MY133211A - Lead free solder powder, lead free solder paste, and a method for preparing the same - Google Patents

Lead free solder powder, lead free solder paste, and a method for preparing the same

Info

Publication number
MY133211A
MY133211A MYPI20000516A MY133211A MY 133211 A MY133211 A MY 133211A MY PI20000516 A MYPI20000516 A MY PI20000516A MY 133211 A MY133211 A MY 133211A
Authority
MY
Malaysia
Prior art keywords
free solder
lead free
powder
preparing
same
Prior art date
Application number
Inventor
Shohji Ikuo
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of MY133211A publication Critical patent/MY133211A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Crushing And Grinding (AREA)

Abstract

[OBJECT]TO PROVIDE LEAD FREE SOLDER POWDER, LEAD FREE SOLDER PASTE WITH EXCELLENT PROPERTIES, AND THE METHOD FOR PREPARING THE POWDER AND THE PASTE.@@[CONSTITUTION] LEAD FREE SOLDER POWDER INCLUDING TWO OR MORE METALS CAPABLE OF FORMING AN INTERMETALLIC COMPOUND AND AN UNREACTED PHASE AND AN AMORPHOUS PHASE IS PREPARED. SUCH LEAD FREE SOLDER POWDER CAN BE OBTAINED BY A MECHANICAL MILLING. FURTHER, LEAD FREE SOLDER PASTE IS PREPARED BY MIXING THE POWDER WITH A SOLDERING FLUX.@@[SELECTED DRAWINGS] NONE
MYPI20000516 1999-02-23 2000-02-15 Lead free solder powder, lead free solder paste, and a method for preparing the same MY133211A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11044016A JP3074649B1 (en) 1999-02-23 1999-02-23 Lead-free solder powder, lead-free solder paste, and methods for producing them

Publications (1)

Publication Number Publication Date
MY133211A true MY133211A (en) 2007-10-31

Family

ID=12679896

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20000516 MY133211A (en) 1999-02-23 2000-02-15 Lead free solder powder, lead free solder paste, and a method for preparing the same

Country Status (7)

Country Link
US (2) US6569262B1 (en)
JP (1) JP3074649B1 (en)
KR (1) KR100353586B1 (en)
CN (1) CN1161207C (en)
ID (1) ID24795A (en)
MY (1) MY133211A (en)
TW (1) TW457161B (en)

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WO2011027659A1 (en) * 2009-09-03 2011-03-10 株式会社村田製作所 Soldering paste, bonding method using same, and bonding structure
CN101811236A (en) * 2010-02-25 2010-08-25 东莞市万丰纳米材料有限公司 Preparation method of micro welding rod
US9132514B2 (en) * 2010-11-18 2015-09-15 Dowa Holdings Co., Ltd. Solder powder and method of producing solder powder
KR20120080987A (en) * 2011-01-10 2012-07-18 김용상 Tin/tin alloy nanoparticles having low melting point and manufacturing thereof
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JP6079375B2 (en) * 2013-03-29 2017-02-15 三菱マテリアル株式会社 Solder powder, method for producing the same, and solder paste using the powder
KR20140121211A (en) * 2013-04-05 2014-10-15 부산대학교 산학협력단 Lead-free solder having high melting point, method of lead-free solder alloy, and uses thereof
FR3033272B1 (en) * 2015-03-04 2017-03-24 Labinal Power Systems BRAZING METHOD FOR ASSEMBLING TWO ELEMENTS VIA AN INTERMETALLIC COMPOUND
WO2016171525A1 (en) * 2015-04-22 2016-10-27 덕산하이메탈(주) Bonding material with exothermic and amorphous characteristics and method for manufacturing same
CN106498197B (en) * 2016-10-18 2018-03-06 广西大学 A kind of preparation method of Sn Cu Al series lead-free solders
CN106799491A (en) * 2017-03-24 2017-06-06 南昌专腾科技有限公司 The preparation system and method for a kind of cored solder of zinc-silver boron phosphide system
CN108031852B (en) * 2018-01-16 2021-03-23 汕尾市索思电子封装材料有限公司 A kind of preparation method of Au-X nano-alloy powder and preparation device thereof
KR102066601B1 (en) * 2018-04-10 2020-01-15 서울시립대학교 산학협력단 Cd free solder material for 18 K red gold
CN108766614B (en) * 2018-06-29 2019-09-24 北京梦之墨科技有限公司 A kind of conductive connection agent and its application method
CN111250893A (en) * 2020-03-12 2020-06-09 南通欢腾机电科技有限公司 Lead-free solder, preparation method and application thereof, and metal terminal
CN113441869B (en) * 2021-07-27 2022-04-08 亿铖达焊锡制造（昆山）有限公司 Lead-free soldering paste production device
CN113560768B (en) * 2021-07-29 2023-06-23 南昌航空大学 A kind of metal foam reinforced lead-free solder and preparation method thereof
CN113798725B (en) * 2021-10-13 2022-10-04 浙江强力控股有限公司 Solder-free lead-free solder for selective wave soldering and preparation method thereof

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Also Published As

Publication number Publication date
JP2000246483A (en) 2000-09-12
HK1030385A1 (en) 2001-05-04
CN1161207C (en) 2004-08-11
JP3074649B1 (en) 2000-08-07
TW457161B (en) 2001-10-01
US6569262B1 (en) 2003-05-27
CN1264635A (en) 2000-08-30
US20030168130A1 (en) 2003-09-11
KR20000058041A (en) 2000-09-25
ID24795A (en) 2000-08-24
US7172643B2 (en) 2007-02-06
KR100353586B1 (en) 2002-09-27

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