MY124654A - Abrasive material for the needle point of a probe card - Google Patents

Abrasive material for the needle point of a probe card

Info

Publication number
MY124654A
MY124654A MYPI98001785A MYPI9801785A MY124654A MY 124654 A MY124654 A MY 124654A MY PI98001785 A MYPI98001785 A MY PI98001785A MY PI9801785 A MYPI9801785 A MY PI9801785A MY 124654 A MY124654 A MY 124654A
Authority
MY
Malaysia
Prior art keywords
needle point
probe card
abrasive material
probe
abrasive
Prior art date
Application number
MYPI98001785A
Inventor
Kazuo Tanaka
Naoya Kamata
Reiji Yoshizumi
Toshiro Maeda
Original Assignee
Minnesota Mining & Mfg
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg, Nec Corp filed Critical Minnesota Mining & Mfg
Publication of MY124654A publication Critical patent/MY124654A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
    • B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

AN ABRASIVE MATERIAL FOR THE NEEDLE POINT (6) OF A PROBE CARD WHICH CAN EFFECTIVELY REMOVE FOREIGN MATTER ADHERING TO THE NEEDLE POINT (6) OF THE PROBE, PROTECT THE NEEDLE POINT (6) FROM DAMAGE AND DEFORMATION, AND PROLONG THE LIFE OF THE PROBE.THE ABRASIVE MATERIAL FOR THE NEEDLE POINT (6) OF A PROBE CARD COMPRISES AN ABRASIVE LAYER INCLUDING A LAYER (3) OF MICRO- POWDERED ABRASIVE GRAINS (5) APPLIED TO A SUBSTRATE (1) AND A CUSHION LAYER (4) HAVING A BUFFER ACTION AND ELASTICITY.(FIG 2)
MYPI98001785A 1997-04-22 1998-04-21 Abrasive material for the needle point of a probe card MY124654A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10419397A JP3923589B2 (en) 1997-04-22 1997-04-22 Probe card needle tip cleaning method

Publications (1)

Publication Number Publication Date
MY124654A true MY124654A (en) 2006-06-30

Family

ID=14374158

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98001785A MY124654A (en) 1997-04-22 1998-04-21 Abrasive material for the needle point of a probe card

Country Status (7)

Country Link
EP (1) EP0977652A1 (en)
JP (1) JP3923589B2 (en)
KR (1) KR100510223B1 (en)
CN (1) CN1252745A (en)
MY (1) MY124654A (en)
TW (1) TW366419B (en)
WO (1) WO1998047663A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857642B1 (en) * 2001-04-09 2008-09-08 니혼 미크로 코팅 가부시끼 가이샤 Contact tip and side cleaning tools
JP2002307316A (en) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd Instrument for cleaning tip and side face of contact
JP2002326169A (en) * 2001-05-02 2002-11-12 Nihon Micro Coating Co Ltd Contact cleaning sheet and method
JP4832664B2 (en) * 2001-05-21 2011-12-07 日本ミクロコーティング株式会社 Contact cleaning sheet and method
JP3888197B2 (en) 2001-06-13 2007-02-28 三菱電機株式会社 Member for removing foreign matter adhering to probe tip, cleaning method and probing device for foreign matter adhering to probe tip
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
JP4745814B2 (en) * 2005-12-19 2011-08-10 東京エレクトロン株式会社 Probe polishing material
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
JP2012233811A (en) * 2011-05-06 2012-11-29 Nitto Denko Corp Cleaning sheet, cleaning member, cleaning method, and conduction test device
CN105823974B (en) * 2016-04-28 2018-08-17 山东浪潮华光光电子股份有限公司 A method of improving LED chip testing needle trace
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
JP2021514827A (en) 2018-02-23 2021-06-17 インターナショナル テスト ソリューションズ， インコーポレイテッド Flexible electronic circuits New materials and hardware for automatically cleaning web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11035898B1 (en) * 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
US20240402219A1 (en) * 2023-06-04 2024-12-05 Wayne Cooper Smith Probe card cleaning element wear detection system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982357A (en) * 1975-04-14 1976-09-28 Eldridge John D Cleaning device for cauterizing knives
US5016401A (en) * 1988-09-21 1991-05-21 Mangus Donald J Cautery tip cleaner and holder
US5593467A (en) * 1993-11-12 1997-01-14 Minnesota Mining And Manufacturing Company Abrasive grain
JP3329644B2 (en) * 1995-07-21 2002-09-30 株式会社東芝 Polishing pad, polishing apparatus and polishing method

Also Published As

Publication number Publication date
JP3923589B2 (en) 2007-06-06
EP0977652A1 (en) 2000-02-09
KR100510223B1 (en) 2005-08-31
TW366419B (en) 1999-08-11
JPH10300777A (en) 1998-11-13
KR20010020159A (en) 2001-03-15
WO1998047663A1 (en) 1998-10-29
CN1252745A (en) 2000-05-10

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