MY129942A - Method and apparatus for connecting a semiconductor chip to a carrier. - Google Patents

Method and apparatus for connecting a semiconductor chip to a carrier.

Info

Publication number
MY129942A
MY129942A MYPI91001347A MYPI9101347A MY129942A MY 129942 A MY129942 A MY 129942A MY PI91001347 A MYPI91001347 A MY PI91001347A MY PI9101347 A MYPI9101347 A MY PI9101347A MY 129942 A MY129942 A MY 129942A
Authority
MY
Malaysia
Prior art keywords
carrier system
semiconductor chip
union
wafer
onto
Prior art date
Application number
MYPI91001347A
Inventor
Richard Scheuenpflug
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of MY129942A publication Critical patent/MY129942A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)

Abstract

A METHOD AND AN APPARATUS FOR CONNECTING A SEMICONDUCTOR CHIP (1) TO A CARRIER SYSTEM (3), WHEREIN THE SEMICONDUCTOR CHIP THAT IS ALREADY DETACHED BUT IS STILL SITUATED IN THE WATER UNION AND THAT IS HELD ON A SELF-ADHESIVE FOIL (2) IS DETACHED THEREFROM AND MOVE ONTO A PRESCRIBED CONNECTING LOCATION ON THE CARRIER SYSTEM (3) AND CONNECTED THERETO. THE PLACEMENT OF THE SEMICONDUCTOR CHIP (1) ONTO THE CARRIER SYSTEM (3) INVOLVES CONSIDERABLY LESS EXPENDITURE OF TIME AND CAPITAL OUTLAY THEN THE PRIOR ART SYSTEMS. THE CARRIER SYSTEM (3) IS PROVIDED WITH A JOINING MATERIAL (4) AT THE PRESCRIBED CONNECTING LOCATIONS. THE WAFER UNION ON THE SELF-ADHESIVE FOIL (2) IS ALIGNED SUCH THAT THE SURFACE OF A SEMICONDUCTOR CHIP (1) TO BE CONNECTED LIES OPPOSITE THE LOCATION OF THE CARRIER SYSTEM (3) THAT IS PROVIDED WITH THE JOINING MATERIAL (4). THE SEMICONDUCTOR CHIP (1) IN THE WAFER UNION IS BROUGHT TO A SPACING OF <0.2 MM ABOVE THE CARRIER SYSTEM (3) AND IS EJECTED FROM THE WAFER UNION WITH A THRUST MECHANISM (5) ONTO THE CONNECTING LOCATION OF THE CARRIER SYSTEM (3) AND IS CONNECTED THERETO. THE METHOD AND THE APPARATUS ARE PARTICULARLY EMPLOYED IN SMD CHIP MOUNTING. (FIG. 1)
MYPI91001347A 1990-08-23 1991-07-26 Method and apparatus for connecting a semiconductor chip to a carrier. MY129942A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4026668 1990-08-23

Publications (1)

Publication Number Publication Date
MY129942A true MY129942A (en) 2007-05-31

Family

ID=6412754

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI91001347A MY129942A (en) 1990-08-23 1991-07-26 Method and apparatus for connecting a semiconductor chip to a carrier.

Country Status (5)

Country Link
EP (1) EP0473976B1 (en)
KR (1) KR920005284A (en)
DE (1) DE59103656D1 (en)
HK (1) HK218196A (en)
MY (1) MY129942A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
US5074947A (en) * 1989-12-18 1991-12-24 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
SG52223A1 (en) * 1992-01-08 1998-09-28 Murata Manufacturing Co Component supply method
WO1995005675A1 (en) * 1993-08-17 1995-02-23 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
FR2743447B1 (en) * 1996-01-08 1998-02-06 Siemens Automotive Sa ELECTRONIC CHIP INVERSION PROCESS
FR2748349B1 (en) * 1996-05-06 1998-06-19 Solaic Sa INTEGRATED CIRCUIT PELLET ASSEMBLY
DE102005036821A1 (en) * 2005-08-04 2007-03-15 Siemens Ag Method for transferring and device for handling electronic components
KR101305374B1 (en) * 2013-02-08 2013-09-06 스타시스코리아(주) Conductive band

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696229A (en) * 1970-04-14 1972-10-03 Thomas L Angelucci Bonding tool for through the tool observation bonding and method of bonding
US3887996A (en) * 1974-05-01 1975-06-10 Gen Motors Corp iconductor loading apparatus for bonding
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
FR2492164B1 (en) * 1980-10-15 1987-01-23 Radiotechnique Compelec METHOD FOR THE SIMULTANEOUS REALIZATION OF MULTIPLE ELECTRICAL LINKS, PARTICULARLY FOR THE ELECTRICAL CONNECTION OF A SEMICONDUCTOR MICRO-WAFER
JPH088292B2 (en) * 1987-08-31 1996-01-29 住友電気工業株式会社 Chip mounting device

Also Published As

Publication number Publication date
KR920005284A (en) 1992-03-28
HK218196A (en) 1996-12-27
EP0473976B1 (en) 1994-11-30
DE59103656D1 (en) 1995-01-12
EP0473976A1 (en) 1992-03-11

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