MY132276A - Ground plane routing - Google Patents

Ground plane routing

Info

Publication number
MY132276A
MY132276A MYPI96001999A MYPI9601999A MY132276A MY 132276 A MY132276 A MY 132276A MY PI96001999 A MYPI96001999 A MY PI96001999A MY PI9601999 A MYPI9601999 A MY PI9601999A MY 132276 A MY132276 A MY 132276A
Authority
MY
Malaysia
Prior art keywords
ground plane
flexible circuit
plane routing
circuit
remainder
Prior art date
Application number
MYPI96001999A
Inventor
Schueller Dennis Randolph
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MY132276A publication Critical patent/MY132276A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)

Abstract

A FLEXIBLE CIRCUIT (20) CONSTRUCTION ALLOWS SOLDER BALLS (26) TO BE MASS REFLOW ATTACHED TO THE GROUND PLANE (22) OF A DOUBLE-SIDED FLEXIBLE CIRCUIT BY PROVIDING A FIRST VIA (30) WHICH IS SEPARATE FROM THE REMAINDER OF THE GROUND PLANE (22), BUT WHICH IS ELECTRICALLY CONNECTED TO THE GROUND PLANE (22) THROUGH A SECOND VIA (38) AT A DISTANCE FROM THE FIRST VIA (30) BY A CIRCUIT TRACE (36) ON THE SIDE OF THE FLEXIBLE CIRCUIT (20) OPPOSITE THE GROUND PLANE (22).FIG. 4
MYPI96001999A 1995-06-16 1996-05-27 Ground plane routing MY132276A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/491,120 US5585162A (en) 1995-06-16 1995-06-16 Ground plane routing

Publications (1)

Publication Number Publication Date
MY132276A true MY132276A (en) 2007-09-28

Family

ID=23950875

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96001999A MY132276A (en) 1995-06-16 1996-05-27 Ground plane routing

Country Status (9)

Country Link
US (1) US5585162A (en)
EP (1) EP0832546A1 (en)
JP (1) JPH11507768A (en)
KR (1) KR19990022863A (en)
CN (1) CN1186588A (en)
CA (1) CA2221756A1 (en)
MY (1) MY132276A (en)
NO (1) NO975928L (en)
WO (1) WO1997000599A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818697A (en) * 1997-03-21 1998-10-06 International Business Machines Corporation Flexible thin film ball grid array containing solder mask
JPH10335035A (en) * 1997-05-30 1998-12-18 Ando Electric Co Ltd Measurement mechanism for BGA-IC
JPH1126919A (en) * 1997-06-30 1999-01-29 Fuji Photo Film Co Ltd Printed wiring board
US5975921A (en) * 1997-10-10 1999-11-02 Berg Technology, Inc. High density connector system
KR100545966B1 (en) * 1997-10-10 2006-03-23 에프씨아이 High density connector system
US6118080A (en) * 1998-01-13 2000-09-12 Micron Technology, Inc. Z-axis electrical contact for microelectronic devices
US6329605B1 (en) 1998-03-26 2001-12-11 Tessera, Inc. Components with conductive solder mask layers
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
KR20010099684A (en) 1998-10-14 2001-11-09 스프레이그 로버트 월터 Tape ball grid array with interconnected ground plane
DE69932304T2 (en) 1998-11-09 2007-12-06 Ballard Power Systems Inc., Burnaby Electrical contact device for a fuel cell
US6354850B1 (en) * 1998-12-15 2002-03-12 Fci Americas Technology, Inc. Electrical connector with feature for limiting the effects of coefficient of thermal expansion differential
US6565364B1 (en) * 1998-12-23 2003-05-20 Mirae Corporation Wafer formed with CSP device and test socket of BGA device
US7115819B1 (en) * 1999-08-18 2006-10-03 Micron Technology, Inc. Positioning flowable solder for bonding integrated circuit elements
US6542377B1 (en) 2000-06-28 2003-04-01 Dell Products L.P. Printed circuit assembly having conductive pad array with in-line via placement
US6507118B1 (en) 2000-07-14 2003-01-14 3M Innovative Properties Company Multi-metal layer circuit
US6903541B2 (en) * 2001-05-25 2005-06-07 Tyco Electronics Corporation Film-based microwave and millimeter-wave circuits and sensors
US6573461B2 (en) * 2001-09-20 2003-06-03 Dpac Technologies Corp Retaining ring interconnect used for 3-D stacking
US6801880B2 (en) * 2002-07-02 2004-10-05 Dell Products L.P. System and method for minimizing a loading effect of a via by tuning a cutout ratio
US20040198082A1 (en) * 2003-04-07 2004-10-07 Victor Zaderej Method of making an electrical connector
JP4212992B2 (en) * 2003-09-03 2009-01-21 Ｔｄｋ株式会社 Solder ball supply method and supply device
GB0817834D0 (en) * 2008-09-30 2008-11-05 Cambridge Silicon Radio Ltd Low cost flexible substrate
TWI491347B (en) * 2012-10-24 2015-07-01 Hon Hai Prec Ind Co Ltd Cooling plate and enclosing casing
CN120567229B (en) * 2025-07-07 2025-11-04 深圳捷扬微电子有限公司 Ultra-wideband communication system packaging structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148310A (en) * 1964-09-08 Methods of making same
US3537176A (en) * 1969-04-01 1970-11-03 Lockheed Aircraft Corp Interconnection of flexible electrical circuits
JPH02238688A (en) * 1989-03-10 1990-09-20 Toshiba Corp Printed wiring board
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5367435A (en) * 1993-11-16 1994-11-22 International Business Machines Corporation Electronic package structure and method of making same

Also Published As

Publication number Publication date
CN1186588A (en) 1998-07-01
US5585162A (en) 1996-12-17
NO975928D0 (en) 1997-12-16
CA2221756A1 (en) 1997-01-03
WO1997000599A1 (en) 1997-01-03
EP0832546A1 (en) 1998-04-01
KR19990022863A (en) 1999-03-25
NO975928L (en) 1997-12-16
JPH11507768A (en) 1999-07-06

Similar Documents

Publication Publication Date Title
MY132276A (en) Ground plane routing
FI950970A7 (en) Ring-shaped circuit components connected to a through hole in a circuit board
EP0942636A3 (en) Solder bonding printed circuit board
DE69837224D1 (en) Electronic device connected to lead-free solder
MXPA03006691A (en) Waferized power connector.
EP0357362A3 (en) Housing for electronic components
IT8022777A0 (en) DEVICE FOR THE NON-DISTRIBUTIVE DISASSEMBLY OF A MODEL ELECTRONIC COMPONENT SOLDERED BY MEANS OF A PLURALITY OF CONNECTION TERMINALS ON A SUBSTRATE.
NO994450L (en) PCB Fixing
DE68918210D1 (en) Selective formation of solder on printed circuit boards.
GB8700597D0 (en) Reflow bonding parts on printed circuit board
EP0757505A3 (en) Piezoelectric element and piezoelectric acoustic device
FI890345A0 (en) A pin that is attached to the circuit board by soldering
FR2549638B1 (en) CIRCUIT BREAKER WITH ARC MOVEMENT ACCELERATION DEVICE
FR2344203B1 (en)
TW361000B (en) Surface-mounted jumper
WO2002033557A3 (en) Single-source or single-destination signal routing
BE900667A (en) DEVICE FOR MOUNTING, INTERCONNECTING AND CONNECTING THE OUTPUT AND INPUT OF PRINTED CIRCUITS.
CA2024047A1 (en) Display tube assembly and mounting process thereof
DE58904371D1 (en) ELECTRONIC CIRCUIT ARRANGEMENT.
TH24802A (en) Routing of the ground plane
JPS5290975A (en) Electronic wristwatch
WO2003045124A3 (en) A replaceable shield can
JPS5422473A (en) Connection of base board
JPS5353968A (en) Electronic circuit device
JPH03197908A (en) Optical signal transmission/reception module