MY125873A - Jet type solder bath - Google Patents

Jet type solder bath

Info

Publication number
MY125873A
MY125873A MYPI9802820A MY125873A MY 125873 A MY125873 A MY 125873A MY PI9802820 A MYPI9802820 A MY PI9802820A MY 125873 A MY125873 A MY 125873A
Authority
MY
Malaysia
Prior art keywords
solder bath
jet type
type solder
moving body
printed board
Prior art date
Application number
Inventor
Takayuki Nikaido
Original Assignee
Senju Metal Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Company Ltd filed Critical Senju Metal Industry Company Ltd
Publication of MY125873A publication Critical patent/MY125873A/en

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM: NON-SOLDERED SPOTS OCCASIONALLY OCCUR BECAUSE MOLTEN SOLDER DOES NOT REACH CORNER SECTIONS FORMED IN SOLDERING SECTIONS BETWEEN CHIP PARTS AND A PRINTED BOARD WHEN THE PRINTED BOARD MOUNTED WITH THE CHIP PARTS IS SOLDERED IN A JET TYPE SOLDER BATH. MEANS FOR SOLVING PROBLEM: IN THIS INVENTION, THE ABOVE-MENTIONED PROBLEM IS SOLVED BY SUPPORTING A MOVING BODY IN THE NOZZLE OF THE PRIMARY JET NOZZLE OF THE SOLDER BATH WITH SPRINGS AT BOTH ENDS AND, AT THE SAME TIME, FORMING IRREGULARITIES ON BOTH SIDES ON THE SURFACE OF THE MOVING BODY BY CUTTING GROOVES THEREIN.FIG. 1
MYPI9802820 1998-03-20 1998-06-22 Jet type solder bath MY125873A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09063798A JP3956250B2 (en) 1998-03-20 1998-03-20 Jet solder bath

Publications (1)

Publication Number Publication Date
MY125873A true MY125873A (en) 2006-08-30

Family

ID=14004023

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9802820 MY125873A (en) 1998-03-20 1998-06-22 Jet type solder bath

Country Status (3)

Country Link
JP (1) JP3956250B2 (en)
MY (1) MY125873A (en)
TW (1) TW385726U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100511167B1 (en) * 1998-05-18 2005-10-26 센주긴조쿠고교 가부시키가이샤 Classification solder bath
KR20040014793A (en) * 2002-08-12 2004-02-18 강민석 stracture of a nozzle for automatic soldering device
DE102012013209A1 (en) * 2012-07-04 2014-01-09 Erwin Quarder Systemtechnik Gmbh Soldering nozzle for soldering device for soldering components having a number of solder joints to be soldered, comprises nozzle chamber and a device with which solder flow in flow area and contour of exiting soldering wave is influenced

Also Published As

Publication number Publication date
JP3956250B2 (en) 2007-08-08
JPH11274709A (en) 1999-10-08
TW385726U (en) 2000-03-21

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