MY127468A - Metal substrate having an ic chip and carrier mounting - Google Patents

Metal substrate having an ic chip and carrier mounting

Info

Publication number
MY127468A
MY127468A MYPI97006030A MYPI9706030A MY127468A MY 127468 A MY127468 A MY 127468A MY PI97006030 A MYPI97006030 A MY PI97006030A MY PI9706030 A MYPI9706030 A MY PI9706030A MY 127468 A MY127468 A MY 127468A
Authority
MY
Malaysia
Prior art keywords
chip
pads
metal substrate
chip carrier
carrier
Prior art date
Application number
MYPI97006030A
Inventor
Stephen Wesley Macquarrie
Wayne Russell Storr
James Warren Wilson
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/783,775 external-priority patent/US6150716A/en
Application filed by Ibm filed Critical Ibm
Publication of MY127468A publication Critical patent/MY127468A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

A PACKAGE FOR MOUNTING AN INTEGRATED CIRCUIT CHIP (30, 52) TO A CIRCUIT BOARD (48) OR THE LIKE IS PROVIDED. THE PACKAGE INCLUDES A CHIP CARRIER (10) WHICH HAS A METAL SUBSTRATE (12) INCLUDING FIRST AND SECOND OPPOSED FACES. A DIELECTRIC COATING (20) IS PROVIDED ON AT LEAST ONE OF THE FACES, WHICH PREFERABLY IS LESS THAN ABOUT 20 MICRONS IN THICKNESS, AND PREFERABLY HAS A DIELECTRIC CONSTANT FROM ABOUT 35 TO ABOUT 4.0. ELECTRICAL CIRCUITRY IS DISPOSED ON THE DIELECTRIC COATING, SAID CIRCUITRY INCLUDING CHIP MOUNTING PADS (22), CONNECTION PADS (24) AND CIRCUIT TRACES (26) CONNECTING THE CHIP MOUNTING PADS TO THE CONNECTION PADS. AN IC CHIP IS MOUNTED BY FLIP CHIP OR WIRE BONDING OR ADHESIVE CONNECTION ON THE FACE OF THE METAL SUBSTRATE WHICH HAS THE DIELECTRIC COATING THEREON. IN ANY CASE, THE IC CHIP IS ELECTRICALLY CONNECTED TO THE CHIP MOUNTING PADS EITHER BY THE SOLDER BALL (54) OR WIRE BOND (36) CONNECTIONS. ELECTRICAL LEADS (38, 60) EXTEND FROM THE CONNECTION PADS ON THE CHIP CARRIER AND ARE CONNECTED TO CORRESPONDING PADS ON A CIRCUIT BOARD OR THE LIKE TO PROVIDE I/O SIGNALS FOR THE IC CHIP. IN CERTAIN EMBODIMENTS, ADDITIONAL HEAT SINKS (62) CAN BE ATTACHED TO THE CHIP CARRIER AND, ALSO IN CERTAIN EMBODIMENTS, CHIPS CAN BE MOUNTED ON BOTH SIDES OF THE CHIP CARRIER TO INCREASE THE CAPACITY OF THE CHIP CARRIER. (FIG. 1)
MYPI97006030A 1997-01-15 1997-12-12 Metal substrate having an ic chip and carrier mounting MY127468A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/783,775 US6150716A (en) 1995-01-25 1997-01-15 Metal substrate having an IC chip and carrier mounting

Publications (1)

Publication Number Publication Date
MY127468A true MY127468A (en) 2006-12-29

Family

ID=25130356

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI97006030A MY127468A (en) 1997-01-15 1997-12-12 Metal substrate having an ic chip and carrier mounting

Country Status (10)

Country Link
JP (1) JP2903013B2 (en)
KR (1) KR100259412B1 (en)
CN (1) CN1132243C (en)
CZ (1) CZ3498A3 (en)
HU (1) HUP9701377A3 (en)
MY (1) MY127468A (en)
PL (1) PL324177A1 (en)
RU (1) RU2191445C2 (en)
SG (1) SG60170A1 (en)
TW (1) TW473887B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2331138C1 (en) * 2006-12-26 2008-08-10 Закрытое акционерное общество "Научно-производственное объединение "НИИТАЛ" (ЗАО "НПО "НИИТАЛ") Integrated circuit case
CN100580919C (en) * 2007-01-23 2010-01-13 南茂科技股份有限公司 Improved deformation of semiconductor package substrates
RU2342736C1 (en) * 2007-03-05 2008-12-27 ФГУП "Центральное конструкторское бюро автоматики" Micropack for chip mounting
RU2481754C1 (en) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Printed circuit board on metal substrate and method of its manufacturing
JP5912058B2 (en) 2012-03-30 2016-04-27 株式会社フジクラ Imaging module, imaging module with lens, endoscope, imaging module manufacturing method, flexible wiring board molding apparatus
CN104882531A (en) * 2015-06-08 2015-09-02 杨子龙 LED integrated light-emitting module group
CN113097162A (en) 2017-10-10 2021-07-09 北京比特大陆科技有限公司 Heat dissipation sheet, chip and circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2744685B2 (en) * 1990-08-08 1998-04-28 三菱電機株式会社 Semiconductor device
CA2056456C (en) * 1991-08-14 2001-05-08 Luc Ouellet High performance passivation for semiconductor devices
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5435876A (en) * 1993-03-29 1995-07-25 Texas Instruments Incorporated Grid array masking tape process
US5635762A (en) * 1993-05-18 1997-06-03 U.S. Philips Corporation Flip chip semiconductor device with dual purpose metallized ground conductor
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package

Also Published As

Publication number Publication date
CN1188984A (en) 1998-07-29
CN1132243C (en) 2003-12-24
KR100259412B1 (en) 2000-06-15
PL324177A1 (en) 1998-07-20
SG60170A1 (en) 1999-02-22
TW473887B (en) 2002-01-21
KR19980070016A (en) 1998-10-26
HUP9701377A2 (en) 1998-08-28
HU9701377D0 (en) 1997-10-28
CZ3498A3 (en) 1998-11-11
RU2191445C2 (en) 2002-10-20
JP2903013B2 (en) 1999-06-07
HUP9701377A3 (en) 2000-01-28
JPH10209332A (en) 1998-08-07

Similar Documents

Publication Publication Date Title
US6339256B2 (en) Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US5798567A (en) Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
US5869889A (en) Thin power tape ball grid array package
MY113991A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto.
WO2003017324A8 (en) Structure and method for fabrication of a leadless chip carrier with embedded inductor
GB2317268B (en) Integral copper column withsolder bump flip-chip
TW358230B (en) Semiconductor package
KR970013236A (en) Chip Scale Package with Metal Circuit Board
GB9711555D0 (en) High density wirebond chip inter-connect for multi-chip modules
US5914535A (en) Flip chip-on-flip chip multi-chip module
MY135942A (en) Integrated circuit package formed at a wafer level
EP0725434A3 (en) Microchip module assemblies
US5473190A (en) Tab tape
US7176563B2 (en) Electronically grounded heat spreader
KR970023907A (en) Semiconductor devices
TW365035B (en) Semiconductor device package having a board, manufacturing method thereof and stack package using the same
MY127468A (en) Metal substrate having an ic chip and carrier mounting
US6682954B1 (en) Method for employing piggyback multiple die #3
JPH03255657A (en) Hybrid integrated circuit device
CA2273223A1 (en) Chip-size package using a polyimide pcb interposer
JPS58218130A (en) Hybrid integrated circuit
JPS63136657A (en) Both-side mounting electronic circuit device
US6744128B2 (en) Integrated circuit package capable of improving signal quality
US6265769B1 (en) Double-sided chip mount package
GB2297652B (en) Microchip module assemblies