MY125256A - Methods and apparatus for cleaning semiconductor substrates after polishing of copper film - Google Patents
Methods and apparatus for cleaning semiconductor substrates after polishing of copper filmInfo
- Publication number
- MY125256A MY125256A MYPI20001501A MYPI20001501A MY125256A MY 125256 A MY125256 A MY 125256A MY PI20001501 A MYPI20001501 A MY PI20001501A MY PI20001501 A MYPI20001501 A MY PI20001501A MY 125256 A MY125256 A MY 125256A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor substrates
- polishing
- cleaning
- methods
- cleaning semiconductor
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- -1 FLUORIDE COMPOUND Chemical class 0.000 abstract 1
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A CLEANING SOLUTION, METHOD, APPARATUS FOR CLEANING SEMICONDUCTOR SUBSTRATES (100) AFTER CHEMICAL MECHANICAL POLISHING (CMP) OF COPPER FILMS IS DESCRIBED.THE PRESENT INVENTION INCLUDES A CLEANING SOLUTION WHICH COMBINES DEIONIZED WATER, AN ORGANIC COMPOUND AND A FLUORIDE COMPOUND INAN ACIDIC PH ENVIRONTMENT FOR CLEANING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE (100) AFTER POLISHING A COPPER LAYER (140). SUCH METHODS OF CLEANING SEMICONDUCTOR SUBSTRATES (100) AFTER COPPER CMP ALLEVIATE THE PROBLEMS ASSOCIATED WITH BRUSH LOADING AND SURFACE AND SUBSURFACE CONTAMINATION.(FIG.2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20001501A MY125256A (en) | 2000-04-11 | 2000-04-11 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20001501A MY125256A (en) | 2000-04-11 | 2000-04-11 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY125256A true MY125256A (en) | 2006-07-31 |
Family
ID=78397462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20001501A MY125256A (en) | 2000-04-11 | 2000-04-11 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY125256A (en) |
-
2000
- 2000-04-11 MY MYPI20001501A patent/MY125256A/en unknown
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