MY130885A - Method for storing carrier for polishing wafer - Google Patents

Method for storing carrier for polishing wafer

Info

Publication number
MY130885A
MY130885A MYPI99005694A MYPI9905694A MY130885A MY 130885 A MY130885 A MY 130885A MY PI99005694 A MYPI99005694 A MY PI99005694A MY PI9905694 A MYPI9905694 A MY PI9905694A MY 130885 A MY130885 A MY 130885A
Authority
MY
Malaysia
Prior art keywords
carrier
polishing wafer
polishing
storing carrier
silicon wafer
Prior art date
Application number
MYPI99005694A
Inventor
Masaaki Ikeda
Ichiro Yoshimura
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of MY130885A publication Critical patent/MY130885A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Prevention Of Fouling (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

TO PROVIDE A METHOD FOR STORING A CARRIER (14) FOR POLISHING A SILICON WAFER (3), WHICH CAN STORE THE CARRIER (14) IN A MANNER TO REDUCE SCRATCHES ON THE SILICON WAFER (3).THE METHOD INCLUDES STORING A CARRIER (14) FOR USE IN POLISHING A SILICON WAFER (3) COMPLETELY IMMERSED IN A LIQUID.AT LEAST A SUBSTANTIAL PORTION OF THE LIQUID IS DEIONIZED WATER.(FIG 1)
MYPI99005694A 1998-12-24 1999-12-23 Method for storing carrier for polishing wafer MY130885A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36687398A JP2000190208A (en) 1998-12-24 1998-12-24 How to store polishing carrier

Publications (1)

Publication Number Publication Date
MY130885A true MY130885A (en) 2007-07-31

Family

ID=18487905

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99005694A MY130885A (en) 1998-12-24 1999-12-23 Method for storing carrier for polishing wafer

Country Status (7)

Country Link
EP (1) EP1142003A1 (en)
JP (1) JP2000190208A (en)
KR (1) KR20010080964A (en)
CN (1) CN1331838A (en)
MY (1) MY130885A (en)
TW (1) TW439137B (en)
WO (1) WO2000039841A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10060697B4 (en) 2000-12-07 2005-10-06 Siltronic Ag Double-sided polishing method with reduced scratch rate and apparatus for carrying out the method
CN101797717B (en) * 2009-02-10 2011-12-07 和舰科技(苏州)有限公司 Device and method for detecting upper/lower positions of sink of chemical machinery grinding machine
JP6977657B2 (en) * 2018-05-08 2021-12-08 信越半導体株式会社 How to store carriers for double-sided polishing equipment and how to polish double-sided wafers
JP7349352B2 (en) * 2019-12-27 2023-09-22 グローバルウェーハズ・ジャパン株式会社 Silicon wafer polishing method
CN117124233A (en) * 2023-10-13 2023-11-28 吉姆西半导体科技（无锡）有限公司 Wafer buffer and CMP equipment
CN118238065B (en) * 2024-05-29 2024-08-27 四川上特科技有限公司 Wafer storage device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06226618A (en) * 1993-01-27 1994-08-16 Hitachi Cable Ltd Method for polishing semiconductor wafer
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
JP2832171B2 (en) * 1995-04-28 1998-12-02 信越半導体株式会社 Apparatus and method for cleaning semiconductor substrate
US6045624A (en) * 1996-09-27 2000-04-04 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed

Also Published As

Publication number Publication date
TW439137B (en) 2001-06-07
KR20010080964A (en) 2001-08-25
CN1331838A (en) 2002-01-16
JP2000190208A (en) 2000-07-11
WO2000039841A1 (en) 2000-07-06
EP1142003A1 (en) 2001-10-10

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