MY135326A - Resin molded product - Google Patents
Resin molded productInfo
- Publication number
- MY135326A MY135326A MYPI99005749A MYPI9905749A MY135326A MY 135326 A MY135326 A MY 135326A MY PI99005749 A MYPI99005749 A MY PI99005749A MY PI9905749 A MYPI9905749 A MY PI9905749A MY 135326 A MY135326 A MY 135326A
- Authority
- MY
- Malaysia
- Prior art keywords
- molded product
- resin molded
- electrically conductive
- conductive filler
- filler
- Prior art date
Links
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 239000011231 conductive filler Substances 0.000 abstract 5
- 239000011159 matrix material Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- 238000004040 coloring Methods 0.000 abstract 2
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- 239000012765 fibrous filler Substances 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 abstract 1
- 239000010439 graphite Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
A RESIN MOLDED PRODUCT IS PROVIDED WHICH EXHIBITS A HIGHER LEVEL OF ELECTRICAL CONDUCTIVITY AND PARTICULARLY A LOWER LEVEL OF SURFACE RESISTANCE THAN THOSE GENERALLY EXPECTED FROM THE CONTENT OF AN ELECTRICALLY CONDUCTIVE FILLER. THE RESIN MOLDED PRODUCT COMPRISES A MATRIX OF A RESIN MATERIAL AND AN ELECTRICALLY CONDUCTIVE FILLER DISPERSED IN THE MATRIX, WHEREIN A CONTENT OF THE ELECTRICALLY CONDUCTIVE FILLER IS LOWER THAN 20 WT%, AND THE RESIN MOLDED PRODUCT HAS BEEN SUBJECTED TO A VOLTAGE APPLICATION PROCESS EMPLOYING A VOLTAGE OF NOT LOWER THAN 20 KV AND LOWER THAN A DIELECTRIC BREAKDOWN VOLTAGE OF THE MATRIX. THE ELECTRICALLY CONDUCTIVE FILLER IS, FOR EXAMPLE, A FIBROUS FILLER SUCH AS A FIBROUS CARBON FILLER OR A FIBROUS GRAPHITE FILLER, AND HAS AN AVERAGE FIBER DIAMETER OF, FOR EXAMPLE, 0.002 TO 15 µM. THE RESIN MOLDED PRODUCT TYPICALLY CONTAINS A COLORING MATERIAL DISPERSED IN THE MATRIX TOGETHER WITH THE ELECTRICALLY CONDUCTIVE FILLER, AND EXHIBITS A COLOR CORRESPONDING TO THE COLORING MATERIAL.FIGURE 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37320398 | 1998-12-28 | ||
| JP37327098 | 1998-12-28 | ||
| JP9903027 | 1999-06-04 | ||
| PCT/JP1999/006090 WO2000040642A1 (en) | 1998-12-28 | 1999-11-01 | Resin molded product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY135326A true MY135326A (en) | 2008-03-31 |
Family
ID=27308828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI99005749A MY135326A (en) | 1998-12-28 | 1999-12-27 | Resin molded product |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3634752B2 (en) |
| MY (1) | MY135326A (en) |
| WO (1) | WO2000040642A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4503758B2 (en) * | 1999-07-23 | 2010-07-14 | 大阪瓦斯株式会社 | Conductive resin sheet and manufacturing method thereof |
| JP2002121304A (en) * | 2000-10-12 | 2002-04-23 | Osaka Gas Co Ltd | Resin molding and its production method |
| US8999200B2 (en) * | 2002-07-23 | 2015-04-07 | Sabic Global Technologies B.V. | Conductive thermoplastic composites and methods of making |
| JP4746556B2 (en) * | 2004-11-08 | 2011-08-10 | 独立行政法人産業技術総合研究所 | Static elimination molded body |
| JP2014051604A (en) * | 2012-09-07 | 2014-03-20 | Yuka Denshi Co Ltd | Electroconductive thermoplastic resin composition and molded article thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56166039A (en) * | 1980-05-26 | 1981-12-19 | Toyota Central Res & Dev Lab Inc | Method of producing electrically-conductive plastic material |
| JPH0725908B2 (en) * | 1990-04-13 | 1995-03-22 | 豊田合成株式会社 | Corona discharge treatment method |
| JPH06215618A (en) * | 1993-01-12 | 1994-08-05 | Tokai Carbon Co Ltd | Manufacture of conductive resin composition containing tic whiskers |
| JPH07268124A (en) * | 1994-03-30 | 1995-10-17 | Dai Ichi Kogyo Seiyaku Co Ltd | Method for improving conductivity of resin molded body |
| JPH0873655A (en) * | 1994-09-07 | 1996-03-19 | Denki Kagaku Kogyo Kk | Electrically conductive resin composition and its production |
| JPH08253606A (en) * | 1995-03-15 | 1996-10-01 | Dai Ichi Kogyo Seiyaku Co Ltd | Method for improving conductivity of resin molding and electrostatic coating method |
| JPH0987403A (en) * | 1995-09-25 | 1997-03-31 | Nippon Paint Co Ltd | Method for improving electrical conductivity of resin molded article and method for producing resin-coated article |
-
1999
- 1999-11-01 WO PCT/JP1999/006090 patent/WO2000040642A1/en not_active Ceased
- 1999-11-01 JP JP2000592348A patent/JP3634752B2/en not_active Expired - Fee Related
- 1999-12-27 MY MYPI99005749A patent/MY135326A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000040642A1 (en) | 2000-07-13 |
| JP3634752B2 (en) | 2005-03-30 |
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