MY126037A - Ic socket - Google Patents

Ic socket

Info

Publication number
MY126037A
MY126037A MYPI20002258A MYPI20002258A MY126037A MY 126037 A MY126037 A MY 126037A MY PI20002258 A MYPI20002258 A MY PI20002258A MY PI20002258 A MYPI20002258 A MY PI20002258A MY 126037 A MY126037 A MY 126037A
Authority
MY
Malaysia
Prior art keywords
transmitter
interference
receiver
during
reseiver
Prior art date
Application number
MYPI20002258A
Inventor
Tomohiro Nakano
Akira Kaneshige
Kiyoshi Adachi
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of MY126037A publication Critical patent/MY126037A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Fluid Pressure (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

SYSTEMS AND METHODS CAN BE USED TO MAINTAIN OPERATION OF A RECEIVER (42) CO-LOCATED WITH A TRANSMITTER (44) IN A COMMUNICATION DEVICE (40) AND SUCCEPTIBLE TO INTERFERENCE THEREFROM BY ANTICIPATING THE INTERVALS DURING WHICH THE TRANSMITTER IS ACTIVE (I.E.,TRANSMITTING) AND THEN DESENITIZING THE RECEIVER (42) DURING THAT INTERNAL. ALTHOUGH THE RESEIVER OF THE INTERFERENCE GENERATED BYE THE TRANSMITTER (44) CAN BE AVOIDED. FOR EXAMPLE, INTERFERENCE FROM THE TRANSMITTER CAN CAUSE VARIABLE, SUCH AS THE GAIN APPLIED BY AN AUTOMATIC GAIN CONTROL (52) MODULE AT THE RECEIVER INPUT, TO DEVIATE FROM A NORMAL OPERATING OR STEADY STATE VALUE, WHICH MUST THEN BE RECOVERED WHEN THE INTERFERENCE FROM THE TRANSMITTER CEASES.
MYPI20002258A 1999-05-25 2000-05-24 Ic socket MY126037A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14518399A JP4414017B2 (en) 1999-05-25 1999-05-25 IC socket

Publications (1)

Publication Number Publication Date
MY126037A true MY126037A (en) 2006-09-29

Family

ID=15379356

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20002258A MY126037A (en) 1999-05-25 2000-05-24 Ic socket

Country Status (6)

Country Link
US (1) US6471524B1 (en)
EP (1) EP1063727A3 (en)
JP (1) JP4414017B2 (en)
KR (1) KR100371660B1 (en)
MY (1) MY126037A (en)
SG (1) SG87118A1 (en)

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US7045889B2 (en) 2001-08-21 2006-05-16 Micron Technology, Inc. Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
US7049693B2 (en) * 2001-08-29 2006-05-23 Micron Technology, Inc. Electrical contact array for substrate assemblies
US7078921B2 (en) 2001-12-25 2006-07-18 Sumitomo Electric Industries, Ltd. Contact probe
US20060006888A1 (en) * 2003-02-04 2006-01-12 Microfabrica Inc. Electrochemically fabricated microprobes
US20050184748A1 (en) * 2003-02-04 2005-08-25 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
US20050104609A1 (en) * 2003-02-04 2005-05-19 Microfabrica Inc. Microprobe tips and methods for making
JP3768183B2 (en) * 2002-10-28 2006-04-19 山一電機株式会社 IC socket for narrow pitch IC package
US20040132320A1 (en) * 2002-12-20 2004-07-08 Dittmann Larry E. Land grid array connector
US6846184B2 (en) * 2003-01-24 2005-01-25 High Connection Density Inc. Low inductance electrical contacts and LGA connector system
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
TW200535425A (en) * 2003-12-31 2005-11-01 Microfabrica Inc Pin-type probes for contacting electronic circuits and methods for making such probes
US20050184747A1 (en) * 2004-02-19 2005-08-25 Sanders David L. Spring plunger probe
US7179108B2 (en) * 2004-09-08 2007-02-20 Advanced Interconnections Corporation Hermaphroditic socket/adapter
US7114996B2 (en) * 2004-09-08 2006-10-03 Advanced Interconnections Corporation Double-pogo converter socket terminal
JP4700353B2 (en) * 2005-01-13 2011-06-15 山一電機株式会社 Manufacturing method of probe element
US7690925B2 (en) * 2005-02-24 2010-04-06 Advanced Interconnections Corp. Terminal assembly with pin-retaining socket
US7435102B2 (en) * 2005-02-24 2008-10-14 Advanced Interconnections Corporation Interconnecting electrical devices
US7220134B2 (en) * 2005-02-24 2007-05-22 Advanced Interconnections Corporation Low profile LGA socket assembly
US7271606B1 (en) * 2005-08-04 2007-09-18 National Semiconductor Corporation Spring-based probe pin that allows kelvin testing
US20070167038A1 (en) * 2006-01-18 2007-07-19 Glenn Goodman Hermaphroditic socket/adapter
US20080009148A1 (en) * 2006-07-07 2008-01-10 Glenn Goodman Guided pin and plunger
DE102008023761B9 (en) * 2008-05-09 2012-11-08 Feinmetall Gmbh Electrical contact element for contact contacting of electrical specimens and corresponding contacting arrangement
CN102207515A (en) * 2010-03-29 2011-10-05 鸿富锦精密工业（深圳）有限公司 Probe structure
US8506307B2 (en) 2010-12-02 2013-08-13 Interconnect Devices, Inc. Electrical connector with embedded shell layer
DE102012220032A1 (en) * 2012-11-02 2014-05-08 Robert Bosch Gmbh Contact device, circuit arrangement
JP6737002B2 (en) * 2016-06-17 2020-08-05 オムロン株式会社 Probe pin
JP6515877B2 (en) * 2016-06-17 2019-05-22 オムロン株式会社 Probe pin
KR101938387B1 (en) 2017-02-16 2019-01-14 (주)에이피텍 Test pin and test apparatus having the same
KR101926672B1 (en) * 2017-03-23 2018-12-11 주식회사 엔티에스 Clip spring pin and test socket having the same
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11802891B1 (en) * 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
KR102704948B1 (en) * 2021-11-17 2024-09-09 (주)포인트엔지니어링 The Electro-conductive Contact Pin And Test Device Having The Same
KR102467602B1 (en) * 2022-03-22 2022-11-16 주식회사 프로이천 Apparatus for testing display panel
CN118033194A (en) * 2022-11-11 2024-05-14 杰冯科技有限公司 Spring contacts for use in integrated circuit test devices

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Also Published As

Publication number Publication date
EP1063727A3 (en) 2002-01-30
JP4414017B2 (en) 2010-02-10
US6471524B1 (en) 2002-10-29
KR20010007118A (en) 2001-01-26
SG87118A1 (en) 2002-03-19
JP2000338175A (en) 2000-12-08
EP1063727A2 (en) 2000-12-27
KR100371660B1 (en) 2003-02-11

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