MY123762A - Conductor for forming conductive path on an integrated circuit and method - Google Patents

Conductor for forming conductive path on an integrated circuit and method

Info

Publication number
MY123762A
MY123762A MYPI96004186A MYPI19964186A MY123762A MY 123762 A MY123762 A MY 123762A MY PI96004186 A MYPI96004186 A MY PI96004186A MY PI19964186 A MYPI19964186 A MY PI19964186A MY 123762 A MY123762 A MY 123762A
Authority
MY
Malaysia
Prior art keywords
conductor
integrated circuit
conductive path
forming conductive
bonding
Prior art date
Application number
MYPI96004186A
Inventor
Economikos Laertis
J Interrante Mario
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of MY123762A publication Critical patent/MY123762A/en

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A CONDUCTOR (80) FOR THE REPAIR OF, OR ADDITION TO, A CIRCUIT INCLUDES A CONDUCTIVE ELEMENT (46) AND AT LEAST ONE OF A DIFFUSION BARRIER (52) OR BONDING MEDIUM (54) ADJACENT TO A CONDUCTIVE ELEMENT SURFACE (48,50). THE DIFFUSION BARRIER INHIBITS THE DIFFUSION OF THE MATERIAL FROM WHICH THE CONDUCTIVE ELEMENT IS MADE INTO A BONDING TIP USED TO EFFECT BONDING OF THE CONDUCTOR TO THE CIRCUIT. THE BONDING MEDIUM ENHANCES BONDING BETWEEN THE CONDUCTIVE ELEMENT AND THE CIRCUIT. (FIGURE 4)
MYPI96004186A 1995-11-02 1996-10-09 Conductor for forming conductive path on an integrated circuit and method MY123762A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55197595A 1995-11-02 1995-11-02

Publications (1)

Publication Number Publication Date
MY123762A true MY123762A (en) 2006-06-30

Family

ID=24203448

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96004186A MY123762A (en) 1995-11-02 1996-10-09 Conductor for forming conductive path on an integrated circuit and method

Country Status (3)

Country Link
CN (1) CN1100350C (en)
MY (1) MY123762A (en)
SG (1) SG49975A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112399724B (en) * 2020-11-04 2022-03-22 广东佛智芯微电子技术研究有限公司 Bonding wire-based fine line repairing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719542B2 (en) * 1985-07-23 1995-03-06 ソニー株式会社 Beam spot correction device for cathode ray tube
US5289632A (en) * 1992-11-25 1994-03-01 International Business Machines Corporation Applying conductive lines to integrated circuits

Also Published As

Publication number Publication date
CN1100350C (en) 2003-01-29
SG49975A1 (en) 1998-06-15
CN1154576A (en) 1997-07-16

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