFTENING POINT OF 50 °C OR ABOVE AND IS IN SOLID STATE AT ROOM TEMPERATURE, AND (D) AN EPOXY RESIN WHICH IS IN LIQUID STATE AT ROOM TEMPERATURE.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08270494A JP3319650B2 (en) | 1994-03-30 | 1994-03-30 | Copper foil for copper clad laminates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY123003A true MY123003A (en) | 2006-05-31 |
Family
ID=13781796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI9500715 MY123003A (en) | 1994-03-30 | 1995-03-22 | Copper foil for copper-clad laminate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3319650B2 (en) |
| CN (1) | CN1052375C (en) |
| MY (1) | MY123003A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69829465T2 (en) | 1997-03-27 | 2006-02-09 | Mitsubishi Rayon Co., Ltd. | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED PLASTICS, PREPEG, AND TUBE-SHAPED MOLDED BODY MANUFACTURED THEREFROM |
| CN1081128C (en) * | 1999-08-18 | 2002-03-20 | 湖北省化学研究所 | Manufacture of metal sheet coated with polymer film specially for soft printed circuit |
| JP2003096423A (en) * | 2001-09-20 | 2003-04-03 | Toyo Chem Co Ltd | Thermosetting adhesive composition and pressure- sensitive adhesive sheet |
| CN102732197A (en) * | 2011-04-12 | 2012-10-17 | 佛冈建滔实业有限公司 | Preparation process of adhesive suitable for adhesive coated copper foil |
| JP5935339B2 (en) * | 2012-01-17 | 2016-06-15 | 東レ株式会社 | Adhesive composition for electronic equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5167997A (en) * | 1989-05-05 | 1992-12-01 | Gould Inc. | Protected conductive foil assemblage and procedure for preparing same using static electrical forces |
| CA2078955A1 (en) * | 1991-10-01 | 1993-04-02 | Jamie H. Chamberlain | Protected conductive foil assemblage and procedure for preparing same using static electrical forces |
-
1994
- 1994-03-30 JP JP08270494A patent/JP3319650B2/en not_active Expired - Lifetime
-
1995
- 1995-02-15 CN CN95101968A patent/CN1052375C/en not_active Expired - Lifetime
- 1995-03-22 MY MYPI9500715 patent/MY123003A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07266492A (en) | 1995-10-17 |
| CN1052375C (en) | 2000-05-10 |
| CN1113071A (en) | 1995-12-06 |
| JP3319650B2 (en) | 2002-09-03 |
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