MY130149A - Process for smoothing the edge of semiconductor wafers. - Google Patents

Process for smoothing the edge of semiconductor wafers.

Info

Publication number
MY130149A
MY130149A MYPI94001563A MYPI9401563A MY130149A MY 130149 A MY130149 A MY 130149A MY PI94001563 A MYPI94001563 A MY PI94001563A MY PI9401563 A MYPI9401563 A MY PI9401563A MY 130149 A MY130149 A MY 130149A
Authority
MY
Malaysia
Prior art keywords
edge
smoothing
semiconductor wafers
semiconductor wafer
working surface
Prior art date
Application number
MYPI94001563A
Inventor
Anton Huber
Joachim Junge
Original Assignee
Wacker Siltronic Halbleitermat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic Halbleitermat filed Critical Wacker Siltronic Halbleitermat
Publication of MY130149A publication Critical patent/MY130149A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

THE INVENTION RELATES TO A PROCESS FOR SMOOTHING THE EDGE OF SEMICONDUCTOR WAFERS, IF REQUIRED ALSO IN THE NOTCH OF A SEMICONDUCTOR WAFER, IN WHICH A COMPRESSIBLE CLOTH IMPREGNATED WITH DIAMONDS IS PRESSED, AS WORKING SURFACE OF A POLISHING TOOL, WITH A SPECIFIED FORCE AGAINST THE EDGE OF A SEMICONDUCTOR WAFER AND THE SEMICONDUCTOR WAFER AND/OR THE WORKING SURFACE EXECUTE A ROTATIONAL MOVEMENT.(FIG 2)
MYPI94001563A 1993-07-29 1994-06-16 Process for smoothing the edge of semiconductor wafers. MY130149A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4325518A DE4325518A1 (en) 1993-07-29 1993-07-29 Method for smoothing the edge of semiconductor wafers

Publications (1)

Publication Number Publication Date
MY130149A true MY130149A (en) 2007-06-29

Family

ID=6494026

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94001563A MY130149A (en) 1993-07-29 1994-06-16 Process for smoothing the edge of semiconductor wafers.

Country Status (7)

Country Link
JP (1) JPH0760624A (en)
KR (1) KR950004435A (en)
CN (1) CN1103511A (en)
DE (1) DE4325518A1 (en)
IT (1) IT1272345B (en)
MY (1) MY130149A (en)
TW (1) TW260812B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245151A (en) * 1998-02-27 1999-09-14 Speedfam Co Ltd Work periphery polishing device
JP3197253B2 (en) * 1998-04-13 2001-08-13 株式会社日平トヤマ Wafer chamfering method
JP2000158315A (en) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd Notch polishing method of notch polishing device in end surface polishing device
KR20000076987A (en) * 1999-03-31 2000-12-26 다구마시로오 Method and apparatus for grinding a workpiece
JP3510584B2 (en) * 2000-11-07 2004-03-29 スピードファム株式会社 Peripheral polishing device for disk-shaped workpiece
JP2002329687A (en) * 2001-05-02 2002-11-15 Speedfam Co Ltd Device wafer outer peripheral polishing apparatus and polishing method
JP3949941B2 (en) * 2001-11-26 2007-07-25 株式会社東芝 Semiconductor device manufacturing method and polishing apparatus
JP5112703B2 (en) * 2007-01-18 2013-01-09 ダイトエレクトロン株式会社 Wafer chamfering method and apparatus
DE102009030294B4 (en) * 2009-06-24 2013-04-25 Siltronic Ag Process for polishing the edge of a semiconductor wafer
JP2011194561A (en) * 2010-02-26 2011-10-06 Nakamura Tome Precision Ind Co Ltd Chamfering device for disk-like workpiece
CN102642253B (en) * 2012-05-04 2014-12-10 上海华力微电子有限公司 Silicon slice edge cutting method and device of silicon slice edge cutting method
US9358655B2 (en) 2012-05-07 2016-06-07 Shin-Etsu Handotai Co., Ltd. Outer periphery polishing apparatus for disc-shaped workpiece
DE102013210057A1 (en) 2013-05-29 2014-12-04 Siltronic Ag Process for polishing the edge of a semiconductor wafer
JP7562994B2 (en) 2020-06-08 2024-10-08 株式会社Sumco Wafer outer circumference polishing device
CN113182971B (en) * 2021-05-12 2022-11-25 四川雅吉芯电子科技有限公司 High-precision edge grinding device for monocrystalline silicon epitaxial wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184662A (en) * 1981-05-09 1982-11-13 Hitachi Ltd Chamfering method and device of wafer
JPS5958827A (en) * 1982-09-28 1984-04-04 Toshiba Corp Semiconductor wafer and method and apparatus for manufacturing semiconductor wafer
JP2719855B2 (en) * 1991-05-24 1998-02-25 信越半導体株式会社 Mirror chamfering device around wafer
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
DE4120003A1 (en) * 1991-06-18 1992-12-24 Mueller Georg Nuernberg DEVICE AND METHOD FOR EDGE-ROUNDING SEMICONDUCTOR RODS
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer

Also Published As

Publication number Publication date
ITRM940495A0 (en) 1994-07-27
TW260812B (en) 1995-10-21
ITRM940495A1 (en) 1996-01-27
CN1103511A (en) 1995-06-07
KR950004435A (en) 1995-02-18
JPH0760624A (en) 1995-03-07
IT1272345B (en) 1997-06-16
DE4325518A1 (en) 1995-02-02

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